SWRS314 January   2024 AWR2544

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
  6. 5 Related Products
  7. 6 Pin Configurations and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions - Digital
    4. 6.4 Signal Descriptions - Analog
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.5.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.5.2 Hardware Requirements
      3. 7.5.3 Impact to Your Hardware Warranty
    6. 7.6  Power Supply Specifications
    7. 7.7  Power Consumption Summary
    8. 7.8  RF Specifications
    9. 7.9  Thermal Resistance Characteristics
    10. 7.10 Power Supply Sequencing and Reset Timing
    11. 7.11 Input Clocks and Oscillators
      1. 7.11.1 Clock Specifications
    12. 7.12 Peripheral Information
      1. 7.12.1 QSPI Flash Memory Peripheral
        1. 7.12.1.1 QSPI Timing Conditions
        2. 7.12.1.2 QSPI Timing Requirements #GUID-C38B9713-DC57-4B3B-8AFF-A79AF70E5A5A/GUID-97D19708-D87E-443B-9ADF-1760CFEF6F4C #GUID-C38B9713-DC57-4B3B-8AFF-A79AF70E5A5A/GUID-0A61EEC9-2B95-4C27-B219-18D27C8F9430
        3. 7.12.1.3 QSPI Switching Characteristics #GUID-D1480E86-4079-4A44-A68A-26C2D9F4506B/T4362547-64 #GUID-D1480E86-4079-4A44-A68A-26C2D9F4506B/T4362547-65
      2. 7.12.2 Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 7.12.2.1 MibSPI Peripheral Description
        2. 7.12.2.2 MibSPI Transmit and Receive RAM Organization
          1. 7.12.2.2.1 SPI Timing Conditions
          2. 7.12.2.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input) #GUID-3DD8619F-41DB-47CF-9AF7-5916CFF97E61/T4362547-236 #GUID-3DD8619F-41DB-47CF-9AF7-5916CFF97E61/T4362547-237 #GUID-3DD8619F-41DB-47CF-9AF7-5916CFF97E61/T4362547-238
          3. 7.12.2.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input) #GUID-220CE6B8-D17E-48AF-BF69-AAEC97D55C95/T4362547-244 #GUID-220CE6B8-D17E-48AF-BF69-AAEC97D55C95/T4362547-245 #GUID-220CE6B8-D17E-48AF-BF69-AAEC97D55C95/T4362547-246
        3. 7.12.2.3 SPI Peripheral Mode I/O Timings
          1. 7.12.2.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output) #GUID-BF2B230C-8F03-4C6A-A240-6DFD0CEC87C8/T4362547-70 #GUID-BF2B230C-8F03-4C6A-A240-6DFD0CEC87C8/T4362547-71 #GUID-BF2B230C-8F03-4C6A-A240-6DFD0CEC87C8/T4362547-73
      3. 7.12.3 Ethernet Switch (RGMII/RMII/MII) Peripheral
        1. 7.12.3.1  RGMII/RMII/MII Timing Conditions
        2. 7.12.3.2  RGMII Transmit Clock Switching Characteristics
        3. 7.12.3.3  RGMII Transmit Data and Control Switching Characteristics
        4. 7.12.3.4  RGMII Receive Clock Timing Requirements
        5. 7.12.3.5  RGMII Receive Data and Control Timing Requirements
        6. 7.12.3.6  RMII Transmit Clock Switching Characteristics
        7. 7.12.3.7  RMII Transmit Data and Control Switching Characteristics
        8. 7.12.3.8  RMII Receive Clock Timing Requirements
        9. 7.12.3.9  RMII Receive Data and Control Timing Requirements
        10. 7.12.3.10 MII Transmit Switching Characteristics
        11. 7.12.3.11 MII Receive Clock Timing Requirements
        12. 7.12.3.12 MII Receive Timing Requirements
        13. 7.12.3.13 MII Transmit Clock Timing Requirements
        14. 7.12.3.14 MDIO Interface Timings
      4. 7.12.4 LVDS Instrumentation and Measurement Peripheral
        1. 7.12.4.1 LVDS Interface Configuration
        2. 7.12.4.2 LVDS Interface Timings
      5. 7.12.5 UART Peripheral
        1. 7.12.5.1 SCI Timing Requirements
      6. 7.12.6 Inter-Integrated Circuit Interface (I2C)
        1. 7.12.6.1 I2C Timing Requirements #GUID-5F6D5D17-1161-44B3-ABD1-283215937B93/T4362547-185
      7. 7.12.7 Enhanced Pulse-Width Modulator (ePWM)
      8. 7.12.8 General-Purpose Input/Output
        1. 7.12.8.1 Switching Characteristics for Output Timing versus Load Capacitance (CL) #GUID-918A19D2-41ED-481C-96AE-E1C69B8B3446/T4362547-45 #GUID-918A19D2-41ED-481C-96AE-E1C69B8B3446/T4362547-50
    13. 7.13 Emulation and Debug
      1. 7.13.1 Emulation and Debug Description
      2. 7.13.2 JTAG Interface
        1. 7.13.2.1 Timing Requirements for IEEE 1149.1 JTAG
        2. 7.13.2.2 Switching Characteristics for IEEE 1149.1 JTAG
      3. 7.13.3 ETM Trace Interface
        1. 7.13.3.1 ETM TRACE Timing Requirements
        2. 7.13.3.2 ETM TRACE Switching Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Subsystems
      1. 8.3.1 RF and Analog Subsystem
        1. 8.3.1.1 RF Clock Subsystem
        2. 8.3.1.2 Transmit Subsystem
        3. 8.3.1.3 Receive Subsystem
      2. 8.3.2 Processor Subsystem
      3. 8.3.3 Automotive Interfaces
    4. 8.4 Other Subsystems
      1. 8.4.1 Hardware Accelerator Subsystem
      2. 8.4.2 Security – Hardware Security Module
      3. 8.4.3 ADC Channels (Service) for User Application
  10. 9 Monitoring and Diagnostics
    1. 9.1 Monitoring and Diagnostic Mechanisms
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Short and Medium Range Radar
    3. 10.3 Reference Schematic
  12. 11Device and Documentation Support
    1. 11.1 Device Support
  13. 12Device Nomenclature
    1. 12.1 Tools and Software
    2. 12.2 Documentation support
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • AMQ|248
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.9 Thermal Resistance Characteristics

THERMAL METRICS(1)(4)°C/W(2)(3)
RΘJCJunction-to-case

3.36

RΘJBJunction-to-board

5.0

RΘJAJunction-to-free air

17.3

ΨJT

Junction-to-top

0.12

ΨJB

Junction-to-board

4.9

(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) °C/W = degrees Celsius per watt.
(3) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:
  • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
  • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
  • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
  • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
A junction temperature of 140°C is assumed.
(4) Air flow = 0m/s