Processor Cores:
- Up to Quad 64-bit Arm®Cortex®-A53 microprocessor subsystem at up to 1.4GHz
- Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC
- Each A53 core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache
with Parity protection
- Single-core Arm®Cortex®-R5F at up to 800MHz, integrated as part of MCU Channel with FFI
- 32KB ICache, 32KB L1 DCache, and 64KB
TCM with SECDED ECC on all memories
- 512KB SRAM with SECDED ECC
- Single-core Arm®Cortex®-R5F at up to 800MHz, integrated to support Device Management
- 32KB ICache, 32KB L1 DCache, and 64KB
TCM with SECDED ECC on all memories
Multimedia:
- Display subsystem
- Triple display support over OLDI
(LVDS) (1x OLDI-DL, 1x or 2x OLDI-SL), DSI or DPI
- OLDI-SL (Single Link): up to 1920
x 1080 at 60fps (165MHZ Pixel Clock)
- OLDI-DL (Dual Link): up to 3840 x
1080 at 60fps (150MHz Pixel Clock)
- MIPI® DSI: with 4 Lane MIPI® D-PHY supports up to 3840 x 1080 at 60fps (300MHz Pixel Clock)
- DPI (24-bit RGB parallel
interface): up to 1920 x 1080 at 60fps (165MHz pixel clock)
- Four display pipelines with hardware
overlay support. A maximum of two display pipelines may be used per display.
- Supports safety features such as
freeze frame detection and data correctness check
- 3D Graphics Processing Unit
- IMG BXS-4-64 with 256KB cache
- Up to 50GFLOPS
- Single shader core
- OpenGL ES3.2 and Vulkan 1.2 API
support
- One Camera Serial Interface (CSI-2) Receiver with 4
Lane D-PHY
- MIPI® CSI-2 v1.3 Compliant + MIPI D-PHY 1.2
- Support for 1,2,3 or 4 data lane mode
up to 1.5Gbps per lane
- ECC verification/correction with CRC
check + ECC on RAM
- Virtual Channel support (up to
16)
- Ability to write stream data directly
to DDR via DMA
- Video Encoder/Decoder
- Support for HEVC (H.265) Main
profiles at Level 5.1 High-tier
- Support for H.264 BaseLine/Main/High
Profiles at Level 5.2
- Support for up to 4K UHD resolution
(3840 × 2160)
- Up to 300MPixels/s operation,
with reduced clocking options available for lower power applications with lower
performance needs
Memory Subsystem:
- Up to 1.09MB of On-chip
RAM
- 64KB of On-Chip RAM (OCRAM) with
SECDED ECC, can be divided into smaller banks in increments of 32KB for as many as 2
separate memory banks
- 256KB of On-Chip RAM with SECDED ECC
in SMS Subsystem
- 176KB of On-Chip RAM with SECDED ECC
in SMS Subsystem for TI security firmware
- 512KB of On-chip RAM with SECDED ECC
in Cortex-R5F MCU Subsystem
- 64KB of On-chip RAM with SECDED ECC
in Device Manager Subsystem
- DDR Subsystem (DDRSS)
- Supports LPDDR4 memory type
- 32-bit data bus with inline ECC
- Supports speeds up to 3733MT/s
- Max size of 8GB
Functional
Safety:
- Functional Safety-Compliant targeted [Industrial]
- Developed for functional safety
applications
- Documentation will be available to
aid IEC 61508 functional safety system design
- Systematic capability up to SIL 3
targeted
- Hardware Integrity up to SIL 2
targeted
- Safety-related certification
- IEC 61508
by TÜV SÜD planned
- Functional Safety-Compliant targeted [Automotive]
- Developed for functional safety
applications
- Documentation will be available to
aid ISO 26262 functional safety system design
- Systematic capability up to ASIL D
targeted
- Hardware integrity up to ASIL B
targeted
- Safety-related certification
- ISO 26262 by TÜV SÜD planned
- AEC - Q100 qualified [Automotive]
Security:
- Secure boot supported
- Hardware-enforced Root-of-Trust
(RoT)
- Support to switch RoT via backup
key
- Support for takeover protection, IP
protection, and anti-roll back protection
- Trusted Execution Environment (TEE)
supported
- Arm TrustZone® based TEE
- Extensive firewall support for
isolation
- Secure watchdog/timer/IPC
- Secure storage support
- Replay Protected Memory Block (RPMB) support
- Dedicated Security Controller with user programmable HSM core and dedicated security DMA
& IPC subsystem for isolated processing
- Cryptographic acceleration supported
- Session-aware cryptographic engine
with ability to auto-switch key-material based on incoming data stream
- Supports cryptographic cores
- AES – 128-/192-/256-Bit key
sizes
- SHA2 – 224-/256-/384-/512-Bit key
sizes
- DRBG with true random number generator
- PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
- Debugging security
- Secure software controlled debug
access
- Security aware debugging
High-Speed
Interfaces:
- Integrated Ethernet switch supporting
(total 2 external ports)
- RMII(10/100) or RGMII
(10/100/1000)
- IEEE1588 (Annex D, Annex E, Annex F
with 802.1AS PTP)
- Clause 45 MDIO PHY management
- Packet Classifier based on ALE engine
with 512 classifiers
- Priority based flow control
- Time Sensitive Networking (TSN)
support
- Four CPU H/W interrupt Pacing
- IP/UDP/TCP checksum offload in
hardware
- Two USB2.0 Ports
- Port configurable as USB host, USB
peripheral, or USB Dual-Role Device (DRD mode)
- Integrated USB VBUS detection
General Connectivity:
- 9x Universal Asynchronous
Receiver-Transmitters (UART)
- 5x Serial Peripheral Interface (SPI)
controllers
- 6x Inter-Integrated Circuit
(I2C) ports
- 3x Multichannel Audio Serial Ports
(McASP)
- Transmit and Receive Clocks up to
50MHz
- Up to 4/6/16 Serial Data Pins across
3x McASP with Independent TX and RX Clocks
- Supports Time Division Multiplexing
(TDM), Inter-IC Sound (I2S), and Similar Formats
- Supports Digital Audio Interface
Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
- FIFO Buffers for Transmit and Receive
(256 Bytes)
- Support for audio reference output
clock
- 3x enhanced PWM modules (ePWM)
- 3x enhanced Quadrature Encoder Pulse
modules (eQEP)
- 3x enhanced Capture modules (eCAP)
- General-Purpose I/O (GPIO), All LVCMOS
I/O can be configured as GPIO
- 4x Controller Area Network (CAN) modules
with CAN-FD support
- Conforms w/ CAN Protocol 2.0 A, B and
ISO 11898-1
- Full CAN-FD support (up to 64 data
bytes)
- Parity/ECC check for Message RAM
- Speed up to 8Mbps
Media and
Data Storage:
- 3x Multi-Media Card/Secure Digital® (MMC/SD®/SDIO) interfaces
- 1x 8-bit eMMC interface up to HS400
speed
- 2x 4-bit SD/SDIO interfaces up to
UHS-I
- Compliant with eMMC 5.1, SD 3.0, and
SDIO Version 3.0
- 1× General-Purpose Memory Controller
(GPMC) up to 133MHz
- Flexible 8- and 16-bit Asynchronous
Memory Interface with up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR,
and SRAM)
- Uses BCH code to support 4-, 8-, or
16-bit ECC
- Uses Hamming code to support 1-bit
ECC
- Error Locator Module (ELM)
- Used with the GPMC to locate
addresses of data errors from syndrome polynomials generated using a BCH
algorithm
- Supports 4-, 8-, and 16-bit per
512-Byte block error location based on BCH algorithms
- OSPI/QSPI with DDR / SDR support
- Support for Serial NAND and Serial
NOR Flash devices
- 4GBytes memory address support
- XIP mode with optional on-the-fly
encryption
Power Management:
- Low-power modes supported by Device
Manager:
- Partial IO support for CAN/GPIO/UART
wakeup
- I/O Only + DDR in Self
Refresh for Suspend to RAM
- DeepSleep
- MCU Only
- Standby
- Dynamic frequency scaling
Optimal Power Management Solution:
- Recommended TI Power Management ICs (PMIC)
- Supports up to Automotive ASIL-B functional safety when powering the AEC – Q100
qualified AM62P-Q1 device
- Supports up to SIL-2 functional safety industrial applications when powering the
AM62P device
- Companion PMIC is specially designed to meet power supply requirements
- Flexible mapping and factory programmed configurations to support different use
cases
Boot Options:
- UART
- I2C EEPROM
- OSPI/QSPI Flash
- GPMC NOR/NAND Flash
- SD Card
- eMMC
- USB (host) Mass storage
- USB (device) boot from external host (DFU
mode)
- Ethernet
Technology / Package:
- 16nm FinFET technology
- 17mm x 17mm, 0.65/0.8mm pitch with VCA,
466-pin FCBGA