SPRSP89 December   2023 AM62P , AM62P-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      11
      2.      12
    3. 5.3 Signal Descriptions
      1.      14
      2. 5.3.1  CPSW3G
        1. 5.3.1.1 MAIN Domain
          1.        17
          2.        18
          3.        19
          4.        20
      3. 5.3.2  CPTS
        1. 5.3.2.1 MAIN Domain
          1.        23
      4. 5.3.3  CSI-2
        1. 5.3.3.1 MAIN Domain
          1.        26
      5. 5.3.4  DDRSS
        1. 5.3.4.1 MAIN Domain
          1.        29
      6. 5.3.5  DSI
        1. 5.3.5.1 MAIN Domain
          1.        32
      7. 5.3.6  DSS
        1. 5.3.6.1 MAIN Domain
          1.        35
      8. 5.3.7  ECAP
        1. 5.3.7.1 MAIN Domain
          1.        38
          2.        39
          3.        40
      9. 5.3.8  Emulation and Debug
        1. 5.3.8.1 MAIN Domain
          1.        43
        2. 5.3.8.2 MCU Domain
          1.        45
      10. 5.3.9  EPWM
        1. 5.3.9.1 MAIN Domain
          1.        48
          2.        49
          3.        50
          4.        51
      11. 5.3.10 EQEP
        1. 5.3.10.1 MAIN Domain
          1.        54
          2.        55
          3.        56
      12. 5.3.11 GPIO
        1. 5.3.11.1 MAIN Domain
          1.        59
          2.        60
        2. 5.3.11.2 MCU Domain
          1.        62
      13. 5.3.12 GPMC
        1. 5.3.12.1 MAIN Domain
          1.        65
      14. 5.3.13 I2C
        1. 5.3.13.1 MAIN Domain
          1.        68
          2.        69
          3.        70
          4.        71
        2. 5.3.13.2 MCU Domain
          1.        73
        3. 5.3.13.3 WKUP Domain
          1.        75
      15. 5.3.14 MCAN
        1. 5.3.14.1 MAIN Domain
          1.        78
          2.        79
        2. 5.3.14.2 MCU Domain
          1.        81
          2.        82
      16. 5.3.15 MCASP
        1. 5.3.15.1 MAIN Domain
          1.        85
          2.        86
          3.        87
      17. 5.3.16 MCSPI
        1. 5.3.16.1 MAIN Domain
          1.        90
          2.        91
          3.        92
        2. 5.3.16.2 MCU Domain
          1.        94
          2.        95
      18. 5.3.17 MDIO
        1. 5.3.17.1 MAIN Domain
          1.        98
      19. 5.3.18 MMC
        1. 5.3.18.1 MAIN Domain
          1.        101
          2.        102
          3.        103
      20. 5.3.19 OLDI
        1. 5.3.19.1 MAIN Domain
          1.        106
      21. 5.3.20 OSPI
        1. 5.3.20.1 MAIN Domain
          1.        109
      22. 5.3.21 Power Supply
        1.       111
      23. 5.3.22 Reserved
        1.       113
      24. 5.3.23 System and Miscellaneous
        1. 5.3.23.1 Boot Mode Configuration
          1. 5.3.23.1.1 MAIN Domain
            1.         117
        2. 5.3.23.2 Clock
          1. 5.3.23.2.1 MCU Domain
            1.         120
          2. 5.3.23.2.2 WKUP Domain
            1.         122
        3. 5.3.23.3 System
          1. 5.3.23.3.1 MAIN Domain
            1.         125
          2. 5.3.23.3.2 MCU Domain
            1.         127
          3. 5.3.23.3.3 WKUP Domain
            1.         129
        4. 5.3.23.4 VMON
          1.        131
      25. 5.3.24 TIMER
        1. 5.3.24.1 MAIN Domain
          1.        134
        2. 5.3.24.2 MCU Domain
          1.        136
        3. 5.3.24.3 WKUP Domain
          1.        138
      26. 5.3.25 UART
        1. 5.3.25.1 MAIN Domain
          1.        141
          2.        142
          3.        143
          4.        144
          5.        145
          6.        146
          7.        147
        2. 5.3.25.2 MCU Domain
          1.        149
        3. 5.3.25.3 WKUP Domain
          1.        151
      27. 5.3.26 USB
        1. 5.3.26.1 MAIN Domain
          1.        154
          2.        155
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings for Devices which are not AEC - Q100 Qualified
    3. 6.3  ESD Ratings for AEC - Q100 Qualified Devices
    4. 6.4  Power-On Hours (POH)
    5. 6.5  Recommended Operating Conditions
    6. 6.6  Operating Performance Points
    7. 6.7  Power Consumption Summary
    8. 6.8  Electrical Characteristics
      1. 6.8.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.8.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 6.8.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 6.8.4  Low-Frequency Oscillator (LFXOSC) Electrical Characteristics
      5. 6.8.5  eMMCPHY Electrical Characteristics
      6. 6.8.6  SDIO Electrical Characteristics
      7. 6.8.7  LVCMOS Electrical Characteristics
      8. 6.8.8  OLDI LVDS (OLDI) Electrical Characteristics
      9. 6.8.9  CSI-2 (D-PHY) Electrical Characteristics
      10. 6.8.10 DSI (D-PHY) Electrical Characteristics
      11. 6.8.11 USB2PHY Electrical Characteristics
      12. 6.8.12 DDR Electrical Characteristics
    9. 6.9  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.9.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.9.2 Hardware Requirements
      3. 6.9.3 Programming Sequence
      4. 6.9.4 Impact to Your Hardware Warranty
    10. 6.10 Thermal Resistance Characteristics
      1. 6.10.1 Thermal Resistance Characteristics for AMH Package
    11. 6.11 Timing and Switching Characteristics
      1. 6.11.1 Timing Parameters and Information
      2. 6.11.2 Power Supply Requirements
        1. 6.11.2.1 Power Supply Slew Rate Requirement
        2. 6.11.2.2 Power Supply Sequencing
          1. 6.11.2.2.1 Power-Up Sequencing
          2. 6.11.2.2.2 Power-Down Sequencing
          3. 6.11.2.2.3 Partial IO Power Sequencing
      3. 6.11.3 System Timing
        1. 6.11.3.1 Reset Timing
        2. 6.11.3.2 Error Signal Timing
        3. 6.11.3.3 Clock Timing
      4. 6.11.4 Clock Specifications
        1. 6.11.4.1 Input Clocks / Oscillators
          1. 6.11.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 6.11.4.1.1.1 Load Capacitance
            2. 6.11.4.1.1.2 Shunt Capacitance
          2. 6.11.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
          3. 6.11.4.1.3 WKUP_LFOSC0 Internal Oscillator Clock Source
          4. 6.11.4.1.4 WKUP_LFOSC0 LVCMOS Digital Clock Source
          5. 6.11.4.1.5 WKUP_LFOSC0 Not Used
        2. 6.11.4.2 Output Clocks
        3. 6.11.4.3 PLLs
        4. 6.11.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 6.11.5 Peripherals
        1. 6.11.5.1  CPSW3G
          1. 6.11.5.1.1 CPSW3G MDIO Timing
          2. 6.11.5.1.2 CPSW3G RMII Timing
          3. 6.11.5.1.3 CPSW3G RGMII Timing
        2. 6.11.5.2  CPTS
        3. 6.11.5.3  CSI-2
        4. 6.11.5.4  DDRSS
        5. 6.11.5.5  DSI
        6. 6.11.5.6  DSS
        7. 6.11.5.7  ECAP
        8. 6.11.5.8  Emulation and Debug
          1. 6.11.5.8.1 Trace
          2. 6.11.5.8.2 JTAG
        9. 6.11.5.9  EPWM
        10. 6.11.5.10 EQEP
        11. 6.11.5.11 GPIO
        12. 6.11.5.12 GPMC
          1. 6.11.5.12.1 GPMC and NOR Flash — Synchronous Mode
          2. 6.11.5.12.2 GPMC and NOR Flash — Asynchronous Mode
          3. 6.11.5.12.3 GPMC and NAND Flash — Asynchronous Mode
        13. 6.11.5.13 I2C
        14. 6.11.5.14 MCAN
        15. 6.11.5.15 MCASP
        16. 6.11.5.16 MCSPI
          1. 6.11.5.16.1 MCSPI — Controller Mode
          2. 6.11.5.16.2 MCSPI — Peripheral Mode
        17. 6.11.5.17 MMCSD
          1. 6.11.5.17.1 MMC0 - eMMC Interface
            1. 6.11.5.17.1.1 Legacy SDR Mode
            2. 6.11.5.17.1.2 High Speed SDR Mode
            3. 6.11.5.17.1.3 High Speed DDR Mode
            4. 6.11.5.17.1.4 HS200 Mode
            5. 6.11.5.17.1.5 HS400 Mode
          2. 6.11.5.17.2 MMC1/MMC2 - SD/SDIO Interface
            1. 6.11.5.17.2.1 Default Speed Mode
            2. 6.11.5.17.2.2 High Speed Mode
            3. 6.11.5.17.2.3 UHS–I SDR12 Mode
            4. 6.11.5.17.2.4 UHS–I SDR25 Mode
            5. 6.11.5.17.2.5 UHS–I SDR50 Mode
            6. 6.11.5.17.2.6 UHS–I DDR50 Mode
            7. 6.11.5.17.2.7 UHS–I SDR104 Mode
        18. 6.11.5.18 OLDI
          1. 6.11.5.18.1 OLDI0 Switching Characteristics
        19. 6.11.5.19 OSPI
          1. 6.11.5.19.1 OSPI0 PHY Mode
            1. 6.11.5.19.1.1 OSPI0 With PHY Data Training
            2. 6.11.5.19.1.2 OSPI0 Without Data Training
              1. 6.11.5.19.1.2.1 OSPI0 PHY SDR Timing
              2. 6.11.5.19.1.2.2 OSPI0 PHY DDR Timing
          2. 6.11.5.19.2 OSPI0 Tap Mode
            1. 6.11.5.19.2.1 OSPI0 Tap SDR Timing
            2. 6.11.5.19.2.2 OSPI0 Tap DDR Timing
        20. 6.11.5.20 Timers
        21. 6.11.5.21 UART
        22. 6.11.5.22 USB
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-A53 Subsystem
      2. 7.2.2 Device/Power Manager
      3. 7.2.3 MCU Arm Cortex-R5F Subsystem
    3. 7.3 Accelerators and Coprocessors
    4. 7.4 Other Subsystems
      1. 7.4.1 Dual Clock Comparator (DCC)
      2. 7.4.2 Data Movement Subsystem (DMSS)
      3. 7.4.3 Memory Cyclic Redundancy Check (MCRC)
      4. 7.4.4 Peripheral DMA Controller (PDMA)
      5. 7.4.5 Real-Time Clock (RTC)
    5. 7.5 Peripherals
      1. 7.5.1  Gigabit Ethernet Switch (CPSW3G)
      2. 7.5.2  Camera Serial Interface Receiver (CSI_RX_IF)
      3. 7.5.3  Display Subsystem (DSS)
      4. 7.5.4  Enhanced Capture (ECAP)
      5. 7.5.5  Error Location Module (ELM)
      6. 7.5.6  Enhanced Pulse Width Modulation (EPWM)
      7. 7.5.7  Error Signaling Module (ESM)
      8. 7.5.8  Enhanced Quadrature Encoder Pulse (EQEP)
      9. 7.5.9  General-Purpose Interface (GPIO)
      10. 7.5.10 General-Purpose Memory Controller (GPMC)
      11. 7.5.11 Global Timebase Counter (GTC)
      12. 7.5.12 Inter-Integrated Circuit (I2C)
      13. 7.5.13 Modular Controller Area Network (MCAN)
      14. 7.5.14 Multichannel Audio Serial Port (MCASP)
      15. 7.5.15 Multichannel Serial Peripheral Interface (MCSPI)
      16. 7.5.16 Multi-Media Card Secure Digital (MMCSD)
      17. 7.5.17 Octal Serial Peripheral Interface (OSPI)
      18. 7.5.18 Timers
      19. 7.5.19 Universal Asynchronous Receiver/Transmitter (UART)
      20. 7.5.20 Universal Serial Bus Subsystem (USBSS)
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply
        1. 8.1.1.1 Power Supply Designs
        2. 8.1.1.2 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG, EMU, and TRACE
      4. 8.1.4 Unused Pins
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 DDR Board Design and Layout Guidelines
      2. 8.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 8.2.2.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 8.2.2.2 External Board Loopback
        3. 8.2.2.3 DQS (only available in Octal SPI devices)
      3. 8.2.3 USB VBUS Design Guidelines
      4. 8.2.4 System Power Supply Monitor Design Guidelines
      5. 8.2.5 High Speed Differential Signal Routing Guidance
      6. 8.2.6 Thermal Solution Guidance
    3. 8.3 Clock Routing Guidelines
      1. 8.3.1 Oscillator Routing
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • AMH|466
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Operating Performance Points

Table 6-1defines the maximum operating frequency of the clocks for each device speed grade and Table 6-2 defines the only valid Operating Performance Points (OPPs) for the device subsystem and core clocks..

Table 6-1 Device Speed Grades
Speed
Grade		 VDD_CORE
(V)(1)		 MAXIMUM OPERATING FREQUNCY (MHz) MAXIMUM
TRANSITION
RATE (MT/s)(2)
A53SS
(Cortex-A53x)		 MAIN
DOMAIN
SYSCLK		 MCU
R5F		 MCU
DOMAIN
SYSCLK		 DEVICE
MANAGER
R5F		 DEVICE
MANAGER
DOMAIN
CLK		 HSM GPU VPU LPDDR4
O 0.75/0.85 1000 500 800 400 800 400 400 560 500 3200
S 0.75 1250 500 800 400 800 400 400 560 500 3200
0.85 1400
U 0.75 1250 500 800 400 800 400 400 720 500 3200
0.85 1400 800
(1) Nominal operating voltage, see Recommended Operating Conditions.
(2) Maximum DDR Frequency will be limited based on the specific memory type (vendor) used in a system and by PCB implementation. Refer to DDR Board Design and Layout Guidelines for the proper PCB implementation to achieve maximum DDR frequency.
Table 6-2 Device Operating Performance Points
OPP A53SS(1) FIXED OPERATING FREQUENCY OPTIONS (MHz)(2) MT/s(3)
MAIN
DOMAIN
SYSCLK		 MCU
R5F		 MCU
DOMAIN
SYSCLK		 DEVICE
MANAGER
R5F		 DEVICE
MANAGER
DOMAIN
CLK		 HSM GPU VPU LPDDR4
 
High
 		 From
ARM0
PLL
Bypass
to
Speed
Grade
Maximum		 500 800 400 800 400 400 Up to
Speed
Grade
Maximum		 500,
400,
200,
or
100		 From
DDR
PLL
Bypass(4)
to
Speed
Grade
Maximum
Low 250 400 200 400 133 133
(1) Default operating frequency, set by software at boot. Supports Dynamic Frequency Scaling after boot.
(2) Fixed operating frequency, set by software at boot.
(3) Maximum DDR Frequency will be limited based on the specific memory type (vendor) used in a system and by PCB implementation. Refer to DDR Board Design and Layout Guidelines for the proper PCB implementation to achieve maximum DDR frequency.
(4) The DDR PLL output, which sources DDR0_CK0 and DDR0_CK0_n, is typically defined in units of frequency. So the "DDR PLL Bypass" transaction rate is equal to 2x the DDR PLL output frequency when operating in bypass mode.