SPRSP98A November   2023  – June 2024 AM625SIP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes and Signal Descriptions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Operating Performance Points
    5. 6.5 Thermal Resistance Characteristics
      1. 6.5.1 Thermal Resistance Characteristics for AMK Package
    6. 6.6 Timing and Switching Characteristics
      1. 6.6.1 Power Supply Requirements
        1. 6.6.1.1 Power Supply Sequencing
  8. 7 Applications, Implementation, and Layout
    1. 7.1 Peripheral- and Interface-Specific Design Information
      1. 7.1.1 Integrated LPDDR4 SDRAM Information
  9. 8 Device and Documentation Support
    1. 8.1 Device Nomenclature
      1. 8.1.1 Standard Package Symbolization
      2. 8.1.2 Device Naming Convention
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • AMK|425
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

AM625SIP is a System In Package (SIP) derivative of the ALW packaged AM6254 device, with the addition of an integrated LPDDR4 SDRAM. This document only defines differences or exceptions to the ALW packaged AM6254 device defined in AM62x Sitara Processors Datasheet (revision B or later).

The AM625SIP (System in Package) Sitara™ MPU with integrated LPDDR4 is an application processor built for Linux development. The system in package integrates 512MB of LPDDR4 with the AM6254 device which has 4x Arm® Cortex®-A53 performance and embedded features, such as: dual-display support, 3D graphics acceleration, along with an extensive set of peripherals that make the System in package well-suited for a broad range of industrial applications while offering intelligent features and optimized power architecture. Additionally, the AM625SIP offers a simplified hardware design, increased robustness, optimized size/system BOM, and power consumption savings all enabling faster software and hardware development.

Some of these applications include:

  • Industrial HMI
  • Medical equipment, Patient monitoring, and Portable medical devices
  • Smart home gateways & Appliances
  • Embedded security: Control & Access panels

The 3-port Gigabit Ethernet switch has one internal port and two external ports with Time-Sensitive Networking (TSN) support. An additional PRU module on the device enables real-time I/O capability for customer’s own use cases. In addition, the extensive set of peripherals included in AM625SIP enables system-level connectivity, such as: USB, MMC/SD, Camera interface, OSPI, CAN-FD and GPMC for parallel host interface to an external ASIC/FPGA. The AM625SIP device also supports secure boot for IP protection with the built-in Hardware Security Module (HSM) and employs advanced power management support for portable and power-sensitive applications

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
AM625SIP AMK (FCCSP BGA, 425) 13mm × 13mm
(2) The package size (length × width) is a nominal value and includes pins, where applicable.