SBAS427D February   2008  – June 2024 AMC1203

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5.   Device Comparison Table
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Timing Diagram
    12. 5.12 Typical Characteristics
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Modulator
      3. 6.3.3 Digital Output
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Shunt Resistor Sizing
        2. 7.2.2.2 Input Filter Design
        3. 7.2.2.3 Bitstream Filtering
      3. 7.2.3 Application Curve
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

AMC1203 DUB Package,8-Pin SOP Gull-Wing(Top View), and PSA Package,8-Pin SOP(Top View) Figure 4-1 DUB Package,8-Pin SOP Gull-Wing(Top View), and PSA Package,8-Pin SOP(Top View)
Table 4-1 Pin Functions: SOP
PIN TYPE DESCRIPTION
NO. NAME
1 AVDD High-side power Analog (high-side) power supply(1).
2 INP Analog input Noninverting analog input.
3 INN Analog input Inverting analog input.
4 AGND High-side ground Analog (high-side) ground reference.
5 DGND Low-side ground Digital (low-side) ground reference.
6 DOUT Digital output Modulator data output.
7 CLKOUT Digital output Modulator clock output.
8 DVDD Low-side power Digital (low-side) power supply(1).
AMC1203 DW Package,16-Pin SOIC(Top View) Figure 4-2 DW Package,16-Pin SOIC(Top View)
Table 4-2 Pin Functions: SOIC
PIN TYPE DESCRIPTION
NO. NAME
1 AVDD High-side power Analog (high-side) power supply(1).
2 INP Analog input Noninverting analog input.
3 INN Analog input Inverting analog input.
4, 8(2) AGND High-side ground Analog (high-side) ground.
5, 6, 7, 10, 12, 15 NC N/A No internal connection. Tie these pins to any potential or leave unconnected.
9, 16(2) DGND Low-side ground Digital (low-side) ground.
11 DOUT Digital output Modulator data output.
13 CLKOUT Digital output Modulator clock output.
14 DVDD Low-side power Digital (low-side) power supply(1).
(1) See the Power Supply Recommendations section for power-supply decoupling recommendations.
(2) Both pins are connected internally by a low-impedance path. Only one pin must be tied to the ground plane.