SBOS559B May   2011  – October 2015 AMC80

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Block Level Description
      2. 7.3.2 Temperature Measurement
        1. 7.3.2.1 Default Interrupt Mode
        2. 7.3.2.2 One-Time Interrupt Mode
        3. 7.3.2.3 Comparator Mode
      3. 7.3.3 Interrupt Structure
    4. 7.4 Programming
      1. 7.4.1 Interface and Control
    5. 7.5 Register Map
      1. 7.5.1  Configuration Register
      2. 7.5.2  Interrupt Status Registers
      3. 7.5.3  Interrupt Mask Registers
      4. 7.5.4  Fan Divisor/RST_OUT/OS Register
      5. 7.5.5  OS Configuration/Temperature Resolution Register
      6. 7.5.6  Conversion Rate Register
      7. 7.5.7  Voltage/Temperature Channel Disable Register
      8. 7.5.8  Input Mode Register
      9. 7.5.9  ADC Control Register
      10. 7.5.10 Conversion Rate Count Register
      11. 7.5.11 Value Ram Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Power-On
      2. 8.1.2 Analog Inputs
      3. 8.1.3 Fan Inputs
  9. 9 Device and Documentation Support
    1. 9.1 Community Resources
    2. 9.2 Trademarks
    3. 9.3 Electrostatic Discharge Caution
    4. 9.4 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Device and Documentation Support

9.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

9.2 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

9.3 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

9.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.