SBAS951B August   2019  – April 2020 AMC1336

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. Table 1.  Absolute Maximum Ratings
    2. Table 2.  ESD Ratings
    3. Table 3.  Recommended Operating Conditions
    4. Table 4.  Thermal Information
    5. Table 5.  Power Ratings
    6. Table 6.  Insulation Specifications
    7. Table 7.  Safety-Related Certifications
    8. Table 8.  Safety Limiting Values
    9. Table 9.  Electrical Characteristics
    10. Table 10. Switching Characteristics
    11. 6.1       Insulation Characteristics Curves
    12. 6.2       Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Modulator
      3. 7.3.3 Isolation Channel Signal Transmission
      4. 7.3.4 Clock Input
      5. 7.3.5 Digital Output
    4. 7.4 Device Functional Modes
      1. 7.4.1 Output Behavior in Case of a Full-Scale Input
      2. 7.4.2 AVDD Diagnostics and Fail-Safe Output
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Digital Filter Usage
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
      4. 8.2.4 What to Do and What Not to Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
        1. 11.1.1.1 Isolation Glossary
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.2 Detailed Design Procedure

Use Ohm's Law to calculate the minimum total resistance of the resistive dividers to limit the cross current to the desired values:

  • For the voltage sensing on the DC bus: RDC1 + RDC2 + RDC3 = VBUS / IDC
  • For the voltage sensing on the output phases U, V, and W: RAC1 + RAC2 + RAC3 = VPHASE (max) / IAC

Consider the following two restrictions to choose the proper value of the resistors RDC3 and RAC3:

  • The voltage drop caused by the nominal voltage range of the system must not exceed the recommended input voltage range of the AMC1336: VxC3 ≤ VFSR
  • The voltage drop caused by the maximum allowed system overvoltage must not exceed the input voltage that causes a clipping output: VxC3 ≤ VClipping

Use similar approach for calculation of the shunt resistor values RSHUNT and see the AMC1306M25 data sheet for further details.

Table 12 lists examples of nominal E96-series (1% accuracy) resistor values for systems using 600 V and 800 V on the DC bus.

Table 12. Resistor Value Examples for DC Bus Sensing

PARAMETER 600-V DC BUS 800-V DC BUS
Resistive divider resistor RDC1 3.01 MΩ 4.22 MΩ
Resistive divider resistor RDC2 3.01 MΩ 4.22 MΩ
Sense resistor RDC3 10 kΩ 10.5 kΩ
Resulting current through resistive divider IDC 99.5 µA 94.7 µA
Resulting voltage drop on sense resistor VRDC3 0.995 V 0.994 V

Table 13 lists examples of nominal E96-series (1% accuracy) resistor values for systems using 230 V and 690 V on the input or output phases.

Table 13. Resistor Value Examples for Phase Voltage Sensing

PARAMETER ±400-VAC PHASE ±690-VAC PHASE
Resistive divider resistor RAC1 2.0 MΩ 3.48 MΩ
Resistive divider resistor RAC2 2.0 MΩ 3.48 MΩ
Sense resistor RAC3 10.0 kΩ 10.0 kΩ
Resulting current through resistive divider IAC 99.8 µA 99.0 µA
Resulting voltage drop on sense resistor VRAC3 ±0.998 V ±0.990 V

Use a power supply with a nominal voltage of 3.3 V for DVDD to directly connect all modulators to the microcontroller.

For modulator output bitstream filtering, a device from TI's TMS320F2807x family of low-cost microcontrollers (MCUs) or TMS320F2837x family of dual-core MCUs is recommended. These MCU families support up to eight channels of dedicated hardwired filter structures called sigma-delta filter modules (SDFMs) that significantly simplify system level design by offering two filtering paths per channel: one providing high accuracy results for the control loop and one that offers a fast response path for overcurrent detection. Use one of the pulse-width modulation (PWM) sources inside the MCU to generate the clock for the modulators and for easy synchronization of all feedback signals and the switching control of the gate drivers.

The application examples in Figure 50 and Figure 51 use a clock buffer to distribute the clock reference signal generated on one of the PWMx outputs of the MCU to all modulators used in the circuit and as a reference for the digital filters in the MCU. In this example, TI's CDCLVC1106 is used for this purpose. Each CDCLVC1106 output can drive a load of 8 pF that is sufficient to drive up to two modulator and up to four SDFM clock inputs.