SLVSCV5E March   2015  – December 2024 ATL431 , ATL432

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics, ATL431Ax, ATL432Ax
    6. 5.6 Electrical Characteristics, ATL431Bx, ATL432Bx
    7. 5.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Open Loop (Comparator)
      2. 7.4.2 Closed Loop
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Comparator With Integrated Reference (Open-Loop)
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Basic Operation
          2. 8.2.1.2.2 Overdrive
          3. 8.2.1.2.3 Output Voltage and Logic Input Level
            1. 8.2.1.2.3.1 Input Resistance
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Shunt Regulator/Reference
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Programming Output/Cathode Voltage
          2. 8.2.2.2.2 Total Accuracy
          3. 8.2.2.2.3 Stability
        3. 8.2.2.3 Application Curves
  10. Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

Thermal Information

THERMAL METRIC(1) ATL43x UNIT
DBZ (SOT-23)
3 PINS
RθJA Junction-to-ambient thermal resistance 331.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 106.5 °C/W
RθJB Junction-to-board thermal resistance 64.6 °C/W
ψJT Junction-to-top characterization parameter 4.9 °C/W
ψJB Junction-to-board characterization parameter 62.9 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.