SBASAX1 August   2024 AMC0106M25

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information (DEN Package)
    5. 5.5 Package Characteristics
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Modulator
      3. 6.3.3 Isolation Channel Signal Transmission
      4. 6.3.4 Digital Output
        1. 6.3.4.1 Output Behavior in Case of a Full-Scale Input
        2. 6.3.4.2 Output Behavior in Case of a Missing High-Side Supply
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Shunt Resistor Sizing
        2. 7.2.2.2 Input Filter Design
        3. 7.2.2.3 Bitstream Filtering
        4. 7.2.2.4 Designing the Bootstrap Supply
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)
MIN NOM MAX UNIT
POWER SUPPLY
AVDD Hgh-side power supply AVDD to AGND 3 5.0 5.5 V
DVDD Low-side power supply DVDD to DGND 2.7 3.3 5.5 V
ANALOG INPUT
VClipping Differential input voltage before clipping output VIN = VINP – VINN ±320 mV
VFSR Specified linear differential input voltage VIN = VINP – VINN –250 250 mV
VCM Operating common-mode input voltage (VINP + VINN) / 2 to AGND –0.16 1 V
CIN, EXT Minimum external capacitance connected to the input from INP to INN 10 nF
DIGITAL I/O
VIO Digital input/output voltage 0 DVDD V
fCLKIN Input clock frequency 5 20 21 MHz
tHIGH Input clock high time 21.5 50 110 ns
tLOW Input clock low time 21.5 50 110 ns
ISOLATION BARRIER
VIOWM Functional isolation working voltage(1) AC voltage (sine wave) 200 VRMS
DC voltage 280 VDC
TEMPERATURE RANGE
TA Specified ambient temperature –40 125 °C
(1) Common-mode from left-side (pins1-4) to right-side (pins5-8) of the package.