SBASB00 August   2024 AMC3306M25-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications 
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Timing Diagrams
    12. 5.12 Insulation Characteristics Curves
    13. 5.13 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Modulator
      3. 6.3.3 Isolation Channel Signal Transmission
      4. 6.3.4 Digital Output
        1. 6.3.4.1 Output Behavior in Case of a Full-Scale Input
        2. 6.3.4.2 Output Behavior in Case of a High-Side Supply Failure
      5. 6.3.5 Isolated DC/DC Converter
      6. 6.3.6 Diagnostic Output
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Digital Filter Usage
    2. 7.2 Typical Application
      1. 7.2.1 Onboard Charger (OBC) Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Shunt Resistor Sizing
          2. 7.2.1.2.2 Input Filter Design
          3. 7.2.1.2.3 Bitstream Filtering
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Best Design Practices
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Isolation Channel Signal Transmission

The AMC3306M25-Q1 uses an on-off keying (OOK) modulation scheme, as shown in Figure 6-3, to transmit the modulator output bitstream across the SiO2-based isolation barrier. The transmit driver (TX) shown in the Functional Block Diagram transmits an internally generated, high-frequency carrier across the isolation barrier to represent a digital one. However, TX does not send a signal to represent a digital zero. The nominal frequency of the carrier used inside the AMC3306M25-Q1 is 480MHz.

The receiver (RX) on the other side of the isolation barrier recovers and demodulates the signal and produces the output. The AMC3306M25-Q1 transmission channel is optimized to achieve the highest level of common-mode transient immunity (CMTI). This channel is also optimized to achieve the lowest level of radiated emissions caused by the high-frequency carrier and RX/TX buffer switching.

AMC3306M25-Q1 OOK-Based
                    Modulation Scheme Figure 6-3 OOK-Based Modulation Scheme