SBASAO3 Data sheet | TI.com

SBASAO3A May 2023 – September 2023 AMC131M03-Q1

PRODUCTION DATA

Package Options

Mechanical Data (Package|Pins)

DFM|20
- MCSS009

Thermal pad, mechanical data (Package|Pins)

Orderable Information

6.12 Typical Characteristics

for channel 0 at T_A = 25°C, DVDD = 3.3 V, f_CLKIN = 8.192 MHz, data rate = 4 kSPS (OSR = 1024 and clock divider N_DIV = 2), high-resolution mode, with all channels enabled, global-chop mode disabled, and gain = 1 (unless otherwise noted)

Figure 6-4 Input Impedance vs Gain

Figure 6-6 Input Impedance vs Temperature

Figure 6-8 Offset Error vs Gain

30 units, 85°C

Figure 6-10 Offset Error vs Time

Figure 6-12 Gain Error vs Gain

Figure 6-14 Dynamic Range vs Gain

Averaged FFT, frequency bin width equals 1 Hz

Figure 6-16 Frequency Spectrum With 50-Hz Input Signal

Figure 6-18 Internal Temperature Sensor Accuracy vs Temperature (Without Calibration)

Figure 6-20 DVDD Current vs CLKIN Frequency

Figure 6-22 HLDO Output Voltage vs Temperature

Figure 6-5 Input Impedance vs CLKIN Frequency

Figure 6-7 Input Current vs Differential Input Voltage

Figure 6-9 Offset Error vs Temperature

30 units, 85°C

Figure 6-11 Gain Error vs Time

Figure 6-13 Gain Error vs Temperature

Figure 6-15 Dynamic Range vs OSR

Averaged FFT, frequency bin width equals 1 Hz

Figure 6-17 Noise Spectral Density vs Frequency

Figure 6-19 Internal Temperature Sensor Accuracy vs Temperature (With Calibration)

Figure 6-21 DVDD Current vs Temperature

Figure 6-23 HLDO Output Voltage vs Load Current