SPRS953G December   2015  – November 2019 AM5726 , AM5728 , AM5729

PRODUCTION DATA.  

  1. Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. Revision History
  3. Device Comparison
    1. 3.1 Related Products
  4. Terminal Configuration and Functions
    1. 4.1 Terminal Assignment
      1. 4.1.1 Unused Balls Connection Requirements
    2. 4.2 Ball Characteristics
    3. 4.3 Multiplexing Characteristics
    4. 4.4 Signal Descriptions
      1. 4.4.1  Video Input Port (VIP)
      2. 4.4.2  Display Subsystem – Video Output Ports
      3. 4.4.3  Display Subsystem – High-Definition Multimedia Interface (HDMI)
      4. 4.4.4  External Memory Interface - (EMIF)
      5. 4.4.5  General-Purpose Memory Controller (GPMC)
      6. 4.4.6  Timer
      7. 4.4.7  Inter-Integrated Circuit Interface (I2C)
      8. 4.4.8  HDQ / 1-Wire Interface (HDQ1W)
      9. 4.4.9  Universal Asynchronous Receiver Transmitter (UART)
      10. 4.4.10 Multichannel Serial Peripheral Interface (McSPI)
      11. 4.4.11 Quad Serial Peripheral Interface (QSPI)
      12. 4.4.12 Multichannel Audio Serial Port (McASP)
      13. 4.4.13 Universal Serial Bus (USB)
      14. 4.4.14 Serial Advanced Technology Attachment (SATA)
      15. 4.4.15 Peripheral Component Interconnect Express (PCIe)
      16. 4.4.16 Controller Area Network Interface (DCAN)
      17. 4.4.17 Ethernet Interface (GMAC_SW)
      18. 4.4.18 Media Local Bus (MLB) Interface
      19. 4.4.19 eMMC/SD/SDIO
      20. 4.4.20 General-Purpose Interface (GPIO)
      21. 4.4.21 Keyboard controller (KBD)
      22. 4.4.22 Pulse Width Modulation (PWM)
      23. 4.4.23 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
      24. 4.4.24 Test Interfaces
      25. 4.4.25 System and Miscellaneous
        1. 4.4.25.1 Sysboot
        2. 4.4.25.2 Power, Reset and Clock Management (PRCM)
        3. 4.4.25.3 Real-Time Clock (RTC) Interface
        4. 4.4.25.4 System Direct Memory Access (SDMA)
        5. 4.4.25.5 Interrupt Controllers (INTC)
        6. 4.4.25.6 Observability
        7. 4.4.25.7 Power Supplies
  5. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Power on Hours (POH) Limits
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Operating Performance Points
      1. 5.5.1 AVS and ABB Requirements
      2. 5.5.2 Voltage And Core Clock Specifications
      3. 5.5.3 Maximum Supported Frequency
    6. 5.6 Power Consumption Summary
    7. 5.7 Electrical Characteristics
      1. 5.7.1  LVCMOS DDR DC Electrical Characteristics
      2. 5.7.2  HDMIPHY DC Electrical Characteristics
      3. 5.7.3  Dual Voltage LVCMOS I2C DC Electrical Characteristics
      4. 5.7.4  IQ1833 Buffers DC Electrical Characteristics
      5. 5.7.5  IHHV1833 Buffers DC Electrical Characteristics
      6. 5.7.6  LVCMOS OSC Buffers DC Electrical Characteristics
      7. 5.7.7  BC1833IHHV Buffers DC Electrical Characteristics
      8. 5.7.8  USBPHY DC Electrical Characteristics
      9. 5.7.9  Dual Voltage SDIO1833 DC Electrical Characteristics
      10. 5.7.10 Dual Voltage LVCMOS DC Electrical Characteristics
      11. 5.7.11 SATAPHY DC Electrical Characteristics
      12. 5.7.12 PCIEPHY DC Electrical Characteristics
    8. 5.8 Thermal Characteristics
      1. 5.8.1 Package Thermal Characteristics
    9. 5.9 Power Supply Sequences
  6. Clock Specifications
    1. 6.1 Input Clock Specifications
      1. 6.1.1 Input Clock Requirements
      2. 6.1.2 System Oscillator OSC0 Input Clock
        1. 6.1.2.1 OSC0 External Crystal
        2. 6.1.2.2 OSC0 Input Clock
      3. 6.1.3 Auxiliary Oscillator OSC1 Input Clock
        1. 6.1.3.1 OSC1 External Crystal
        2. 6.1.3.2 OSC1 Input Clock
      4. 6.1.4 RTC Oscillator Input Clock
        1. 6.1.4.1 RTC Oscillator External Crystal
        2. 6.1.4.2 RTC Oscillator Input Clock
    2. 6.2 RC On-die Oscillator Clock
    3. 6.3 DPLLs, DLLs Specifications
      1. 6.3.1 DPLL Characteristics
      2. 6.3.2 DLL Characteristics
  7. Timing Requirements and Switching Characteristics
    1. 7.1  Timing Test Conditions
    2. 7.2  Interface Clock Specifications
      1. 7.2.1 Interface Clock Terminology
      2. 7.2.2 Interface Clock Frequency
    3. 7.3  Timing Parameters and Information
      1. 7.3.1 Parameter Information
        1. 7.3.1.1 1.8V and 3.3V Signal Transition Levels
        2. 7.3.1.2 1.8V and 3.3V Signal Transition Rates
        3. 7.3.1.3 Timing Parameters and Board Routing Analysis
    4. 7.4  Recommended Clock and Control Signal Transition Behavior
    5. 7.5  Virtual and Manual I/O Timing Modes
    6. 7.6  Video Input Ports (VIP)
    7. 7.7  Display Subsystem – Video Output Ports
    8. 7.8  Display Subsystem – High-Definition Multimedia Interface (HDMI)
    9. 7.9  External Memory Interface (EMIF)
    10. 7.10 General-Purpose Memory Controller (GPMC)
      1. 7.10.1 GPMC/NOR Flash Interface Synchronous Timing
      2. 7.10.2 GPMC/NOR Flash Interface Asynchronous Timing
      3. 7.10.3 GPMC/NAND Flash Interface Asynchronous Timing
    11. 7.11 Timers
    12. 7.12 Inter-Integrated Circuit Interface (I2C)
      1. Table 7-34 Timing Requirements for I2C Input Timings
      2. Table 7-35 Timing Requirements for I2C HS-Mode (I2C3/4/5 Only)
      3. Table 7-36 Switching Characteristics Over Recommended Operating Conditions for I2C Output Timings
    13. 7.13 HDQ / 1-Wire Interface (HDQ1W)
      1. 7.13.1 HDQ / 1-Wire — HDQ Mode
      2. 7.13.2 HDQ/1-Wire—1-Wire Mode
    14. 7.14 Universal Asynchronous Receiver Transmitter (UART)
      1. Table 7-41 Timing Requirements for UART
      2. Table 7-42 Switching Characteristics Over Recommended Operating Conditions for UART
    15. 7.15 Multichannel Serial Peripheral Interface (McSPI)
    16. 7.16 Quad Serial Peripheral Interface (QSPI)
    17. 7.17 Multichannel Audio Serial Port (McASP)
      1. Table 7-49 Timing Requirements for McASP1
      2. Table 7-50 Timing Requirements for McASP2
      3. Table 7-51 Timing Requirements for McASP3/4/5/6/7/8
      4. Table 7-52 Switching Characteristics Over Recommended Operating Conditions for McASP1
      5. Table 7-53 Switching Characteristics Over Recommended Operating Conditions for McASP2
      6. Table 7-54 Switching Characteristics Over Recommended Operating Conditions for McASP3/4/5/6/7/8
    18. 7.18 Universal Serial Bus (USB)
      1. 7.18.1 USB1 DRD PHY
      2. 7.18.2 USB2 PHY
    19. 7.19 Serial Advanced Technology Attachment (SATA)
    20. 7.20 Peripheral Component Interconnect Express (PCIe)
    21. 7.21 Controller Area Network Interface (DCAN)
    22. 7.22 Ethernet Interface (GMAC_SW)
      1. 7.22.1 GMAC MII Timings
        1. Table 7-68 Timing Requirements for miin_rxclk - MII Operation
        2. Table 7-69 Timing Requirements for miin_txclk - MII Operation
        3. Table 7-70 Timing Requirements for GMAC MIIn Receive 10/100 Mbit/s
        4. Table 7-71 Switching Characteristics Over Recommended Operating Conditions for GMAC MIIn Transmit 10/100 Mbits/s
      2. 7.22.2 GMAC MDIO Interface Timings
      3. 7.22.3 GMAC RMII Timings
        1. Table 7-76 Timing Requirements for GMAC REF_CLK - RMII Operation
        2. Table 7-77 Timing Requirements for GMAC RMIIn Receive
        3. Table 7-78 Switching Characteristics Over Recommended Operating Conditions for GMAC REF_CLK - RMII Operation
        4. Table 7-79 Switching Characteristics Over Recommended Operating Conditions for GMAC RMIIn Transmit 10/100 Mbits/s
      4. 7.22.4 GMAC RGMII Timings
        1. Table 7-83 Timing Requirements for rgmiin_rxc - RGMIIn Operation
        2. Table 7-84 Timing Requirements for GMAC RGMIIn Input Receive for 10/100/1000 Mbps
        3. Table 7-85 Switching Characteristics Over Recommended Operating Conditions for rgmiin_txctl - RGMIIn Operation for 10/100/1000 Mbit/s
        4. Table 7-86 Switching Characteristics for GMAC RGMIIn Output Transmit for 10/100/1000 Mbps
    23. 7.23 eMMC/SD/SDIO
      1. 7.23.1 MMC1—SD Card Interface
        1. 7.23.1.1 Default speed, 4-bit data, SDR, half-cycle
        2. 7.23.1.2 High speed, 4-bit data, SDR, half-cycle
        3. 7.23.1.3 SDR12, 4-bit data, half-cycle
        4. 7.23.1.4 SDR25, 4-bit data, half-cycle
        5. 7.23.1.5 UHS-I SDR50, 4-bit data, half-cycle
        6. 7.23.1.6 UHS-I SDR104, 4-bit data, half-cycle
        7. 7.23.1.7 UHS-I DDR50, 4-bit data
      2. 7.23.2 MMC2 — eMMC
        1. 7.23.2.1 Standard JC64 SDR, 8-bit data, half cycle
        2. 7.23.2.2 High-speed JC64 SDR, 8-bit data, half cycle
        3. 7.23.2.3 High-speed HS200 JC64 SDR, 8-bit data, half cycle
        4. 7.23.2.4 High-speed JC64 DDR, 8-bit data
      3. 7.23.3 MMC3 and MMC4—SDIO/SD
        1. 7.23.3.1 MMC3 and MMC4, SD Default Speed
        2. 7.23.3.2 MMC3 and MMC4, SD High Speed
        3. 7.23.3.3 MMC3 and MMC4, SD and SDIO SDR12 Mode
        4. 7.23.3.4 MMC3 and MMC4, SD SDR25 Mode
        5. 7.23.3.5 MMC3 SDIO High-Speed UHS-I SDR50 Mode, Half Cycle
    24. 7.24 General-Purpose Interface (GPIO)
    25. 7.25 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
      1. 7.25.1 Programmable Real-Time Unit (PRU-ICSS PRU)
        1. 7.25.1.1 PRU-ICSS PRU Direct Input/Output Mode Electrical Data and Timing
          1. Table 7-135 PRU-ICSS PRU Timing Requirements - Direct Input Mode
          2. Table 7-136 PRU-ICSS PRU Switching Requirements – Direct Output Mode
        2. 7.25.1.2 PRU-ICSS PRU Parallel Capture Mode Electrical Data and Timing
          1. Table 7-137 PRU-ICSS PRU Timing Requirements - Parallel Capture Mode
        3. 7.25.1.3 PRU-ICSS PRU Shift Mode Electrical Data and Timing
          1. Table 7-138 PRU-ICSS PRU Timing Requirements – Shift In Mode
          2. Table 7-139 PRU-ICSS PRU Switching Requirements - Shift Out Mode
      2. 7.25.2 PRU-ICSS EtherCAT (PRU-ICSS ECAT)
        1. 7.25.2.1 PRU-ICSS ECAT Electrical Data and Timing
          1. Table 7-140 PRU-ICSS ECAT Timing Requirements – Input Validated With LATCH_IN
          2. Table 7-141 PRU-ICSS ECAT Timing Requirements – Input Validated With SYNCx
          3. Table 7-142 PRU-ICSS ECAT Timing Requirements – Input Validated With Start of Frame (SOF)
          4. Table 7-143 PRU-ICSS ECAT Timing Requirements - LATCHx_IN
          5. Table 7-144 PRU-ICSS ECAT Switching Requirements - Digital IOs
      3. 7.25.3 PRU-ICSS MII_RT and Switch
        1. 7.25.3.1 PRU-ICSS MDIO Electrical Data and Timing
          1. Table 7-145 PRU-ICSS MDIO Timing Requirements – MDIO_DATA
          2. Table 7-146 PRU-ICSS MDIO Switching Characteristics - MDIO_CLK
          3. Table 7-147 PRU-ICSS MDIO Switching Characteristics – MDIO_DATA
        2. 7.25.3.2 PRU-ICSS MII_RT Electrical Data and Timing
          1. Table 7-148 PRU-ICSS MII_RT Timing Requirements – MII[x]_RXCLK
          2. Table 7-149 PRU-ICSS MII_RT Timing Requirements - MII[x]_TXCLK
          3. Table 7-150 PRU-ICSS MII_RT Timing Requirements - MII_RXD[3:0], MII_RXDV, and MII_RXER
          4. Table 7-151 PRU-ICSS MII_RT Switching Characteristics - MII_TXD[3:0] and MII_TXEN
      4. 7.25.4 PRU-ICSS Universal Asynchronous Receiver Transmitter (PRU-ICSS UART)
        1. Table 7-152 Timing Requirements for PRU-ICSS UART Receive
        2. Table 7-153 Switching Characteristics Over Recommended Operating Conditions for PRU-ICSS UART Transmit
      5. 7.25.5 PRU-ICSS IOSETs
      6. 7.25.6 PRU-ICSS Manual Functional Mapping
    26. 7.26 System and Miscellaneous interfaces
    27. 7.27 Test Interfaces
      1. 7.27.1 IEEE 1149.1 Standard-Test-Access Port (JTAG)
        1. 7.27.1.1 JTAG Electrical Data/Timing
          1. Table 7-174 Timing Requirements for IEEE 1149.1 JTAG
          2. Table 7-175 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
          3. Table 7-176 Timing Requirements for IEEE 1149.1 JTAG With RTCK
          4. Table 7-177 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG With RTCK
      2. 7.27.2 Trace Port Interface Unit (TPIU)
        1. 7.27.2.1 TPIU PLL DDR Mode
  8. Applications, Implementation, and Layout
    1. 8.1 Power Supply Mapping
    2. 8.2 DDR3 Board Design and Layout Guidelines
      1. 8.2.1 DDR3 General Board Layout Guidelines
      2. 8.2.2 DDR3 Board Design and Layout Guidelines
        1. 8.2.2.1  Board Designs
        2. 8.2.2.2  DDR3 EMIFs
        3. 8.2.2.3  DDR3 Device Combinations
        4. 8.2.2.4  DDR3 Interface Schematic
          1. 8.2.2.4.1 32-Bit DDR3 Interface
          2. 8.2.2.4.2 16-Bit DDR3 Interface
        5. 8.2.2.5  Compatible JEDEC DDR3 Devices
        6. 8.2.2.6  PCB Stackup
        7. 8.2.2.7  Placement
        8. 8.2.2.8  DDR3 Keepout Region
        9. 8.2.2.9  Bulk Bypass Capacitors
        10. 8.2.2.10 High-Speed Bypass Capacitors
          1. 8.2.2.10.1 Return Current Bypass Capacitors
        11. 8.2.2.11 Net Classes
        12. 8.2.2.12 DDR3 Signal Termination
        13. 8.2.2.13 VREF_DDR Routing
        14. 8.2.2.14 VTT
        15. 8.2.2.15 CK and ADDR_CTRL Topologies and Routing Definition
          1. 8.2.2.15.1 Four DDR3 Devices
            1. 8.2.2.15.1.1 CK and ADDR_CTRL Topologies, Four DDR3 Devices
            2. 8.2.2.15.1.2 CK and ADDR_CTRL Routing, Four DDR3 Devices
          2. 8.2.2.15.2 Two DDR3 Devices
            1. 8.2.2.15.2.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
            2. 8.2.2.15.2.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
          3. 8.2.2.15.3 One DDR3 Device
            1. 8.2.2.15.3.1 CK and ADDR_CTRL Topologies, One DDR3 Device
            2. 8.2.2.15.3.2 CK and ADDR/CTRL Routing, One DDR3 Device
        16. 8.2.2.16 Data Topologies and Routing Definition
          1. 8.2.2.16.1 DQS and DQ/DM Topologies, Any Number of Allowed DDR3 Devices
          2. 8.2.2.16.2 DQS and DQ/DM Routing, Any Number of Allowed DDR3 Devices
        17. 8.2.2.17 Routing Specification
          1. 8.2.2.17.1 CK and ADDR_CTRL Routing Specification
          2. 8.2.2.17.2 DQS and DQ Routing Specification
    3. 8.3 High Speed Differential Signal Routing Guidance
    4. 8.4 Power Distribution Network Implementation Guidance
    5. 8.5 Thermal Solution Guidance
    6. 8.6 Single-Ended Interfaces
      1. 8.6.1 General Routing Guidelines
      2. 8.6.2 QSPI Board Design and Layout Guidelines
    7. 8.7 LJCB_REFN/P Connections
    8. 8.8 Clock Routing Guidelines
      1. 8.8.1 32-kHz Oscillator Routing
      2. 8.8.2 Oscillator Ground Connection
  9. Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Related Links
    5. 9.5 Support Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ABC|760
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Power Supply Sequences

This section describes the power-up and power-down sequence required to ensure proper device operation. The power supply names described in this section comprise a superset of a family of compatible devices. Some members of this family will not include a subset of these power supplies and their associated device modules. Refer to the Section 4.2, Ball Characteristics of the Section 4, Terminal Configuration and Functions to determine which power supplies are applicable.

NOTE

RTC only mode is not supported feature.

Figure 5-2 and Figure 5-3 describe the device Power Sequencing when RTC-mode is NOT used.

AM5729 AM5728 AM5726 SPRS85v_ELCH_04.gifFigure 5-2 Power-Up Sequencing
  1. Grey shaded areas are windows where it is valid to ramp the voltage rail.
  2. Blue dashed lines are not valid windows but show alternate ramp possibilities based on the associated note.
  3. If RTC-only mode is not used then the following combinations are approved:
    - vdda_rtc can be combined with vdds18v
    - vdd_rtc can be combined with vdd
    - vddshv5 can be combined with other 1.8V or 3.3V vddshvn rails.
    If combinations listed above are not followed then sequencing for these 3 voltage rails should follow the RTC mode timing requirements. When using RTC mode timing:
    - vdda_rtc rises coincident with, or before, the 1.8V interface supplies (such as vdds18v).
    - vdd_rtc rises coincident with vdd, or it may rise earlier. If rising earlier, it must rise after the 1.8V interface supplies.
    - vddshv5 rises coincident with the other vddshvn rails (of the same voltage) or it can rise about the same time as the 1.8V PHY supplies (such as vdd_usb1).
  4. vdd must ramp before or at the same time as vdd_mpu, vdd_gpu, vdd_dspeve and vdd_iva.
  5. vdd_mpu, vdd_gpu, vdd_dspeve, vdd_iva can be ramped at the same time or can be staggered.
  6. If any of the vddshv[1-7,9-11] rails (not including vddshv8) are used as 1.8V only, then these rails can be combined with vdds18v.
  7. vddshv8 is separated out to show support for dual voltage. If single voltage is used then vddshv8 can be combined with other vddshvn rails but vddshv8 must ramp after vdd.
  8. vdds and vdda rails must not be combined together, with the one exception of vdda_rtc when RTC-mode is not supported.
  9. Pulse duration: rtc_porz must remain low 1ms after vdda_rtc, vddshv5, and vdd_rtc are ramped and stable.
  10. The FUNC_32K_CLK source must be stable and at a valid frequency 1ms prior to deasserting rtc_porz high.
  11. porz must remain asserted low until all of the following conditions are met:
    • All device supply rails reach stable operational levels.
    • xi_osc0 is stable and at a valid frequency.
    • Minimum of 12P after both of the above conditions are met, where P = 1 / (SYS_CLK1/610), units in ns.
      resetn must be high prior to, or rise simultaneous with, porz but not before its power supply, vddshv3, rising.
  12. Setup time: sysboot[15:0] pins must be valid 2P(15) before porz is de-asserted high.
  13. Hold time: sysboot[15:0] pins must be valid 15P(15) after porz is de-asserted high.
  14. rstoutn will be asserted low when porz is low, and de-asserted following an internal 2ms delay. rstoutn is only valid after vddshv3 reaches an operational level. If used as a peripheral component reset, it should be AND gated with porz to avoid possible reset glitches during power up.
  15. P = 1/(SYS_CLK1/610) frequency in ns.
  16. ddr1_vref0 / ddr2_vref0 may rise coincident with vdds_ddr1 / vdds_ddr2, respectively or at a later time. However, it must be valid before porz rising.
AM5729 AM5728 AM5726 SPRS85v_ELCH_05.gifFigure 5-3 Power-Down Sequencing(10)(11)
  1. Grey shaded areas are windows where it is valid to ramp the voltage rail.
  2. Blue dashed lines are not valid windows but show alternate ramp possibilities based on the associated note.
  3. xi_osc0 can be turned off anytime after porz assertion and must be turned off before vdda_osc voltage rail is shutdown.
  4. If RTC-mode is not used then the following combinations are approved:
    - vdda_rtc can be combined with vdds18v
    - vdd_rtc can be combined with vdd
    - vddshv5 can be combined with other 1.8V or 3.3V vddshv* rails
    If combinations listed above are not followed then sequencing for these 3 voltage rails should follow the RTC mode timing requirements. When using RTC mode timing:
    - vdda_rtc falls coincident with, or later than, the 1.8V interface supplies (such as vdds18v).
    - vdd_rtc falls coincident with vdd, or it may fall later. If falling later, it must fall before, or coincident with, the 1.8V interface supplies.
    - vddshv5 falls coincident with the other vddshvn rails (of the same voltage) or it can fall about the same time as the 1.8V PHY supplies (such as vdd_usb1).
  5. vdd_mpu, vdd_gpu, vdd_dspeve, vdd_iva can be ramped at the same time or can be staggered.
  6. vdd must ramp after or at the same time as vdd_mpu, vdd_gpu, vdd_dspeve and vdd_iva.
  7. If any of the vddshv[1-7,9-11] rails (not including vddshv8) are used as 1.8V only, then these rails can be combined with vdds18v. vddshv[1-7,9-11] is allowed to ramp down at either of the two points shown in the timing diagram in either 1.8V mode or in 3.3V mode. If vddshv[1-7,9-11] ramps down at the later time in the diagram then the board design must ensure that the vddshv[1-7,9-11] rail is never higher than 2.0 V above the vdds18v rail.
  8. vddshv8 is separated out to show support for dual voltage. If a dedicated LDO/supply source is used for vddshv8, then vddshv8 ramp down should occur at one of the two earliest points in the timing diagram. If vddshv8 is powered by the same supply source as the other vddshv[1-7,9-11] rails, then it is allowed to ramp down at either of the last two points in the timing diagram.
  9. The 1.8V vdda_* supplies can either ramp down at the earlier time period shown or can be delayed to ramp down after the core supplies coincident with the vdds18v supply as long as porz is asserted (low) during the power down sequence.
  10. The power down sequence shown is the most general case and is always valid. An accelerated power down sequence is also available but is only valid when porz is asserted (low). This accelerated power down sequence has been implemented in the companion PMIC that is recommended for use with this SOC. The accelerated sequence has porz go low first, then all 3.3V supplies simultaneously second, core supplies, DDR supplies and DDR references simultaneously third and all 1.8V supplies simultaneously last.
  11. Ramped Down is defined as reaching a voltage level of no more than 0.6V.
  12. ddr1_vref0 / ddr2_vref0 may fall coincident with vdds_ddr1 / vdds_ddr2, respectively or at a prior time but after porz is asserted low.

Figure 5-4 describes vddshv[1-7,9-11] Supplies Falling Before vdds18v Supplies Delta.

AM5729 AM5728 AM5726 SPRS85v_ELCH_06.gifFigure 5-4 vddshv* Supplies Falling After vdds18v Supplies Delta
  1. Vdelta MAX = 2V
  2. If vddshv8 is powered by the same supply source as the other vddshv[1-7,9-11] rails.