SLAS972B November   2014  – March 2016 AMC7834

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics—DAC Specifications
    6. 6.6  Electrical Characteristics—ADC, Current and Temperature Sensor Specifications
    7. 6.7  Electrical Characteristics—General Specifications
    8. 6.8  Serial Interface Timing Requirements
    9. 6.9  Switching Characteristics—DAC Specifications
    10. 6.10 Switching Characteristics—ADC, Current and Temperature Sensor Specifications
    11. 6.11 Switching Characteristics—General Specifications
    12. 6.12 Typical Characteristics
      1. 6.12.1 Typical Characteristics: DAC
      2. 6.12.2 Typical Characteristics: ADC
      3. 6.12.3 Typical Characteristics: Current Sense
      4. 6.12.4 Typical Characteristics: Temperature Sensor
      5. 6.12.5 Typical Characteristics: Reference
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converters (DACs)
        1. 7.3.1.1 DAC Configuration
          1. 7.3.1.1.1 Bipolar DACs (DAC1, DAC2, DAC3, and DAC4)
          2. 7.3.1.1.2 Auxiliary DACs (AUXDAC1, AUXDAC2, AUXDAC3, and AUXDAC4)
        2. 7.3.1.2 DAC Register Structure
        3. 7.3.1.3 DAC Clamp Operation
      2. 7.3.2 Analog-to-Digital Converter (ADC)
        1. 7.3.2.1 External Analog Inputs
        2. 7.3.2.2 Internal Bipolar DAC Monitoring Inputs
        3. 7.3.2.3 ADC Sequencing
      3. 7.3.3 Temperature Sensors
        1. 7.3.3.1 Internal Temperature Sensor
        2. 7.3.3.2 Remote Temperature Sensors
      4. 7.3.4 Current Sensors
      5. 7.3.5 Drain Switch Control
      6. 7.3.6 Programmable Out-of-Range Alarms
        1. 7.3.6.1 ADC Internal Monitoring Input Out-of-Range Alarm
        2. 7.3.6.2 Current-Sense Out-of-Range Alarm
        3. 7.3.6.3 Temperature Sensors Out-of-Range Alarm
        4. 7.3.6.4 Bipolar DACs High Alarm
        5. 7.3.6.5 AVSS Detection Alarm
        6. 7.3.6.6 AVDD Detection Alarm
        7. 7.3.6.7 Hysteresis
        8. 7.3.6.8 False-Alarm Protection
      7. 7.3.7 Reference Specifications
        1. 7.3.7.1 Internal Reference Operation
        2. 7.3.7.2 External Reference Operation
      8. 7.3.8 General Purpose I/Os
    4. 7.4 Device Functional Modes
      1. 7.4.1 Open-Loop Mode
      2. 7.4.2 Closed-Loop Mode
    5. 7.5 Programming
    6. 7.6 Register Maps
      1. 7.6.1  Power Mode: Address 0x02
        1. 7.6.1.1 Power Mode Register (address = 0x02) [reset = 0x000]
      2. 7.6.2  Device Identification: Address 0x04 through 0x0C
        1. 7.6.2.1 Device ID Register (address = 0x04) [reset = 0x0C34]
        2. 7.6.2.2 Version ID Register (address = 0x06) [reset = 0x0001]
        3. 7.6.2.3 Vendor ID Register (address = 0x0C) [reset = 0x0451]
      3. 7.6.3  General Device Configuration: Address 0x10 through 0x16
        1. 7.6.3.1 AMC Configuration 0 Register (address = 0x10) [reset = 0x0300]
        2. 7.6.3.2 AMC Configuration 1 Register (address = 0x11) [reset = 0x036A]
        3. 7.6.3.3 ADC MUX Register (address = 0x12) [reset = 0x0000]
        4. 7.6.3.4 Closed Loop Settling Time Register (address = 0x14) [reset = 0x2222]
        5. 7.6.3.5 DAC Sync Register (address = 0x15) [reset = 0x0000]
        6. 7.6.3.6 DAC Range Register (address = 0x16) [reset = 0x0000]
      4. 7.6.4  Clamp and Alarm Configuration: Address 0x17 through 0x1B
        1. 7.6.4.1 CLAMP Configuration Register (address = 0x17) [reset = 0x003F]
        2. 7.6.4.2 SLEEP1 Configuration Register (address = 0x18) [reset = 0xFF00]
        3. 7.6.4.3 SLEEP2 Configuration Register (address = 0x19) [reset = 0xFF00]
        4. 7.6.4.4 ALARMOUT Clamp Register (address = 0x1A) [reset = 0x0000]
        5. 7.6.4.5 ALARMOUT Configuration Register (address = 0x1B) [reset = 0x0000]
      5. 7.6.5  Conversion Trigger: Address 0x1C
        1. 7.6.5.1 DAC and ADC Trigger Register (address = 0x1C) [reset = 0x0000]
      6. 7.6.6  Reset: Address 0x1D
        1. 7.6.6.1 Software Reset Register (address = 0x1D) [reset = 0x0000]
      7. 7.6.7  Device Status: Address 0x1E and 0x1F
        1. 7.6.7.1 Alarm Status Register (address = 0x1E) [reset = 0x0000]
        2. 7.6.7.2 General Status Register (address = 0x1F) [reset = 0x0000]
      8. 7.6.8  ADC Data: Address 0x20 through 0x2F
        1. 7.6.8.1 ADCn-Internal-Data Register (address = 0x20 to 0x23) [reset = 0x0000]
        2. 7.6.8.2 ADCn-External-Data Register (address = 0x24 to 0x27) [reset = 0x0000]
        3. 7.6.8.3 CSn-Data Register (address = 0x28 to 0x2B) [reset = 0x0000]
        4. 7.6.8.4 LT-Data Register (address = 0x2D) [reset = 0x0000]
        5. 7.6.8.5 RTn-Data Register (address = 0x2E to 0x2F) [reset = 0x0000]
      9. 7.6.9  DAC Data: Address 0x30 through 0x37
        1. 7.6.9.1 DACn-Data Register (address = 0x30 to 0x33) [reset = 0x0000]
        2. 7.6.9.2 AUXDACn-Data Register (address = 0x34 to 0x37) [reset = 0x0000]
      10. 7.6.10 Closed-Loop Control: Address 0x38 through 0x3B
        1. 7.6.10.1 ClosedLoopn Register (address = 0x38 to 0x3B) [reset = 0x0000]
      11. 7.6.11 Alarm Threshold Configuration: Address 0x40 through 0x4F
        1. 7.6.11.1 ADCINTn/CSn-Upper-Threshold Register (address = 0x40, 0x42, 0x44 and 0x46) [reset = 0x0FFF]
        2. 7.6.11.2 ADCINTn/CSn-Lower-Threshold Register (address = 0x41, 0x43, 0x45 and 0x47) [reset = 0x0000]
        3. 7.6.11.3 TS-Upper-Threshold Register (address = 0x48, 0x4A and 0x4C) [reset = 0x07FF]
        4. 7.6.11.4 TS-Lower-Threshold Register (address = 0x49, 0x4B and 0x4D) [reset = 0x0800]
        5. 7.6.11.5 DACnn-Upper-Threshold Register (address = 0x4E and 0x4F) [reset = 0x0FFF]
      12. 7.6.12 Alarm Hysteresis Configuration: Address 0x50 and 0x56
        1. 7.6.12.1 ADCINTn/CSn-Hysteresis Register (address = 0x50 to 0x53) [reset = 0x0008]
        2. 7.6.12.2 LT-Hysteresis Register (address = 0x54) [reset = 0x0008]
        3. 7.6.12.3 RTn-Hysteresis Register (address = 0x55 to 0x56) [reset = 0x0008]
      13. 7.6.13 GPIO: Address 0x58
        1. 7.6.13.1 GPIO Register (address = 0x58) [reset = 0x000F]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 ADC Input Conditioning
        2. 8.2.2.2 DAC Output Range Selection
        3. 8.2.2.3 Temperature Sensing Applications
        4. 8.2.2.4 Current Sensing Applications
      3. 8.2.3 Application Performance Curve
    3. 8.3 Initialization Set Up
      1. 8.3.1 Initialization Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

  • All power supply pins should be bypassed to ground with a low-ESR ceramic bypass capacitor. The typical recommended bypass capacitance has a value of 0.1 µF and is ceramic with a X7R or NP0 dielectric.
  • A 4.7 µF capacitor is recommended between the REF_CMP pin and the AGND4 pin. A minimum capacitor value of 470 nF is required to ensure stability.
  • A high-quality ceramic capacitor, type NP0 or X7R, is recommended because of the optimal performance of the capacitor across temperature and very-low dissipation factor.
  • The digital and analog sections should have proper placement with respect to the digital pins and analog pins of the AMC7834 device (see Figure 110). The separation of analog and digital blocks allows for better design and practice as it ensures less coupling into neighboring blocks and minimizes the interaction between analog and digital return currents.

10.2 Layout Example

AMC7834 layout_slas972.gif Figure 109. AMC7834 Layout Example
AMC7834 layout_component_placement_slas972.gif Figure 110. AMC7834 Example Board Layout — Component Placement