SBASAH9
February 2022
AMC1306M25-Q1
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Power Ratings
6.6
Insulation Specifications
6.7
Safety-Related Certifications
Safety Limiting Values
6.8
Electrical Characteristics
Switching Characteristics
6.9
Timing Diagrams
6.10
Insulation Characteristics Curves
6.11
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Analog Input
7.3.2
Modulator
7.3.3
Isolation Channel Signal Transmission
7.3.4
Digital Output
7.3.4.1
Output Behavior in Case of a Full-Scale Input
7.3.4.2
Output Behavior in Case of Input Common-Mode Overrange
7.3.4.3
Output Behavior in Case of a Missing High-Side Supply
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Shunt Resistor Sizing
8.2.2.2
Input Filter Design
8.2.2.3
Bitstream Filtering
8.2.3
Application Curve
8.3
What to Do and What Not to Do
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Support Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DWV|8
MPDS382B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbasah9_oa
sbasah9_pm
11.6
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.