SBASAT2 December   2024 AMC0386

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Timing Diagrams
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Modulator
      3. 7.3.3 Isolation Channel Signal Transmission
      4. 7.3.4 Digital Output
        1. 7.3.4.1 Output Behavior in Case of a Fullscale Input
        2. 7.3.4.2 Output Behavior in Case of a Missing High-Side Supply
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Filter Design
        2. 8.2.2.2 Bitstream Filtering
        3. 8.2.2.3 Application Curve
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
  • DFX|15
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.1 Analog Input

The resistive divider at the input of the AMC0386 scales down the voltage applied to the HVIN pin to a ±1V linear full-scale level. This signal is available on the SNSP pin, which is also the input of the analog signal chain.

The high-impedance input buffer on the SNSP pin feeds a second-order, switched-capacitor, feed-forward ΔΣ modulator. The modulator converts the analog signal into a bitstream that is transferred across the isolation barrier, as described in the Isolation Channel Signal Transmission section.

For reduced offset and offset drift, the input buffer is chopper-stabilized with the chopping frequency set at fCLKIN/16. Figure 7-1 shows the spur at 625kHz that is generated by the chopping frequency for a modulator clock of 10MHz.

AMC0386 Quantization Noise Shaping
sinc3 filter, OSR = 1, fCLKIN = 10MHz, fIN = 1kHz
Figure 7-1 Quantization Noise Shaping