SBASAP9A March   2023  – December 2024 AMC23C15

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information 
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications (Reinforced Isolation)
    7. 5.7  Safety-Related Certifications 
    8. 5.8  Safety Limiting Values 
    9. 5.9  Electrical Characteristics 
    10. 5.10 Switching Characteristics 
    11. 5.11 Timing Diagrams
    12. 5.12 Insulation Characteristics Curves
    13. 5.13 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Reference Input
      3. 6.3.3 Isolation Channel Signal Transmission
      4. 6.3.4 Open-Drain Digital Outputs
      5. 6.3.5 Power-Up and Power-Down Behavior
      6. 6.3.6 VDD1 Brownout and Power-Loss Behavior
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Overcurrent and Short-Circuit Current Detection
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
      2. 7.2.2 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Application Curves

Figure 7-2 shows the typical response of the AMC23C15 to a bipolar, triangular input waveform with an amplitude of 140mVPP. OUT1 switches when VIN crosses the ±50mV level determined by the REF pin voltage that is biased to 50mV in this example. OUT2 switches when VIN crosses the ±60mV level determined by the fixed internal reference value.

AMC23C15 Output Response of the AMC23C15 to a Triangular Input WaveformFigure 7-2 Output Response of the AMC23C15 to a Triangular Input Waveform

The integrated LDO of the AMC23C15 greatly relaxes the power-supply requirements on the high-voltage side and allows powering the device from non-regulated transformer, charge pump, and bootstrap supplies. As given by the following images, the internal LDO provides a stable operating voltage to the internal circuitry, allowing the trip thresholds to remain mostly undisturbed even at ripple voltages of 2VPP and higher.

AMC23C15 Trip Threshold Sensitivity to VDD1 Ripple Voltage (Cmp0, fRIPPLE = 10kHz)Figure 7-3 Trip Threshold Sensitivity to VDD1 Ripple Voltage (Cmp0, fRIPPLE = 10kHz)
AMC23C15 Trip Threshold Sensitivity to VDD1 Ripple Voltage (Cmp2, fRIPPLE = 10kHz)Figure 7-5 Trip Threshold Sensitivity to VDD1 Ripple Voltage (Cmp2, fRIPPLE = 10kHz)
AMC23C15 Trip Threshold Sensitivity to VDD1 Ripple Voltage (Cmp1, fRIPPLE = 10kHz)Figure 7-4 Trip Threshold Sensitivity to VDD1 Ripple Voltage (Cmp1, fRIPPLE = 10kHz)
AMC23C15 Trip Threshold Sensitivity to VDD1 Ripple Voltage (Cmp3, fRIPPLE = 10kHz)Figure 7-6 Trip Threshold Sensitivity to VDD1 Ripple Voltage (Cmp3, fRIPPLE = 10kHz)