SBASAO0A May   2023  – September 2023 AMC130M03

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Insulation Specifications
    6. 6.6  Safety-Related Certifications
    7. 6.7  Safety Limiting Values
    8. 6.8  Electrical Characteristics
    9. 6.9  Timing Requirements
    10. 6.10 Switching Characteristics
    11. 6.11 Timing Diagrams
    12. 6.12 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Noise Measurements
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Isolated DC/DC Converter
        1. 8.3.1.1 DC/DC Converter Failure Detection
      2. 8.3.2  High-Side Current Drive Capability
      3. 8.3.3  Isolation Channel Signal Transmission
      4. 8.3.4  Input ESD Protection Circuitry
      5. 8.3.5  Input Multiplexer
      6. 8.3.6  Programmable Gain Amplifier (PGA)
      7. 8.3.7  Voltage Reference
      8. 8.3.8  Internal Test Signals
      9. 8.3.9  Clocking and Power Modes
      10. 8.3.10 ΔΣ Modulator
      11. 8.3.11 Digital Filter
        1. 8.3.11.1 Digital Filter Implementation
          1. 8.3.11.1.1 Fast-Settling Filter
          2. 8.3.11.1.2 SINC3 and SINC3 + SINC1 Filter
        2. 8.3.11.2 Digital Filter Characteristic
      12. 8.3.12 Channel Phase Calibration
      13. 8.3.13 Calibration Registers
      14. 8.3.14 Register Map CRC
      15. 8.3.15 Temperature Sensor
        1. 8.3.15.1 Internal Temperature Sensor
        2. 8.3.15.2 External Temperature Sensor
        3. 8.3.15.3 Clock Selection for Temperature Sensor Operation
      16. 8.3.16 General-Purpose Digital Output (GPO)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Up and Reset
        1. 8.4.1.1 Power-On Reset
        2. 8.4.1.2 SYNC/RESET Pin
        3. 8.4.1.3 RESET Command
      2. 8.4.2 Start-Up Behavior After Power-Up
      3. 8.4.3 Start-Up Behavior After a Pin Reset or RESET Command
      4. 8.4.4 Start-Up Behavior After a Pause in CLKIN
      5. 8.4.5 Synchronization
      6. 8.4.6 Conversion Modes
        1. 8.4.6.1 Continuous-Conversion Mode
        2. 8.4.6.2 Global-Chop Mode
      7. 8.4.7 Power Modes
      8. 8.4.8 Standby Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1  Chip Select (CS)
        2. 8.5.1.2  Serial Data Clock (SCLK)
        3. 8.5.1.3  Serial Data Input (DIN)
        4. 8.5.1.4  Serial Data Output (DOUT)
        5. 8.5.1.5  Data Ready (DRDY)
        6. 8.5.1.6  Conversion Synchronization or System Reset (SYNC/RESET)
        7. 8.5.1.7  SPI Communication Frames
        8. 8.5.1.8  SPI Communication Words
        9. 8.5.1.9  Short SPI Frames
        10. 8.5.1.10 Communication Cyclic Redundancy Check (CRC)
        11. 8.5.1.11 SPI Timeout
      2. 8.5.2 ADC Conversion Data Format
      3. 8.5.3 Commands
        1. 8.5.3.1 NULL (0000 0000 0000 0000)
        2. 8.5.3.2 RESET (0000 0000 0001 0001)
        3. 8.5.3.3 STANDBY (0000 0000 0010 0010)
        4. 8.5.3.4 WAKEUP (0000 0000 0011 0011)
        5. 8.5.3.5 LOCK (0000 0101 0101 0101)
        6. 8.5.3.6 UNLOCK (0000 0110 0101 0101)
        7. 8.5.3.7 RREG (101a aaaa annn nnnn)
          1. 8.5.3.7.1 Reading a Single Register
          2. 8.5.3.7.2 Reading Multiple Registers
        8. 8.5.3.8 WREG (011a aaaa annn nnnn)
      4. 8.5.4 ADC Output Buffer and FIFO Buffer
      5. 8.5.5 Collecting Data for the First Time or After a Pause in Data Collection
    6. 8.6 AMC130M03 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Unused Inputs and Outputs
      2. 9.1.2 Antialiasing
      3. 9.1.3 Minimum Interface Connections
      4. 9.1.4 Multiple Device Configuration
      5. 9.1.5 Calibration
      6. 9.1.6 Troubleshooting
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Voltage Measurement
        2. 9.2.2.2 Current Shunt Measurement
        3. 9.2.2.3 Temperature Measurement
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) DFM (SOIC) UNIT
20 PINS
RθJA Junction-to-ambient thermal resistance 68.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 24.6 °C/W
RθJB Junction-to-board thermal resistance 53.7 °C/W
ΨJT Junction-to-top characterization parameter 17.1 °C/W
ΨJB Junction-to-board characterization parameter 50.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.