SWRS314A January   2024  – November 2024 AWR2544

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
  6. 5 Related Products
  7. 6 Pin Configurations and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions - Digital
    4. 6.4 Signal Descriptions - Analog
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.5.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.5.2 Hardware Requirements
      3. 7.5.3 Impact to Your Hardware Warranty
    6. 7.6  Power Supply Specifications
    7. 7.7  Power Consumption Summary
    8. 7.8  RF Specifications
    9. 7.9  Thermal Resistance Characteristics
    10. 7.10 Power Supply Sequencing and Reset Timing
    11. 7.11 Input Clocks and Oscillators
      1. 7.11.1 Clock Specifications
    12. 7.12 Peripheral Information
      1. 7.12.1 QSPI Flash Memory Peripheral
        1. 7.12.1.1 QSPI Timing Conditions
        2. 7.12.1.2 QSPI Timing Requirements #GUID-C38B9713-DC57-4B3B-8AFF-A79AF70E5A5A/GUID-97D19708-D87E-443B-9ADF-1760CFEF6F4C #GUID-C38B9713-DC57-4B3B-8AFF-A79AF70E5A5A/GUID-0A61EEC9-2B95-4C27-B219-18D27C8F9430
        3. 7.12.1.3 QSPI Switching Characteristics #GUID-D1480E86-4079-4A44-A68A-26C2D9F4506B/T4362547-64 #GUID-D1480E86-4079-4A44-A68A-26C2D9F4506B/T4362547-65
      2. 7.12.2 Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 7.12.2.1 MibSPI Peripheral Description
        2. 7.12.2.2 MibSPI Transmit and Receive RAM Organization
          1. 7.12.2.2.1 SPI Timing Conditions
          2. 7.12.2.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input) #GUID-3DD8619F-41DB-47CF-9AF7-5916CFF97E61/T4362547-236 #GUID-3DD8619F-41DB-47CF-9AF7-5916CFF97E61/T4362547-237 #GUID-3DD8619F-41DB-47CF-9AF7-5916CFF97E61/T4362547-238
          3. 7.12.2.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input) #GUID-220CE6B8-D17E-48AF-BF69-AAEC97D55C95/T4362547-244 #GUID-220CE6B8-D17E-48AF-BF69-AAEC97D55C95/T4362547-245 #GUID-220CE6B8-D17E-48AF-BF69-AAEC97D55C95/T4362547-246
        3. 7.12.2.3 SPI Peripheral Mode I/O Timings
          1. 7.12.2.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output) #GUID-BF2B230C-8F03-4C6A-A240-6DFD0CEC87C8/T4362547-70 #GUID-BF2B230C-8F03-4C6A-A240-6DFD0CEC87C8/T4362547-71 #GUID-BF2B230C-8F03-4C6A-A240-6DFD0CEC87C8/T4362547-73
      3. 7.12.3 Ethernet Switch (RGMII/RMII/MII) Peripheral
        1. 7.12.3.1  RGMII/RMII/MII Timing Conditions
        2. 7.12.3.2  RGMII Transmit Clock Switching Characteristics
        3. 7.12.3.3  RGMII Transmit Data and Control Switching Characteristics
        4. 7.12.3.4  RGMII Receive Clock Timing Requirements
        5. 7.12.3.5  RGMII Receive Data and Control Timing Requirements
        6. 7.12.3.6  RMII Transmit Clock Switching Characteristics
        7. 7.12.3.7  RMII Transmit Data and Control Switching Characteristics
        8. 7.12.3.8  RMII Receive Clock Timing Requirements
        9. 7.12.3.9  RMII Receive Data and Control Timing Requirements
        10. 7.12.3.10 MII Transmit Switching Characteristics
        11. 7.12.3.11 MII Receive Clock Timing Requirements
        12. 7.12.3.12 MII Receive Timing Requirements
        13. 7.12.3.13 MII Transmit Clock Timing Requirements
        14. 7.12.3.14 MDIO Interface Timings
      4. 7.12.4 LVDS Instrumentation and Measurement Peripheral
        1. 7.12.4.1 LVDS Interface Configuration
        2. 7.12.4.2 LVDS Interface Timings
      5. 7.12.5 UART Peripheral
        1. 7.12.5.1 SCI Timing Requirements
      6. 7.12.6 Inter-Integrated Circuit Interface (I2C)
        1. 7.12.6.1 I2C Timing Requirements #GUID-5F6D5D17-1161-44B3-ABD1-283215937B93/T4362547-185
      7. 7.12.7 Enhanced Pulse-Width Modulator (ePWM)
      8. 7.12.8 General-Purpose Input/Output
        1. 7.12.8.1 Switching Characteristics for Output Timing versus Load Capacitance (CL) #GUID-918A19D2-41ED-481C-96AE-E1C69B8B3446/T4362547-45 #GUID-918A19D2-41ED-481C-96AE-E1C69B8B3446/T4362547-50
    13. 7.13 Emulation and Debug
      1. 7.13.1 Emulation and Debug Description
      2. 7.13.2 JTAG Interface
        1. 7.13.2.1 Timing Requirements for IEEE 1149.1 JTAG
        2. 7.13.2.2 Switching Characteristics for IEEE 1149.1 JTAG
      3. 7.13.3 ETM Trace Interface
        1. 7.13.3.1 ETM TRACE Timing Requirements
        2. 7.13.3.2 ETM TRACE Switching Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Subsystems
      1. 8.3.1 RF and Analog Subsystem
        1. 8.3.1.1 RF Clock Subsystem
        2. 8.3.1.2 Transmit Subsystem
        3. 8.3.1.3 Receive Subsystem
      2. 8.3.2 Processor Subsystem
      3. 8.3.3 Automotive Interfaces
    4. 8.4 Other Subsystems
      1. 8.4.1 Hardware Accelerator Subsystem
      2. 8.4.2 Security – Hardware Security Module
      3. 8.4.3 ADC Channels (Service) for User Application
  10. 9 Monitoring and Diagnostics
    1. 9.1 Monitoring and Diagnostic Mechanisms
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Short and Medium Range Radar
    3. 10.3 Reference Schematic
  12. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Device Nomenclature
    3. 11.3 Tools and Software
    4. 11.4 Documentation support
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • AMQ|248
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.11.1 Clock Specifications

An external crystal is connected to the device pins. Figure 7-3 shows the crystal implementation.

AWR2544 Crystal Implementation Figure 7-3 Crystal Implementation
Note:

The load capacitors, Cf1 and Cf2 in Figure 7-3, can be chosen such that Equation 1 is satisfied. CL in the equation is the load specified by the crystal manufacturer. All discrete components used to implement the oscillator circuit can be placed as close as possible to the associated oscillator CLKP and CLKM pins. Note that Cf1 and Cf2 include the parasitic capacitances due to PCB routing.

Note: The board routing parasitics between CLKP/CLKM pins also need to be included in the estimates of CP
Equation 1. AWR2544

Table 7-5 lists the electrical characteristics of the clock crystal.

Table 7-5 Crystal Electrical Characteristics (Oscillator Mode)
NAME DESCRIPTION MIN TYP MAX UNIT
fp Parallel resonance crystal frequency 50 MHz
CL Crystal load capacitance 5 8 12 pF
ESR Crystal ESR 50 Ω
Temperature range Expected temperature range of operation -40 140 ℃
Frequency tolerance Crystal frequency tolerance(1)(2) -100 100(3) ppm
Drive level 50 200 μW
(1) The crystal manufacturer's specification must satisfy this requirement.
(2) Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance.
(3) For Ethernet operation, tighter specifications of less than 100PPM frequency error is required. If the Ethernet interface is not used , a PPM error up to 200PPM can be tolerated.

In the case where an external clock is used as the clock resource, the signal is fed to the CLKP pin only; CLKM is grounded. The phase noise requirement is very important when a 50MHz clock is fed externally. Table 7-6 lists the electrical characteristics of the external clock signal.

Table 7-6 External Clock Mode Specifications
PARAMETER SPECIFICATION UNIT
MIN TYP MAX
Input Clock: External AC-coupled sine wave or DC-coupled square wave Phase Noise referred to 50 MHz Frequency 50 MHz
AC-Amplitude 700 1200 mV (pp)
DC-trise/fall 10 ns
Phase Noise at 1 kHz -132 dBc/Hz
Phase Noise at 10 kHz –143 dBc/Hz
Phase Noise at 100 kHz –152 dBc/Hz
Phase Noise at 1 MHz –153 dBc/Hz
Duty Cycle 35 65 %
Freq Tolerance -100 100 ppm