SBAS427D February   2008  – June 2024 AMC1203

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5.   Device Comparison Table
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Timing Diagram
    12. 5.12 Typical Characteristics
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Modulator
      3. 6.3.3 Digital Output
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Shunt Resistor Sizing
        2. 7.2.2.2 Input Filter Design
        3. 7.2.2.3 Bitstream Filtering
      3. 7.2.3 Application Curve
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision C (June 2011) to Revision D (June 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added Package Information table, Device Comparison Table, ESD Ratings, Power Ratings, Insulation Specifications, Power Ratings, Insulation Specifications, Safety-Related Certifications, Safety Limiting Values, Switching Characteristics, Overview, Functional Block Diagram, Feature Description, Device Functional Modes, Application and Implementation, Typical Application, Best Design Practices, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Deleted Package/Ordering Information, Dissipation Ratings, Regulatory Information, IEC 60747-5-2 Isolation Characteristics, Package Characteristics, IEC Safety Limiting Values, IEC 61000-4-5 Ratings, and IEC 60664-1 Ratings tablesGo
  • Changed entire document to align with current family formatGo
  • Added PSA and DW package options to documentGo
  • Changed VIOTM from 4000VPK to 3800VPK and VISO from 2800VRMS to 2700VRMS Go
  • Changed VIOSM from 6000VPK to 4000VPK Go

Changes from Revision B (May 2010) to Revision C (June 2011)

  • Changed Minimum Air Gap parameter in Package Characteristics table to show values for all packagesGo
  • Added VIOSM symbol to Surge Immunity parameter in IEC 61000-4-5 Ratings tableGo