SBASAP9 March   2023 AMC23C15

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information 
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications 
    8. 6.8  Safety Limiting Values 
    9. 6.9  Electrical Characteristics 
    10. 6.10 Switching Characteristics 
    11. 6.11 Timing Diagrams
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Reference Input
      3. 7.3.3 Isolation Channel Signal Transmission
      4. 7.3.4 Open-Drain Digital Outputs
      5. 7.3.5 Power-Up and Power-Down Behavior
      6. 7.3.6 VDD1 Brownout and Power-Loss Behavior
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Overcurrent and Short-Circuit Current Detection
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)
MIN NOM MAX UNIT
POWER SUPPLY
VVDD1 High-side power-supply voltage VDD1 to GND1 3.0 5 27 V
VVDD2 Low-side power supply voltage VDD2 to GND2 2.7 3.3 5.5 V
ANALOG INPUT
VIN Input voltage IN to GND1, VDD1 ≤ 4.3 V –0.4               VDD1 – 0.3 V
IN to GND1, VDD1 > 4.3 V –0.4 4
VREF Reference voltage, window comparator mode REF to GND1 20(2) 300 mV
Reference voltage, positive-comparator mode Low hysteresis mode 20(2) 450
High hysteresis mode
(Cmp0 only)		 600 2700(1)
Reference voltage headroom VDD1 – VREF 1.4 V
Filter capacitance on REF pin 20 100 nF
DIGITAL OUTPUTS
Digital output voltage OUT1, OUT2 to GND2 GND2 VDD2 V
Sink current OUT1, OUT2 0 4 mA
TEMPERATURE RANGE
TA Specified ambient temperature –40 25 125 °C
(1) Reference voltages (VREF) >1.6 V require VVDD1 > VVDD1,MIN to maintain minimum headroom (VVDD1 – VREF) of 1.4 V.
(2) The device has been tested with VREF as low as 5 mV. The device remains functional but relative switching threshold accuracy can decrease because of offset errors.