SWRS223D February   2020  – February 2024 AWR2243

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Signal Descriptions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Power-On Hours (POH)
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Power Supply Specifications
    6. 7.6 Power Consumption Summary
    7. 7.7 RF Specification
    8. 7.8 Thermal Resistance Characteristics for FCBGA Package [ABL0161]
    9. 7.9 Timing and Switching Characteristics
      1. 7.9.1 Power Supply Sequencing and Reset Timing
      2. 7.9.2 Synchronized Frame Triggering
      3. 7.9.3 Input Clocks and Oscillators
        1. 7.9.3.1 Clock Specifications
      4. 7.9.4 Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 7.9.4.1 Peripheral Description
          1. 7.9.4.1.1 SPI Timing Conditions
          2. 7.9.4.1.2 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
          3. 7.9.4.1.3 SPI Peripheral Mode Timing Requirements (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        2. 7.9.4.2 Typical Interface Protocol Diagram (Peripheral Mode)
      5. 7.9.5 Inter-Integrated Circuit Interface (I2C)
        1. 7.9.5.1 I2C Timing Requirements
      6. 7.9.6 LVDS Interface Configuration
        1. 7.9.6.1 LVDS Interface Timings
      7. 7.9.7 General-Purpose Input/Output
        1. 7.9.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      8. 7.9.8 Camera Serial Interface (CSI)
        1. 7.9.8.1 CSI Switching Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Subsystems
      1. 8.3.1 RF and Analog Subsystem
        1. 8.3.1.1 Clock Subsystem
        2. 8.3.1.2 Transmit Subsystem
        3. 8.3.1.3 Receive Subsystem
      2. 8.3.2 Host Interface
    4. 8.4 Other Subsystems
      1. 8.4.1 ADC Data Format Over CSI2 Interface
      2. 8.4.2 ADC Channels (Service) for User Application
        1. 8.4.2.1 GPADC Parameters
  10. 9 Monitoring and Diagnostic Mechanisms
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Short-, Medium-, and Long-Range Radar
    3. 10.3 Imaging Radar using Cascade Configuration
    4. 10.4 Reference Schematic
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Export Control Notice
    8. 11.8 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ABL|161
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.8 Thermal Resistance Characteristics for FCBGA Package [ABL0161]

THERMAL METRICS(1)°C/W(2)(3)
RΘJCJunction-to-case5
RΘJBJunction-to-board5.9
RΘJAJunction-to-free air21.6
RΘJMAJunction-to-moving air15.3(4)
PsiJTJunction-to-package top0.69
PsiJBJunction-to-board5.8
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) °C/W = degrees Celsius per watt.
(3) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:
  • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
  • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
  • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
  • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(4) Air flow = 1 m/s