SBASA35B June   2020  – September 2024 AMC3330-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications 
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Timing Diagram
    12. 5.12 Insulation Characteristics Curves
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Isolation Channel Signal Transmission
      3. 6.3.3 Analog Output
      4. 6.3.4 Isolated DC/DC Converter
      5. 6.3.5 Diagnostic Output and Fail-Safe Behavior
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Filter Design
        2. 7.2.2.2 Differential to Single-Ended Output Conversion
      3. 7.2.3 Application Curve
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)
MIN NOM MAX UNIT
POWER SUPPLY
VDD Low-side supply voltage VDD to GND 3.0 3.3 5.5 V
ANALOG INPUT
VClipping Differential input voltage before clipping output VIN = VINP – VINN ±1.25 V
VFSR Specified linear differential full-scale voltage VIN = VINP – VINN –1 1 V
Absolute common-mode input voltage(1) (VINP + VINN) / 2 to HGND –2 3 V
VCM Operating common-mode input voltage (VINP + VINN) / 2 to HGND,
VINP = VINN		 –1.4 1.6 V
(VINP + VINN) / 2 to HGND,
|VINP – VINN| = 1.0 V (2)		 –0.925 0.725
(VINP + VINN) / 2 to HGND,
|VINP – VINN| = 1.25 V		 –0.8 0.6
ANALOG OUTPUT
CLOAD Capacitive load On OUTP or OUTN to GND2, Without any series resistance 500 pF
CLOAD Capacitive load OUTP to OUTN, Without any series resistance 250 pF
RLOAD Resistive load On OUTP or OUTN to GND2 10 1 kΩ
DIGITAL OUTPUT
Pull-up supply-voltage for DIAG pin 0 VDD V
TEMPERATURE RANGE
TA Operating ambient temperature –40 25 125 °C
(1) Steady-state voltage supported by the device in case of a system failure. See specified common-mode input voltage VCM for normal operation. Observe analog input voltage range as specified in the Absolute Maximum Ratings table.
(2) Linear response.