SBASB00 August   2024 AMC3306M25-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications 
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Timing Diagrams
    12. 5.12 Insulation Characteristics Curves
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Modulator
      3. 6.3.3 Isolation Channel Signal Transmission
      4. 6.3.4 Digital Output
        1. 6.3.4.1 Output Behavior in Case of a Full-Scale Input
        2. 6.3.4.2 Output Behavior in Case of a High-Side Supply Failure
      5. 6.3.5 Isolated DC/DC Converter
      6. 6.3.6 Diagnostic Output
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Digital Filter Usage
    2. 7.2 Typical Application
      1. 7.2.1 Onboard Charger (OBC) Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Shunt Resistor Sizing
          2. 7.2.1.2.2 Input Filter Design
          3. 7.2.1.2.3 Bitstream Filtering
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Best Design Practices
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

AMC3306M25-Q1 DWE Package,16-Pin SOIC(Top View) Figure 4-1 DWE Package,16-Pin SOIC(Top View)
Table 4-1 Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
1 DCDC_OUT Power High-side output of the DC/DC converter; connect this pin to the HLDO_IN pin.(1)
2 DCDC_HGND High-side power ground High-side ground reference for the DC/DC converter; connect this pin to the HGND pin.
3 HLDO_IN Power Input of the high-side LDO; connect this pin to the DCDC_OUT pin.(1)
4 NC — No internal connection. Connect this pin to the high-side ground or leave unconnected (floating).
5 HLDO_OUT Power Output of the high-side LDO.(1)
6 INP Analog input Noninverting analog input. Make sure INP or INN has a DC current path to HGND to define the common-mode input voltage.(2)
7 INN Analog input Inverting analog input. Make sure INP or INN has a DC current path to HGND to define the common-mode input voltage.(2)
8 HGND High-side signal ground High-side analog signal ground; connect this pin to the DCDC_HGND pin.
9 GND Low-side signal ground Low-side analog signal ground; connect this pin to the DCDC_GND pin.
10 DOUT Digital output Modulator data output.
11 CLKIN Digital input Modulator clock input with an internal pulldown resistor (typical value: 1.5MΩ).
12 VDD Low-side power Low-side power supply.(1)
13 LDO_OUT Power Output of the low-side LDO; connect this pin to the DCDC_IN pin. Do not load the output of the LDO with external circuitry.(1)
14 DIAG Digital output Active-low, open-drain status indicator output. Connect this pin to the pullup supply (for example, VDD) using a resistor or leave this pin floating if not used.
15 DCDC_GND Low-side power ground Low-side ground reference for the DC/DC converter; connect this pin to the GND pin.
16 DCDC_IN Power Low-side input of the DC/DC converter; connect this pin to the LDO_OUT pin.(1)
(1) See the Power Supply Recommendations section for power-supply decoupling recommendations.
(2) See the Layout section for details.