SBASB00 August   2024 AMC3306M25-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications 
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Timing Diagrams
    12. 5.12 Insulation Characteristics Curves
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Modulator
      3. 6.3.3 Isolation Channel Signal Transmission
      4. 6.3.4 Digital Output
        1. 6.3.4.1 Output Behavior in Case of a Full-Scale Input
        2. 6.3.4.2 Output Behavior in Case of a High-Side Supply Failure
      5. 6.3.5 Isolated DC/DC Converter
      6. 6.3.6 Diagnostic Output
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Digital Filter Usage
    2. 7.2 Typical Application
      1. 7.2.1 Onboard Charger (OBC) Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Shunt Resistor Sizing
          2. 7.2.1.2.2 Input Filter Design
          3. 7.2.1.2.3 Bitstream Filtering
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Best Design Practices
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2.2 Best Design Practices

Do not leave the inputs of the AMC3306M25-Q1 unconnected (floating) when the device is powered up. If left floating, the input bias currents potentially drive the inputs to a positive value that exceeds the operating common-mode input voltage. As a result, the output of the device is undetermined.

Connect the negative input (INN) to the high-side ground (HGND), either by a hard short or through a resistive path. A DC current path between INN and HGND is required to define the input common-mode voltage. Take care not to exceed the input common-mode range as specified in the Recommended Operating Conditions table. For best accuracy, route the ground connection as a separate trace. Connect this trace directly to the shunt resistor rather than shorting AGND to INN directly at the input to the device. See the Layout section for more details.

The high-side LDO is capable of sourcing a limited amount of current (IH) to power external circuitry. Do not to overload the high-side LDO and be aware of derating IH at high temperatures, as explained in the Isolated DC/DC Converter section.

The low-side LDO does not output a constant voltage and is not intended for powering any external circuitry. Do not connect any external load to the LDO_OUT pin.