SPRSP56G January   2021  – April 2024 AM6411 , AM6412 , AM6421 , AM6422 , AM6441 , AM6442

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      11
      2.      12
    3. 5.3 Signal Descriptions
      1.      14
      2. 5.3.1  ADC
        1. 5.3.1.1 MAIN Domain
          1.        17
      3. 5.3.2  CPSW3G
        1. 5.3.2.1 MAIN Domain
          1.        20
          2.        21
          3.        22
      4. 5.3.3  CPTS
        1. 5.3.3.1 MAIN Domain
          1.        25
          2.        26
      5. 5.3.4  DDRSS
        1. 5.3.4.1 MAIN Domain
          1.        29
      6. 5.3.5  ECAP
        1. 5.3.5.1 MAIN Domain
          1.        32
          2.        33
          3.        34
      7. 5.3.6  Emulation and Debug
        1. 5.3.6.1 MAIN Domain
          1.        37
        2. 5.3.6.2 MCU Domain
          1.        39
      8. 5.3.7  EPWM
        1. 5.3.7.1 MAIN Domain
          1.        42
          2.        43
          3.        44
          4.        45
          5.        46
          6.        47
          7.        48
          8.        49
          9.        50
          10.        51
      9. 5.3.8  EQEP
        1. 5.3.8.1 MAIN Domain
          1.        54
          2.        55
          3.        56
      10. 5.3.9  FSI
        1. 5.3.9.1 MAIN Domain
          1.        59
          2.        60
          3.        61
          4.        62
          5.        63
          6.        64
          7.        65
          8.        66
      11. 5.3.10 GPIO
        1. 5.3.10.1 MAIN Domain
          1.        69
          2.        70
        2. 5.3.10.2 MCU Domain
          1.        72
      12. 5.3.11 GPMC
        1. 5.3.11.1 MAIN Domain
          1.        75
      13. 5.3.12 I2C
        1. 5.3.12.1 MAIN Domain
          1.        78
          2.        79
          3.        80
          4.        81
        2. 5.3.12.2 MCU Domain
          1.        83
          2.        84
      14. 5.3.13 MCAN
        1. 5.3.13.1 MAIN Domain
          1.        87
          2.        88
      15. 5.3.14 MCSPI
        1. 5.3.14.1 MAIN Domain
          1.        91
          2.        92
          3.        93
          4.        94
          5.        95
        2. 5.3.14.2 MCU Domain
          1.        97
          2.        98
      16. 5.3.15 MDIO
        1. 5.3.15.1 MAIN Domain
          1.        101
      17. 5.3.16 MMC
        1. 5.3.16.1 MAIN Domain
          1.        104
          2.        105
      18. 5.3.17 OSPI
        1. 5.3.17.1 MAIN Domain
          1.        108
      19. 5.3.18 Power Supply
        1.       110
      20. 5.3.19 PRU_ICSSG
        1. 5.3.19.1 MAIN Domain
          1.        113
          2.        114
      21. 5.3.20 Reserved
        1.       116
      22. 5.3.21 SERDES
        1. 5.3.21.1 MAIN Domain
          1.        119
      23. 5.3.22 System and Miscellaneous
        1. 5.3.22.1 Boot Mode Configuration
          1. 5.3.22.1.1 MAIN Domain
            1.         123
        2. 5.3.22.2 Clock
          1. 5.3.22.2.1 MCU Domain
            1.         126
        3. 5.3.22.3 System
          1. 5.3.22.3.1 MAIN Domain
            1.         129
          2. 5.3.22.3.2 MCU Domain
            1.         131
        4. 5.3.22.4 VMON
          1.        133
      24. 5.3.23 TIMER
        1. 5.3.23.1 MAIN Domain
          1.        136
        2. 5.3.23.2 MCU Domain
          1.        138
      25. 5.3.24 UART
        1. 5.3.24.1 MAIN Domain
          1.        141
          2.        142
          3.        143
          4.        144
          5.        145
          6.        146
          7.        147
        2. 5.3.24.2 MCU Domain
          1.        149
          2.        150
      26. 5.3.25 USB
        1. 5.3.25.1 MAIN Domain
          1.        153
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Power-On Hours (POH)
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Operating Performance Points
    6. 6.6  Power Consumption Summary
    7. 6.7  Electrical Characteristics
      1. 6.7.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.7.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 6.7.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 6.7.4  eMMCPHY Electrical Characteristics
      5. 6.7.5  SDIO Electrical Characteristics
      6. 6.7.6  LVCMOS Electrical Characteristics
      7. 6.7.7  ADC12B Electrical Characteristics
      8. 6.7.8  USB2PHY Electrical Characteristics
      9. 6.7.9  SerDes PHY Electrical Characteristics
      10. 6.7.10 DDR Electrical Characteristics
    8. 6.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.8.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.8.2 Hardware Requirements
      3. 6.8.3 Programming Sequence
      4. 6.8.4 Impact to Your Hardware Warranty
    9. 6.9  Thermal Resistance Characteristics
      1. 6.9.1 Thermal Resistance Characteristics
    10. 6.10 Timing and Switching Characteristics
      1. 6.10.1 Timing Parameters and Information
      2. 6.10.2 Power Supply Requirements
        1. 6.10.2.1 Power Supply Slew Rate Requirement
        2. 6.10.2.2 Power Supply Sequencing
          1. 6.10.2.2.1 Power-Up Sequencing
          2. 6.10.2.2.2 Power-Down Sequencing
      3. 6.10.3 System Timing
        1. 6.10.3.1 Reset Timing
        2. 6.10.3.2 Safety Signal Timing
        3. 6.10.3.3 Clock Timing
      4. 6.10.4 Clock Specifications
        1. 6.10.4.1 Input Clocks / Oscillators
          1. 6.10.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 6.10.4.1.1.1 Load Capacitance
            2. 6.10.4.1.1.2 Shunt Capacitance
          2. 6.10.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
        2. 6.10.4.2 Output Clocks
        3. 6.10.4.3 PLLs
        4. 6.10.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 6.10.5 Peripherals
        1. 6.10.5.1  CPSW3G
          1. 6.10.5.1.1 CPSW3G MDIO Timing
          2. 6.10.5.1.2 CPSW3G RMII Timing
          3. 6.10.5.1.3 CPSW3G RGMII Timing
          4. 6.10.5.1.4 CPSW3G IOSETs
        2. 6.10.5.2  DDRSS
        3. 6.10.5.3  ECAP
        4. 6.10.5.4  EPWM
        5. 6.10.5.5  EQEP
        6. 6.10.5.6  FSI
        7. 6.10.5.7  GPIO
        8. 6.10.5.8  GPMC
          1. 6.10.5.8.1 GPMC and NOR Flash — Synchronous Mode
          2. 6.10.5.8.2 GPMC and NOR Flash — Asynchronous Mode
          3. 6.10.5.8.3 GPMC and NAND Flash — Asynchronous Mode
          4. 6.10.5.8.4 GPMC0 IOSETs
        9. 6.10.5.9  I2C
        10. 6.10.5.10 MCAN
        11. 6.10.5.11 MCSPI
          1. 6.10.5.11.1 MCSPI — Controller Mode
          2. 6.10.5.11.2 MCSPI — Peripheral Mode
        12. 6.10.5.12 MMCSD
          1. 6.10.5.12.1 MMC0 - eMMC Interface
            1. 6.10.5.12.1.1 Legacy SDR Mode
            2. 6.10.5.12.1.2 High Speed SDR Mode
            3. 6.10.5.12.1.3 High Speed DDR Mode
            4. 6.10.5.12.1.4 HS200 Mode
          2. 6.10.5.12.2 MMC1 - SD/SDIO Interface
            1. 6.10.5.12.2.1 Default Speed Mode
            2. 6.10.5.12.2.2 High Speed Mode
            3. 6.10.5.12.2.3 UHS–I SDR12 Mode
            4. 6.10.5.12.2.4 UHS–I SDR25 Mode
            5. 6.10.5.12.2.5 UHS–I SDR50 Mode
            6. 6.10.5.12.2.6 UHS–I DDR50 Mode
            7. 6.10.5.12.2.7 UHS–I SDR104 Mode
        13. 6.10.5.13 CPTS
        14. 6.10.5.14 OSPI
          1. 6.10.5.14.1 OSPI0 PHY Mode
            1. 6.10.5.14.1.1 OSPI0 With PHY Data Training
            2. 6.10.5.14.1.2 OSPI0 Without Data Training
              1. 6.10.5.14.1.2.1 OSPI0 PHY SDR Timing
              2. 6.10.5.14.1.2.2 OSPI0 PHY DDR Timing
          2. 6.10.5.14.2 OSPI0 Tap Mode
            1. 6.10.5.14.2.1 OSPI0 Tap SDR Timing
            2. 6.10.5.14.2.2 OSPI0 Tap DDR Timing
        15. 6.10.5.15 PCIe
        16. 6.10.5.16 PRU_ICSSG
          1. 6.10.5.16.1 PRU_ICSSG Programmable Real-Time Unit (PRU)
            1. 6.10.5.16.1.1 PRU_ICSSG PRU Direct Output Mode Timing
            2. 6.10.5.16.1.2 PRU_ICSSG PRU Parallel Capture Mode Timing
            3. 6.10.5.16.1.3 PRU_ICSSG PRU Shift Mode Timing
            4. 6.10.5.16.1.4 PRU_ICSSG PRU Sigma Delta and Peripheral Interface
              1. 6.10.5.16.1.4.1 PRU_ICSSG PRU Sigma Delta and Peripheral Interface Timing
          2. 6.10.5.16.2 PRU_ICSSG Pulse Width Modulation (PWM)
            1. 6.10.5.16.2.1 PRU_ICSSG PWM Timing
          3. 6.10.5.16.3 PRU_ICSSG Industrial Ethernet Peripheral (IEP)
            1. 6.10.5.16.3.1 PRU_ICSSG IEP Timing
          4. 6.10.5.16.4 PRU_ICSSG Universal Asynchronous Receiver Transmitter (UART)
            1. 6.10.5.16.4.1 PRU_ICSSG UART Timing
          5. 6.10.5.16.5 PRU_ICSSG Enhanced Capture Peripheral (ECAP)
            1. 6.10.5.16.5.1 PRU_ICSSG ECAP Timing
          6. 6.10.5.16.6 PRU_ICSSG RGMII, MII_RT, and Switch
            1. 6.10.5.16.6.1 PRU_ICSSG MDIO Timing
            2. 6.10.5.16.6.2 PRU_ICSSG MII Timing
            3. 6.10.5.16.6.3 PRU_ICSSG RGMII Timing
        17. 6.10.5.17 Timers
        18. 6.10.5.18 UART
        19. 6.10.5.19 USB
      6. 6.10.6 Emulation and Debug
        1. 6.10.6.1 Trace
        2. 6.10.6.2 JTAG
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-A53 Subsystem
      2. 7.2.2 Arm Cortex-R5F Subsystem (R5FSS)
      3. 7.2.3 Arm Cortex-M4F (M4FSS)
    3. 7.3 Accelerators and Coprocessors
      1. 7.3.1 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU_ICSSG)
    4. 7.4 Other Subsystems
      1. 7.4.1 PDMA Controller
      2. 7.4.2 Peripherals
        1. 7.4.2.1  ADC
        2. 7.4.2.2  DCC
        3. 7.4.2.3  Dual Date Rate (DDR) External Memory Interface (DDRSS)
        4. 7.4.2.4  ECAP
        5. 7.4.2.5  EPWM
        6. 7.4.2.6  ELM
        7. 7.4.2.7  ESM
        8. 7.4.2.8  GPIO
        9. 7.4.2.9  EQEP
        10. 7.4.2.10 General-Purpose Memory Controller (GPMC)
        11. 7.4.2.11 I2C
        12. 7.4.2.12 MCAN
        13. 7.4.2.13 MCRC Controller
        14. 7.4.2.14 MCSPI
        15. 7.4.2.15 MMCSD
        16. 7.4.2.16 OSPI
        17. 7.4.2.17 Peripheral Component Interconnect Express (PCIe)
        18. 7.4.2.18 Serializer/Deserializer (SerDes) PHY
        19. 7.4.2.19 Real Time Interrupt (RTI/WWDT)
        20. 7.4.2.20 Dual Mode Timer (DMTIMER)
        21. 7.4.2.21 UART
        22. 7.4.2.22 Universal Serial Bus Subsystem (USBSS)
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply
        1. 8.1.1.1 Power Supply Designs
        2. 8.1.1.2 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG, EMU, and TRACE
      4. 8.1.4 Unused Pins
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 DDR Board Design and Layout Guidelines
      2. 8.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 8.2.2.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 8.2.2.2 External Board Loopback
        3. 8.2.2.3 DQS (only available in Octal SPI devices)
      3. 8.2.3 USB VBUS Design Guidelines
      4. 8.2.4 System Power Supply Monitor Design Guidelines
      5. 8.2.5 High Speed Differential Signal Routing Guidance
      6. 8.2.6 Thermal Solution Guidance
    3. 8.3 Clock Routing Guidelines
      1. 8.3.1 Oscillator Routing
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALV|441
Thermal pad, mechanical data (Package|Pins)
Orderable Information
6.10.5.14.1.1 OSPI0 With PHY Data Training

Read and write data valid windows will shift due to variation in process, voltage, temperature, and operating frequency. A data training method may be implemented to dynamically configure optimal read and write timing. Implementing data training enables proper operation across temperature with a specific process, voltage, and frequency operating condition, while achieving a higher operating frequency.

Data transmit and receive timing parameters are not defined for the data training use case since they are dynamically adjusted based on the operating condition.

Table 6-94 defines DLL delays required for OSPI0 with Data Training. Table 6-95, Figure 6-78, Table 6-96, and Figure 6-79 present timing requirements and switching characteristics for OSPI0 with Data Training.

Table 6-94 OSPI0 DLL Delay Mapping for PHY Data Training
MODE OSPI_PHY_CONFIGURATION_REG BIT FIELD DELAY VALUE
Transmit
All modes PHY_CONFIG_TX_DLL_DELAY_FLD, (1)
Receive
All modes PHY_CONFIG_RX_DLL_DELAY_FLD (2)
(1) Transmit DLL delay value determined by training software
(2) Receive DLL delay value determined by training software
Table 6-95 OSPI0 Timing Requirements – PHY Data Training see Figure 6-78
NO. MODE MIN MAX UNIT
O15 tsu(D-LBCLK) Setup time, OSPI0_D[7:0] valid before active OSPI0_DQS edge DDR with DQS (1) ns
O16 th(LBCLK-D) Hold time, OSPI0_D[7:0] valid after active OSPI0_DQS edge DDR with DQS (1) ns
(1) Minimum setup and hold time requirements for OSPI0_D[7:0] inputs are not defined when Data Training is used to find the optimum data valid window.
GUID-E00937AF-BFE0-4418-A9ED-E46A1C187641-low.gif Figure 6-78 OSPI0 Timing Requirements – PHY Data Training, DDR with DQS
Table 6-96 OSPI Switching Characteristics – PHY Data Training See Figure 6-79
NO. PARAMETER MODE MIN MAX UNIT
O1 tc(CLK) Cycle time, OSPI0_CLK 1.8V, DDR 6.02 7.52 ns
3.3V, DDR 7.52 7.52 ns
O2 tw(CLKL) Pulse duration, OSPI0_CLK low DDR ((0.475P(1)) - 0.3) ns
O3 tw(CLKH) Pulse duration, OSPI0_CLK high DDR ((0.475P(1)) - 0.3) ns
O4 td(CSn-CLK) Delay time, OSPI0_CSn[3:0] active edge to OSPI0_CLK rising edge DDR ((0.475P(1)) + (0.975M(2)R(4)) + (0.04TD(5)) - 1) ((0.525P(1)) + (1.025M(2)R(4)) + (0.11TD(5)) + 1) ns
O5 td(CLK-CSn) Delay time, OSPI0_CLK rising edge to OSPI0_CSn[3:0] inactive edge DDR ((0.475P(1)) + (0.975N(3)R(4)) - (0.04TD(5)) - 1) ((0.525P(1)) + (1.025N(3)R(4)) - (0.11TD(5)) + 1) ns
O6 td(CLK-D) Delay time, OSPI0_CLK active edge to OSPI0_D[7:0] transition DDR (6) (6) ns
(1) P = SCLK cycle time in ns = OSPI0_CLK cycle time in ns
(2) M = OSPI_DEV_DELAY_REG[D_INIT_FLD]
(3) N = OSPI_DEV_DELAY_REG[D_AFTER_FLD]
(4) R = reference clock cycle time in ns
(5) TD = PHY_CONFIG_TX_DLL_DELAY_FLD
(6) Minimum and maximum delay times for OSPI0_D[7:0] outputs are not defined when Data Training is used to find the optimum data valid window.
GUID-489AADD3-03CA-408E-8257-98F0E65997F1-low.gif Figure 6-79 OSPI0 Switching Characteristics – PHY DDR Data Training