SLAS986D November   2014  – February 2018 AMC7836

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: DAC
    6. 6.6  Electrical Characteristics: ADC and Temperature Sensor
    7. 6.7  Electrical Characteristics: General
    8. 6.8  Timing Requirements
    9. 6.9  Typical Characteristics: DAC
    10. 6.10 Typical Characteristics: ADC
    11. 6.11 Typical Characteristics: Reference
    12. 6.12 Typical Characteristics: Temperature Sensor
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converters (DACs)
        1. 7.3.1.1 DAC Output Range and Clamp Configuration
          1. 7.3.1.1.1 Auto-Range Detection
        2. 7.3.1.2 DAC Register Structure
        3. 7.3.1.3 DAC Clear Operation
      2. 7.3.2 Analog-to-Digital Converter (ADC)
        1. 7.3.2.1 Analog Inputs
          1. 7.3.2.1.1 Bipolar Analog Inputs
          2. 7.3.2.1.2 Unipolar Analog Inputs
        2. 7.3.2.2 ADC Sequencing
        3. 7.3.2.3 ADC Synchronization
        4. 7.3.2.4 Programmable Out-of-Range Alarms
          1. 7.3.2.4.1 Unipolar Inputs Out-of-Range Alarms
          2. 7.3.2.4.2 Unipolar Inputs Out-of-Range Alarms
          3. 7.3.2.4.3 ALARMIN Alarm
          4. 7.3.2.4.4 Hysteresis
          5. 7.3.2.4.5 False-Alarm Protection
      3. 7.3.3 Internal Temperature Sensor
      4. 7.3.4 Internal Reference
      5. 7.3.5 General Purpose I/Os
    4. 7.4 Device Functional Modes
      1. 7.4.1 All-Positive DAC Range Mode
      2. 7.4.2 All-Negative DAC Range Mode
      3. 7.4.3 Mixed DAC Range Mode
    5. 7.5 Programming
    6. 7.6 Register Maps
      1. 7.6.1  Interface Configuration: Address 0x00 – 0x02
        1. 7.6.1.1 Interface Configuration 0 Register (address = 0x00) [reset = 0x30]
          1. Table 9. Interface Config 0 Register Field Descriptions (R/W)
        2. 7.6.1.2 Interface Configuration 1 Register (address = 0x01) [reset = 0x00]
          1. Table 10. Interface Config 1 Register Field Descriptions
        3. 7.6.1.3 Device Configuration Register (address = 0x02) [reset = 0x03]
          1. Table 11. Device Config Register Field Descriptions
      2. 7.6.2  Device Identification: Address 0x03 – 0x0D
        1. 7.6.2.1 Chip Type Register (address = 0x03) [reset = 0x08]
          1. Table 12. Chip Type Register Field Descriptions
        2. 7.6.2.2 Chip ID Low Byte Register (address = 0x04) [reset = 0x36]
          1. Table 13. Chip ID Low Byte Register Field Descriptions
        3. 7.6.2.3 Chip ID High Byte Register (address = 0x05) [reset = 0x0C]
          1. Table 14. Chip ID High Byte Register Field Descriptions
        4. 7.6.2.4 Version ID Register (address = 0x06) [reset = 0x00]
          1. Table 15. Version ID Register Field Descriptions
        5. 7.6.2.5 Manufacturer ID Low Byte Register (address = 0x0C) [reset = 0x51]
          1. Table 16. Manufacturer ID Low Byte Register Field Descriptions
        6. 7.6.2.6 Manufacturer ID High Byte Register (address = 0x0D) [reset = 0x04]
          1. Table 17. Manufacturer ID High Byte Register Field Descriptions
      3. 7.6.3  Register Update (Buffered Registers): Address 0x0F
        1. 7.6.3.1 Register Update Register (address = 0x0F) [reset = 0x00]
          1. Table 18. Register Update Register Field Descriptions
      4. 7.6.4  General Device Configuration: Address 0x10 through 0x17
        1. 7.6.4.1 ADC Configuration Register (address = 0x10) [reset = 0x00]
          1. Table 19. ADC Configuration Register Field Descriptions
        2. 7.6.4.2 False Alarm Configuration Register (address = 0x11) [reset = 0x70]
          1. Table 21. False Alarm Configuration Register Field Descriptions
        3. 7.6.4.3 GPIO Configuration Register (address = 0x12) [reset = 0x00]
          1. Table 24. GPIO Configuration Register Field Descriptions
        4. 7.6.4.4 ADC MUX Configuration 0 Register (address = 0x13) [reset = 0x00]
          1. Table 25. ADC MUX Configuration 0 Register Field Descriptions
        5. 7.6.4.5 ADC MUX Configuration 1 Register (address = 0x14) [reset = 0x00]
          1. Table 26. ADC MUX Configuration 1 Register Field Descriptions
        6. 7.6.4.6 ADC MUX Configuration 2 Register (address = 0x15) [reset = 0x00]
          1. Table 27. ADC MUX Configuration 2 Register Field Descriptions
        7. 7.6.4.7 DAC Clear Enable 0 Register (address = 0x18) [reset = 0x00]
          1. Table 28. DAC Clear Enable 0 Register Field Descriptions
        8. 7.6.4.8 DAC Clear Enable 1 Register (address = 0x19) [reset = 0x00]
          1. Table 29. DAC Clear Enable 1 Register Field Descriptions
      5. 7.6.5  DAC Clear and ALARMOUT Source Select: Address 0x1A through 0x1D
        1. 7.6.5.1 DAC Clear Source 0 Register (address = 0x1A) [reset = 0x00]
          1. Table 30. DAC Clear Source 0 Register Field Descriptions
        2. 7.6.5.2 DAC Clear Source 1 Register (address = 0x1B) [reset = 0x00]
          1. Table 31. DAC Clear Source 1 Register Field Descriptions
        3. 7.6.5.3 ALARMOUT Source 0 Register (address = 0x1c) [reset = 0x00]
          1. Table 32. ALARMOUT Source 0 Register Field Descriptions
        4. 7.6.5.4 ALARMOUT Source 1 Register (address = 0x1D) [reset = 0x00]
          1. Table 33. ALARMOUT Source 1 Register Field Descriptions
      6. 7.6.6  DAC Range: Address 0x1E
        1. 7.6.6.1 DAC Range Register (address = 0x1E) [reset = 0x00]
          1. Table 34. DAC Range Register Field Descriptions
        2. 7.6.6.2 DAC Range 1 Register (address = 0x1F) [reset = 0x00]
          1. Table 36. DAC Range 1 Register Field Descriptions
      7. 7.6.7  ADC and Temperature Data: Address 0x20 through 0x4B
        1. 7.6.7.1 ADCn-Data (Low Byte) Register (address = 0x20 through 0x49) [reset = 0x00]
          1. Table 37. ADCn-Data (Low Byte) Register Field Descriptions
        2. 7.6.7.2 ADCn-Data (High Byte) Register (address = 0x20 through 0x49) [reset = 0x00]
          1. Table 38. ADCn-Data (High Byte) Register Field Descriptions
        3. 7.6.7.3 Temperature Data (Low Byte) Register (address = 0x4A) [reset = 0x00]
          1. Table 39. Temperature Data (Low Byte) Register Field Descriptions
        4. 7.6.7.4 Temperature Data (High Byte) Register (address = 0x4B) [reset = 0x00]
          1. Table 40. Temperature Data (High Byte) Register Field Descriptions
      8. 7.6.8  DAC Data: Address 0x50 through 0x6F
        1. 7.6.8.1 DACn-Data (Low Byte) Register (address = 0x50 through 0x6F) [reset = 0x00]
          1. Table 41. DACn-Data (Low Byte) Register Field Descriptions
        2. 7.6.8.2 DACn Data (High Byte) Register (address = 0x50 through 0x6F) [reset = 0x00]
          1. Table 42. DACn Data (High Byte) Register Field Descriptions
      9. 7.6.9  Status Registers: Address 0x70 through 0x72
        1. 7.6.9.1 Alarm Status 0 Register (address = 0x70) [reset = 0x00]
          1. Table 43. Alarm Status 0 Register Field Descriptions
        2. 7.6.9.2 Alarm Status 1 Register (address = 0x71) [reset = 0x00]
          1. Table 44. Alarm Status 1 Register Field Descriptions
        3. 7.6.9.3 General Status Register (address = 0x72) [reset = 0x0C]
          1. Table 45. General Status Register Field Descriptions
      10. 7.6.10 GPIO: Address 0x7A
        1. 7.6.10.1 GPIO Register (address = 0x7A) [reset = 0xFF]
          1. Table 46. GPIO Register Field Descriptions
      11. 7.6.11 Out-Of-Range ADC Thresholds: Address 0x80 through 0x93
        1. 7.6.11.1 ADCn-Upper-Thresh (Low Byte) Register (address = 0x80 through 0x93) [reset = 0xFF]
          1. Table 47. ADCn-Upper-Thresh (Low Byte) Register Field Descriptions
        2. 7.6.11.2 ADCn-Upper-Thresh (High Byte) Register (address = 0x80 through 0x93) [reset = 0x0F]
          1. Table 48. ADCn-Upper-Thresh (High Byte) Register Field Descriptions
        3. 7.6.11.3 ADCn-Lower-Thresh (Low Byte) Register (address = 0x80 through 0x93) [reset = 0x00]
          1. Table 49. ADCn-Lower-Thresh (Low Byte) Register Field Descriptions
        4. 7.6.11.4 ADCn-Lower-Thresh (High Byte) Register (address = 0x80 through 0x93) [reset = 0x00]
          1. Table 50. ADCn-Lower-Thresh (High Byte) Register Field Descriptions Field Descriptions
        5. 7.6.11.5 LT-Upper-Thresh (Low Byte) Register (address = 0x94) [reset = 0xFF]
          1. Table 51. LT-Upper-Thresh (Low Byte) Register Field Descriptions
        6. 7.6.11.6 LT-Upper-Thresh (High Byte) Register (address = 0x95) [reset = 0x07]
          1. Table 52. LT-Upper-Thresh (High Byte) Register Field Descriptions
        7. 7.6.11.7 LT-Lower-Thresh (Low Byte) Register (address = 0x96) [reset = 0x00]
          1. Table 53. LT-Lower-Thresh (Low Byte) Register Field Descriptions
        8. 7.6.11.8 LT-Lower-Thresh (High Byte) Register (address = 0x97) [reset = 0x08]
          1. Table 54. LT-Lower-Thresh (High Byte) Register Field Descriptions
      12. 7.6.12 Alarm Hysteresis Configuration: Address 0xA0 and 0xA5
        1. 7.6.12.1 ADCn-Hysteresis Register (address = 0xA0 through 0xA4) [reset = 0x08]
          1. Table 55. ADCn-Hysteresis Register Field Descriptions
        2. 7.6.12.2 LT-Hysteresis Register (address = 0xA5) [reset = 0x08]
          1. Table 56. LT-Hysteresis Register Field Descriptions
      13. 7.6.13 Clear and Power-Down Registers: Address 0xB0 through 0XB4
        1. 7.6.13.1 DAC Clear 0 Register (address = 0xB0) [reset = 0x00]
          1. Table 57. DAC Clear 0 Register Field Descriptions
        2. 7.6.13.2 DAC Clear 1 Register (address = 0xB1) [reset = 0x00]
          1. Table 58. DAC Clear 1 Register Field Descriptions
        3. 7.6.13.3 Power-Down 0 Register (address = 0xB2) [reset = 0x00]
          1. Table 59. Power-Down 0 Register Field Descriptions
        4. 7.6.13.4 Power-Down 1 Register (address = 0xB3) [reset = 0x00]
          1. Table 60. Power-Down 1 Register Field Descriptions
        5. 7.6.13.5 Power-Down 2 Register (address = 0xB4) [reset = 0x00]
          1. Table 61. Power-Down 2 Register Field Descriptions
      14. 7.6.14 ADC Trigger: Address 0xC0
        1. 7.6.14.1 ADC Trigger Register (address = 0xC0) [reset = 0x00]
          1. Table 62. ADC Trigger Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Temperature Sensing Applications
      2. 8.1.2 Current Sensing Applications
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 ADC Input Conditioning
        2. 8.2.2.2 DAC Output Range Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Device Reset Options
      1. 9.1.1 Power-on-Reset (POR)
      2. 9.1.2 Hardware Reset
        1. 9.1.2.1 Software Reset
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

PAP Package
64-Pin HTQFP With Exposed Thermal Pad
Top View
AMC7836 po_64_pap_slas986.gif

Pin Functions

PINDESCRIPTION
NAMENO.I/O
ADC_0 47 I Bipolar analog inputs. These pins are typically used to monitor the DAC group-C outputs. The input range of these channels is –12.5 to 12.5 V.
ADC_1 46 I
ADC_2 45 I
ADC_3 44 I
ADC_4 43 I Bipolar analog inputs. These pins are typically used to monitor the DAC group-D outputs. The input range of these channels is –12.5 to 12.5 V.
ADC_5 42 I
ADC_6 41 I
ADC_7 40 I
ADC_8 34 I Bipolar analog inputs. These pins are typically used to monitor the DAC group-B outputs. The input range of these channels is –12.5 to 12.5 V.
ADC_9 33 I
ADC_10 32 I
ADC_11 31 I
ADC_12 30 I Bipolar analog inputs. These pins are typically used to monitor the DAC group-A outputs. The input range of these channels is –12.5 to 12.5 V.
ADC_13 29 I
ADC_14 28 I
ADC_15 27 I
AGND1 21 I Analog ground. These pins are the ground reference point for all analog circuitry on the device. Connect the AGND1, AGND2, and AGND3 pins to the same potential (AGND). Ideally, the analog and digital grounds should be at the same potential (GND) and must not differ by more than ±0.3 V.
AGND2 48 I
AGND3 56 I
AVCC_AB 20 I Positive analog power for DAC groups A and B. The AVCC_AB and AVCC_CD pins must be connected to the same potential (AVCC).
AVCC_CD 57 I Positive analog power for DAC groups C and D. The AVCC_AB and AVCC_CD pins must be connected to the same potential (AVCC).
AVDD 50 I Analog supply voltage (4.7 V to 5.5 V). This pin must have the same value as the DVDD pin.
AVEE 17 I Lowest potential in the system. This pin is typically tied to a negative supply voltage but if all DACs are set in a positive output range, this pin can be connected to the analog ground. This pin also acts as the negative analog supply for DAC group A. This pin sets the power-on-reset and clamp voltage values for the DAC group A.
AVSSB 24 I Negative analog supply for DAC group B. This pin sets the power-on-reset and clamp voltage values for the DAC group B. This pin is typically tied to the AVEE pin for the negative output ranges or AGND for the positive output ranges.
AVSSC 53 I Negative analog supply for DAC group C. This pin sets the power-on-reset and clamp voltage values for the DAC group C. This pin is typically tied to the AVEE pin for the negative output ranges or AGND for the positive output ranges.
AVSSD 60 I Negative analog supply for DAC group D. This pin sets the power-on-reset and clamp voltage values for the DAC group D. This pin is typically tied to the AVEE pin for the negative output ranges or AGND for the positive output ranges.
CS 6 I Active-low serial-data enable. This input is the frame-synchronization signal for the serial data. When this signal goes low, it enables the serial interface input shift register.
DAC_A0 15 O DAC group A. These DAC channels share the same range and clamp voltage. If any of the other DAC groups is in a negative voltage range, DAC group A should be in a negative voltage range as well.
DAC_A1 16 O
DAC_A2 18 O
DAC_A3 19 O
DAC_B4 22 O DAC group B. These DAC channels share the same range and clamp voltage.
DAC_B5 23 O
DAC_B6 25 O
DAC_B7 26 O
DAC_C8 51 O DAC group C. These DAC channels share the same range and clamp voltage.
DAC_C9 52 O
DAC_C10 54 O
DAC_C11 55 O
DAC_D12 58 O DAC group D. These DAC channels share the same range and clamp voltage.
DAC_D13 59 O
DAC_D14 61 O
DAC_D15 62 O
DGND 64 I Digital ground. This pin is the ground reference point for all digital circuitry on the device. Ideally, the analog and digital grounds should be at the same potential (GND) and must not differ by more than ±0.3 V.
DVDD 63 I Digital supply voltage (4.7 V to 5.5 V). This pin must have the same value as the AVDD pin.
GPIO0/ALARMIN 7 I/O General-purpose digital I/O 0 (default). This pin is a bidirectional digital input/output (I/O) with an internal 48-kΩ pullup resistor to the IOVDD pin. Alternatively the pin can be set to operate as the digital input ALARMIN which is an active-low alarm-control signal. If unused this pin can be left floating.
GPIO0/ALARMOUT 8 I/O General purpose digital I/O 1 (default). This pin is a bidirectional digital I/O with an internal 48-kΩ pullup resistor to the IOVDD pin. Alternatively the pin can be set to operate as ALARMOUT which is an open drain global alarm output. This pin goes low (active) when an alarm event is detected. If unused this pin can be left floating.
GPIO2/ADCTRIG 9 I/O General purpose digital I/O 2 (default). This pin is a bidirectional digital I/O with internal 48-kΩ pullup resistor to the IOVDD pin. Alternatively the pin can be set to operate as ADCTRIG which is an active-low external conversion trigger. The falling edge of this pin begins the sampling and conversion of the ADC. If unused this pin can be left floating.
GPIO3/DAV 10 I/O General purpose digital I/O 3 (default). This pin is a bidirectional digital I/O with internal 48-kΩ pullup resistor to the IOVDD pin. Alternatively the pin can be set to operate as DAV which is an active-low data-available indicator output. In direct mode, the DAV pin goes low (active) when the conversion ends. In auto mode, a 1-µs pulse (active low) appears on this pin when a conversion cycle finishes. The DAV pin remains high when deactivated. If unused this pin can be left floating.
GPIO4 11 I/O General purpose digital I/O. These pins are bidirectional digital I/Os with an internal 48-kΩ pullup resistor to the IOVDD pin. If unused these pins can be left floating.
GPIO5 12 I/O
GPIO6 13 I/O
GPIO7 14 I/O
IOVDD 1 I I/O supply voltage (1.8 V to 5.5 V). This pin sets the I/O operating voltage and threshold levels. The voltage on this pin must not be greater than the value of the DVDD pin.
LV_ADC16 39 I General purpose analog inputs. These channels are used for general monitoring. The input range of these pins is 0 to 2 × Vref.
LV_ADC17 38 I
LV_ADC18 37 I
LV_ADC19 36 I
LV_ADC20 35 I
REF_CMP 49 O Internal-reference compensation-capacitor connection. Connect a 4.7-μF capacitor between this pin and the AGND2 pin.
RESET 2 I Active-low reset input. Logic low on this pin causes the device to perform a hardware reset.
SCLK 5 I Serial interface clock.
SDI 4 I Serial-interface data input. Data is clocked into the input shift register on each rising edge of the SCLK pin.
SDO 3 O Serial-interface data output. The SDO pin is in high impedance when the CS pin is high. Data is clocked out of the input shift register on each falling edge of the SCLK pin.
Thermal Pad — I The thermal pad is located on the bottom-side of the device package. The thermal pad should be tied to the same potential as the AVEE pin or left disconnected.