SBASAB8
May 2021
AMC1202
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Power Ratings
6.6
Insulation Specifications
6.7
Safety-Related Certifications
6.8
Safety Limiting Values
6.9
Electrical Characteristics
6.10
Switching Characteristics
6.11
Timing Diagram
6.12
Insulation Characteristics Curves
6.13
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Analog Input
7.3.2
Isolation Channel Signal Transmission
7.3.3
Analog Output
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Shunt Resistor Sizing
8.2.2.2
Input Filter Design
8.2.2.3
Differential to Single-Ended Output Conversion
8.2.3
Application Curve
8.2.4
What to Do and What Not to Do
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Trademarks
11.3
Electrostatic Discharge Caution
11.4
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DWV|8
MPDS382B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbasab8_oa
sbasab8_pm
6.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged device model (CDM), per JESD22-C101
(2)
±1000
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.