SBASA35B June   2020  – September 2024 AMC3330-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications 
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Timing Diagram
    12. 5.12 Insulation Characteristics Curves
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Isolation Channel Signal Transmission
      3. 6.3.3 Analog Output
      4. 6.3.4 Isolated DC/DC Converter
      5. 6.3.5 Diagnostic Output and Fail-Safe Behavior
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Filter Design
        2. 7.2.2.2 Differential to Single-Ended Output Conversion
      3. 7.2.3 Application Curve
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Power Supply Recommendations

The AMC3330-Q1 is powered from the low-side power supply (VDD) with a nominal value of 3.3 V (or 5 V). TI recommends a low-ESR decoupling capacitor of 1 nF (C8 in Figure 7-5) placed as close as possible to the VDD pin, followed by a 1-µF capacitor (C9) to filter this power-supply path.

The low-side of the DC/DC converter is decoupled with a low-ESR 100-nF capacitor (C4) positioned close to the device between the DCDC_IN and DCDC_GND pins. Use a 1-µF capacitor (C2) to decouple the high-side in addition to a low-ESR, 1-nF capacitor (C3) placed as close as possible to the device and connected to the DCDC_OUT and DCDC_HGND pins.

For the high-side LDO, use low-ESR capacitors of 1-nF (C6), placed as close as possible to the AMC3330-Q1, followed by a 100-nF decoupling capacitor (C5).

The ground reference for the high-side (HGND) is derived from the terminal of the sense resistor which is connected to the negative input (INN) of the device. For best DC accuracy, use a separate trace to make this connection but shorting HGND to INN directly at the device input is also acceptable. The high-side DC/DC ground terminal(DCDC_HGND) is shorted to HGND directly at the device pins.

AMC3330-Q1 Decoupling the AMC3330-Q1 Figure 7-5 Decoupling the AMC3330-Q1

Capacitors must provide adequate effective capacitance under the applicable DC bias conditions they experience in the application. Multilayer ceramic capacitors (MLCC) capacitors typically exhibit only a fraction of their nominal capacitance under real-world conditions and this factor must be taken into consideration when selecting these capacitors. This problem is especially acute in low-profile capacitors, in which the dielectric field strength is higher than in taller components. Reputable capacitor manufacturers provide capacitance versus DC bias curves that greatly simplify component selection.

The Best Practices to Attenuate AMC3301 Family Radiated Emissions EMI application note is available for download at www.ti.com.

Table 7-3 lists components suitable for use with the AMC3330-Q1. This list is not exhaustive. Other components may exist that are equally suitable (or better), however these listed components have been validated during the development of the AMC3330-Q1.

Table 7-3 Recommended External Components
DESCRIPTION PART NUMBER MANUFACTURER SIZE (EIA, L x W)
VDD
C8 1 nF ± 10%, X7R, 50 V 12065C102KAT2A AVX 1206, 3.2 mm x 1.6 mm
C9 1 µF ± 10%, X7R, 25 V 12063C105KAT2A AVX 1206, 3.2 mm x 1.6 mm
DC/DC CONVERTER
C4 100 nF ± 10%, X7R, 50 V C0603C104K5RACAUTO Kemet 0603, 1.6 mm x 0.8 mm
C3 1 nF ± 10%, X7R, 50 V C0603C102K5RACTU Kemet 0603, 1.6 mm x 0.8 mm
C2 1 µF ± 10%, X7R, 25 V CGA3E1X7R1E105K080AC TDK 0603, 1.6 mm x 0.8 mm
HLDO
C1 100 nF ± 10%, X7R, 50 V C0603C104K5RACAUTO Kemet 0603, 1.6 mm x 0.8 mm
C5 100 nF ± 5%, NP0, 50 V C3216NP01H104J160AA TDK 1206, 3.2 mm x 1.6 mm
C6 1 nF ± 10%, X7R, 50 V 12065C102KAT2A AVX 1206, 3.2 mm x 1.6 mm
FERRITE BEADS
FB1, FB2, FB3 Ferrite bead(1) 74269244182 Wurth Elektronik 0402, 1.0mm × 0.5mm
BLM15HD182SH1 Murata 0402, 1.0mm × 0.5mm
BKH1005LM182-T Taiyo Yuden 0402, 1.0mm × 0.5mm
(1) No ferrite beads are used for parametric validation.