SBAS895D May   2018  – May 2022 AMC1300

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics
    10. 7.10 Switching Characteristics
    11. 7.11 Timing Diagram
    12. 7.12 Insulation Characteristics Curves
    13. 7.13 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
      2. 8.3.2 Isolation Channel Signal Transmission
      3. 8.3.3 Analog Output
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Shunt Resistor Sizing
        2. 9.2.2.2 Input Filter Design
        3. 9.2.2.3 Differential-to-Single-Ended Output Conversion
      3. 9.2.3 Application Curves
    3. 9.3 What To Do and What Not To Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

Figure 6-1 DWV Package,8-Pin SOIC,Top View
Table 6-1 Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
1 VDD1 High-side power High-side power supply.(1)
2 INP Analog input Noninverting analog input. Either INP or INN must have a DC current path to GND1 to define the common-mode input voltage.(2)
3 INN Analog input Inverting analog input. Either INP or INN must have a DC current path to GND1 to define the common-mode input voltage.(2)
4 GND1 High-side ground High-side analog ground.
5 GND2 Low-side ground Low-side analog ground.
6 OUTN Analog output Inverting analog output.
7 OUTP Analog output Noninverting analog output.
8 VDD2 Low-side power Low-side power supply.(1)
(1) See the Section 10 section for power-supply decoupling recommendations.
(2) See the Section 11 section for details.