SBAS789B October   2017  – April 2020 AMC1106E05 , AMC1106M05

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics: AMC1106x
    10. 7.10 Timing Requirements
    11. 7.11 Switching Characteristics
    12. 7.12 Insulation Characteristics Curves
    13. 7.13 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
      2. 8.3.2 Modulator
      3. 8.3.3 Isolation Channel Signal Transmission
      4. 8.3.4 Digital Output
      5. 8.3.5 Manchester Coding Feature
    4. 8.4 Device Functional Modes
      1. 8.4.1 Fail-Safe Output
      2. 8.4.2 Output Behavior in Case of a Full-Scale Input
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Digital Filter Usage
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
      4. 9.2.4 What To Do and What Not To Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
        1. 12.1.1.1 Isolation Glossary
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Support Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Power Supply Recommendations

For lowest system-level cost, the high-side power supply (AVDD) for the AMC1106 is derived from an external capacitive-drop power supply. The Magnetically Immune Transformerless Power Supply for Isolated Shunt Current Measurement reference design and Figure 52 shows a proven solution based on a 6.2-V diode and the TLV70450 5-V low dropout (LDO) regulator. A low equivalent series resistance (ESR) decoupling capacitor of 0.1 µF is recommended for filtering this power-supply path. Place this capacitor (C5 in Figure 52) as close as possible to the AVDD pin of the AMC1106 for best performance.

The floating ground reference (AGND) is derived from the end of the shunt resistor that is also connected to the negative input (AINN) of the device. If a four-pin shunt is used, the device inputs are connected to the inner leads and AGND is connected to one of the outer leads of the shunt.

For decoupling of the digital power supply on the controller side, TI recommends using a 0.1-µF capacitor (C6 in Figure 52) assembled as close to the DVDD pin of the AMC1106 as possible, followed by an additional capacitor in the range of 1 µF to 10 µF.

AMC1106E05 AMC1106M05 cap_drop_bas789.gifFigure 52. Capacitive-Drop Solution for the AMC1106 AVDD Supply