SBASA71 May   2022 AMC1333M10

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Timing Diagrams
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Modulator
      3. 7.3.3 Isolation Channel Signal Transmission
      4. 7.3.4 Digital Output
        1. 7.3.4.1 Output Behavior in Case of a Full-Scale Input
        2. 7.3.4.2 Output Behavior in Case of a Missing High-Side Supply
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Filter Design
        2. 8.2.2.2 Bitstream Filtering
      3. 8.2.3 Application Curve
    3. 8.3 What to Do and What Not to Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.10 Switching Characteristics

over operating ambient temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fCLK Internal clock frequency 9.5 10 10.5 MHz
Internal clock duty cycle 45% 50% 55%
tH DOUT hold time after rising edge of CLKOUT CLOAD = 15 pF 3.5 ns
tD DOUT hold time after rising edge of CLKOUT CLOAD = 15 pF 15 ns
tr DOUT and CLKOUT rise time 10% to 90%, 2.7 V ≤ DVDD ≤ 3.6 V, CLOAD = 15 pF 2.5 6 ns
10% to 90%, 4.5 V ≤ DVDD ≤ 5.5 V, CLOAD = 15 pF 3.2 6
tf DOUT and CLKOUT fall time 10% to 90%, 2.7 V ≤ DVDD ≤ 3.6 V, CLOAD = 15 pF 2.2 6 ns
10% to 90%, 4.5 V ≤ DVDD ≤ 5.5 V, CLOAD = 15 pF 2.9 6
tASTART Device start-up time AVDD step from 0  to 3.0 V with DVDD ≥ 2.7 V to bitstream valid, 0.1% settling 0.25 ms