SLASFK0 August   2024 AMC6V704

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device and Documentation Support
    1. 4.1 Receiving Notification of Documentation Updates
    2. 4.2 Support Resources
    3. 4.3 Trademarks
    4. 4.4 Electrostatic Discharge Caution
    5. 4.5 Glossary
  6. 5Revision History
  7. 6Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|36
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.3 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.