SBASB00 August   2024 AMC3306M25-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications 
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Timing Diagrams
    12. 5.12 Insulation Characteristics Curves
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Modulator
      3. 6.3.3 Isolation Channel Signal Transmission
      4. 6.3.4 Digital Output
        1. 6.3.4.1 Output Behavior in Case of a Full-Scale Input
        2. 6.3.4.2 Output Behavior in Case of a High-Side Supply Failure
      5. 6.3.5 Isolated DC/DC Converter
      6. 6.3.6 Diagnostic Output
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Digital Filter Usage
    2. 7.2 Typical Application
      1. 7.2.1 Onboard Charger (OBC) Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Shunt Resistor Sizing
          2. 7.2.1.2.2 Input Filter Design
          3. 7.2.1.2.3 Bitstream Filtering
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Best Design Practices
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3 Power Supply Recommendations

The AMC3306M25-Q1 is powered from the low-side power supply (VDD) with a nominal value of 3.3V or 5V. Place a low-ESR, 1nF decoupling capacitor (C8 in Figure 7-4) as close as possible to the VDD pin. Follow the 1nF capacitor with a 1µF capacitor (C9) to filter this power-supply path.

Decouple the low side of the DC/DC converter with a low-ESR, 100nF capacitor (C4) positioned close to the device between the DCDC_IN and DCDC_GND pins. Use a 1µF capacitor (C2) to decouple the high side. Additionally, place a low-ESR, 1nF capacitor (C3) as close as possible to the device and connect this capacitor to the DCDC_OUT and DCDC_HGND pins.

For the high-side LDO, use low-ESR, 1nF capacitors (C6), placed as close as possible to the AMC3306M25-Q1, followed by a 100nF decoupling capacitor (C5).

The ground reference for the high side (HGND) is derived from the terminal of the shunt resistor connected to the device negative input (INN). For best DC accuracy, use a separate trace to make this connection instead of shorting HGND to INN directly at the device input. The high-side DC/DC ground terminal (DCDC_HGND) is shorted to HGND directly at the device pins.

AMC3306M25-Q1 Decoupling the AMC3306M25-Q1 Figure 7-4 Decoupling the AMC3306M25-Q1

Make sure capacitors provide adequate effective capacitance under the applicable DC bias conditions experienced in the application. MLCC capacitors typically exhibit only a fraction of the nominal capacitance under real-world conditions; take this factor into consideration when selecting these capacitors. This problem is especially acute in low-profile capacitors, in which the dielectric field strength is higher than in taller components. Reputable capacitor manufacturers provide capacitance versus DC bias curves that greatly simplify component selection.

The Best Practices to Attenuate AMC3301 Family Radiated Emissions EMI application note is available for download at www.ti.com.

Table 7-2 lists recommended components for use with the AMC3306M25-Q1. This list is not exhaustive. Other components potentially exist that are equally capable (or better), however these listed components have been validated during the development of the AMC3306M25-Q1.

Table 7-2 Recommended External Components
DESCRIPTION PART NUMBER MANUFACTURER SIZE (EIA, L × W)
VDD
C8 1nF ± 10%, X7R, 50V 12065C102KAT2A(1) AVX 1206, 3.2mm × 1.6mm
C0603C102K5RACTU Kemet 0603, 1.6mm × 0.8mm
C9 1µF ± 10%, X7R, 25V 12063C105KAT2A(1) AVX 1206, 3.2mm × 1.6mm
CGA3E1X7R1E105K080AC TDK 0603, 1.6mm × 0.8mm
DC/DC CONVERTER
C4 100nF ± 10%, X7R, 50V C0603C104K5RACAUTO Kemet 0603, 1.6mm × 0.8mm
C3 1nF ± 10%, X7R, 50V C0603C102K5RACTU Kemet 0603, 1.6mm × 0.8mm
C2 1µF ± 10%, X7R, 25V CGA3E1X7R1E105K080AC TDK 0603, 1.6mm × 0.8mm
HLDO
C1 100nF ± 10%, X7R, 50V C0603C104K5RACAUTO Kemet 0603, 1.6mm × 0.8mm
C5 100nF ± 5%, NP0, 50V C3216NP01H104J160AA(1) TDK 1206, 3.2mm × 1.6mm
100nF ± 10%, X7R, 50V C0603C104K5RACAUTO Kemet 0603, 1.6mm × 0.8mm
C6 1nF ± 10%, X7R, 50V 12065C102KAT2A(1) AVX 1206, 3.2mm × 1.6mm
C0603C102K5RACTU Kemet 0603, 1.6mm × 0.8mm
FERRITE BEADS
FB1,FB2, FB3 Ferrite bead(2) 74269244182 Wurth Elektronik 0402, 1.0mm × 0.5mm
BLM15HD182SH1 Murata 0402, 1.0mm × 0.5mm
BKH1005LM182-T Taiyo Yuden 0402, 1.0mm × 0.5mm
(1) Component used for parametric validation.
(2) No ferrite beads used for parametric validation.