The AMC3302 is a precision, isolated amplifier optimized for shunt-based current measurements. The fully integrated, isolated DC/DC converter allows single-supply operation from the low-side of the device, which makes the device a unique solution for space-constrained applications. The reinforced capacitive isolation barrier is certified according to VDE V 0884-11 and UL1577 and supports a working voltage of up to 1.2 kVRMS.
The isolation barrier separates parts of the system that operate on different common-mode voltage levels and protects the low-voltage side from hazardous voltages and damage.
The input of the AMC3302 is optimized for direct connection to a low-impedance shunt resistor or another low-impedance voltage source with low signal levels. The excellent DC accuracy and low temperature drift supports accurate current measurements over the extended industrial temperature range from –40°C to +125°C.
The integrated DC/DC converter fault-detection and diagnostic output pin of the AMC3302 simplify system-level design and diagnostics.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
AMC3302 | SOIC (16) | 10.30 mm × 7.50 mm |
Changes from Revision A (February 2021) to Revision B (July 2021)
PIN | TYPE | DESCRIPTION | |
---|---|---|---|
NO. | NAME | ||
1 | DCDC_OUT | Power | High-side output of the isolated DC/DC converter; connect this pin to the HLDO_IN pin.(1) |
2 | DCDC_HGND | High-side power ground | High-side ground reference for the isolated DC/DC converter; connect this pin to the HGND pin. |
3 | HLDO_IN | Power | Input of the high-side LDO; connect this pin to the DCDC_OUT pin(1) |
4 | NC | — | No internal connection; connect this pin to HGND or leave this pin unconnected. |
5 | HLDO_OUT | Power | Output of the high-side LDO.(1) |
6 | INP | Analog input | Noninverting analog input. Either INP or INN must have a DC current path to HGND to define the common-mode input voltage.(2) |
7 | INN | Analog input | Inverting analog input. Either INP or INN must have a DC current path to HGND to define the common-mode input voltage.(2) |
8 | HGND | High-side signal ground | High-side analog ground; connect this pin to the DCDC_HGND pin. |
9 | GND | Low-side signal ground | Low-side analog ground; connect this pin to the DCDC_GND pin. |
10 | OUTN | Analog output | Inverting analog output. |
11 | OUTP | Analog output | Noninverting analog output. |
12 | VDD | Low-side power | Low-side power supply.(1) |
13 | LDO_OUT | Power | Output of the low-side LDO; connect this pin to the DCDC_IN pin. The output of the LDO must not be loaded by external circuitry.(1) |
14 | DIAG | Digital output | Active-low, open-drain status indicator output; connect this pin to the pullup supply (for example, VDD) using a resistor or leave this pin floating if not used. |
15 | DCDC_GND | Low-side power ground | Low-side ground reference for the isolated DC/DC converter; connect this pin to the GND pin. |
16 | DCDC_IN | Power | Low-side input of the isolated DC/DC converter; connect this pin to the LDO_OUT pin.(1) |
MIN | MAX | UNIT | ||
---|---|---|---|---|
Power-supply voltage | VDD to GND | –0.3 | 6.5 | V |
Analog input voltage | INP, INN | HGND – 6 | VHLDO_OUT + 0.5 | V |
Analog output voltage | OUTP, OUTN | GND – 0.5 | VDD + 0.5 | V |
Digital output voltage | DIAG | GND – 0.5 | 6.5 | V |
Input current | Continuous, any pin except power-supply pins | –10 | 10 | mA |
Temperature | Junction, TJ | 150 | °C | |
Storage, Tstg | –65 | 150 |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) | ±2000 | V |
Charged device model (CDM), per JESD22-C101 (2) | ±1000 |
MIN | NOM | MAX | UNIT | |||
---|---|---|---|---|---|---|
POWER SUPPLY | ||||||
VDD | Low-side power supply | VDD to GND | 3 | 3.3 | 5.5 | V |
ANALOG INPUT | ||||||
VClipping | Differential input voltage before clipping output | VIN = VINP – VINN | ±64 | mV | ||
VFSR | Specified linear differential full-scale voltage | VIN = VINP – VINN | –50 | 50 | mV | |
Absolute common-mode input voltage (1) | (VINP + VINN) / 2 to HGND | –2 | VHLDO_OUT | V | ||
VCM | Operating common-mode input voltage | (VINP + VINN) / 2 to HGND | –0.032 | 1 | V | |
TEMPERATURE RANGE | ||||||
TA | Specified ambient temperature | –40 | 125 | °C |
THERMAL METRIC(1) | AMC3302 | UNIT | |
---|---|---|---|
DWE (SOIC) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 73.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 31 | °C/W |
RθJB | Junction-to-board thermal resistance | 44 | °C/W |
YJT | Junction-to-top characterization parameter | 16.7 | °C/W |
YJB | Junction-to-board characterization parameter | 42.8 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |