SWRS296B July   2023  – June 2024 AWRL1432

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configurations and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Signal Descriptions
      1.      11
      2.      12
      3.      13
      4.      14
      5.      15
      6.      16
      7.      17
      8.      18
      9.      19
      10.      20
      11.      21
      12.      22
      13.      23
      14.      24
      15.      25
      16.      26
      17.      27
    3.     28
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.5.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.5.2 Hardware Requirements
      3. 7.5.3 Impact to Your Hardware Warranty
    6. 7.6  Power Supply Specifications
      1. 7.6.1 Power Optimized 3.3V I/O Topology
      2. 7.6.2 BOM Optimized 3.3V I/O Topology
      3. 7.6.3 Power Optimized 1.8V I/O Topology
      4. 7.6.4 BOM Optimized 1.8V I/O Topology
      5. 7.6.5 System Topologies
        1. 7.6.5.1 Power Topologies
          1. 7.6.5.1.1 BOM Optimized Mode
          2. 7.6.5.1.2 Power Optimized Mode
      6. 7.6.6 Internal LDO output decoupling capacitor and layout conditions for BOM optimized topology
        1. 7.6.6.1 Single-capacitor rail
          1. 7.6.6.1.1 1.2V Digital LDO
        2. 7.6.6.2 Two-capacitor rail
          1. 7.6.6.2.1 1.2V RF LDO
          2. 7.6.6.2.2 1.2V SRAM LDO
          3. 7.6.6.2.3 1.0V RF LDO
      7. 7.6.7 Noise and Ripple Specifications
    7. 7.7  Power Save Modes
      1. 7.7.1 Typical Power Consumption Numbers
    8. 7.8  Peak Current Requirement per Voltage Rail
    9. 7.9  RF Specification
    10. 7.10 Supported Front End features
    11. 7.11 CPU Specifications
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 Timing and Switching Characteristics
      1. 7.13.1  Power Supply Sequencing and Reset Timing
      2. 7.13.2  Synchronized Frame Triggering
      3. 7.13.3  Input Clocks and Oscillators
        1. 7.13.3.1 Clock Specifications
      4. 7.13.4  MultiChannel buffered / Standard Serial Peripheral Interface (McSPI)
        1. 7.13.4.1 McSPI Features
        2. 7.13.4.2 SPI Timing Conditions
        3. 7.13.4.3 SPI—Controller Mode
          1. 7.13.4.3.1 Timing and Switching Requirements for SPI - Controller Mode
          2. 7.13.4.3.2 Timing and Switching Characteristics for SPI Output Timings—Controller Mode
        4. 7.13.4.4 SPI—Peripheral Mode
          1. 7.13.4.4.1 Timing and Switching Requirements for SPI - Peripheral Mode
          2. 7.13.4.4.2 Timing and Switching Characteristics for SPI Output Timings—Secondary Mode
      5. 7.13.5  RDIF Interface Configuration
        1. 7.13.5.1 RDIF Interface Timings
        2. 7.13.5.2 RDIF Data Format
      6. 7.13.6  LIN
      7. 7.13.7  General-Purpose Input/Output
        1. 7.13.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      8. 7.13.8  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 7.13.8.1 Dynamic Characteristics for the CANx TX and RX Pins
      9. 7.13.9  Serial Communication Interface (SCI)
        1. 7.13.9.1 SCI Timing Requirements
      10. 7.13.10 Inter-Integrated Circuit Interface (I2C)
        1. 7.13.10.1 I2C Timing Requirements
      11. 7.13.11 Quad Serial Peripheral Interface (QSPI)
        1. 7.13.11.1 QSPI Timing Conditions
        2. 7.13.11.2 Timing Requirements for QSPI Input (Read) Timings
        3. 7.13.11.3 QSPI Switching Characteristics
      12. 7.13.12 JTAG Interface
        1. 7.13.12.1 JTAG Timing Conditions
        2. 7.13.12.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 7.13.12.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Subsystems
      1. 8.3.1 RF and Analog Subsystem
      2. 8.3.2 Clock Subsystem
      3. 8.3.3 Transmit Subsystem
      4. 8.3.4 Receive Subsystem
      5. 8.3.5 Processor Subsystem
      6. 8.3.6 Automotive Interface
      7. 8.3.7 Host Interface
      8. 8.3.8 Application Subsystem
      9. 8.3.9 Hardware Accelerator (HWA1.2) Features
        1. 8.3.9.1 Hardware Accelerator Feature Differences Between HWA1.1 and HWA1.2
    4. 8.4 Other Subsystems
      1. 8.4.1 GPADC Channels (Service) for User Application
      2. 8.4.2 GPADC Parameters
    5. 8.5 Memory Partitioning Options
    6. 8.6 Boot Modes
  10. 9 Monitoring and Diagnostics
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Reference Schematic
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • AMF|102
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Revision History

Changes from July 1, 2023 to February 28, 2024 (from Revision * (July 2023) to Revision A (February 2024))

  • (Description) : Updated the applicationsGo
  • (Description) : Updated the packaging variants information in the tableGo
  • (Power Supply Sequencing) : Updated the SOP sequence. 1.2V, 1.8V and VIOIN power up synced. Go

Changes from February 28, 2024 to June 12, 2024 (from Revision A (February 2024) to Revision B (June 2024))

  • (Features) : Updated typical Noise figure to 14dBGo
  • (Description) : Updated the packaging variants information in the tableGo
  • (Device Comparison) : Added note for "Compliance targeted" devicesGo
  • (Signal Descriptions) : Updated the incorrect pin signal name, descriptions and mappings.Go
  • (Signal Descriptions) : Moved the Pin Type column before Description column. Incorrect pin descriptions and mappings are corrected.Go
  • (Pin Muxing) : Added SOP[0] and SOP[1] pin muxing details in the tableGo
  • (Pin Muxing) : Moved PULL UP/DOWN TYPE column to the last column.Go
  • (VPP Specification) : Added new section with VPP specifications.Go
  • (BOM Optimized 3.3V I/O Topology) : Added VNWAGo
  • (BOM Optimized 1.8V I/O Topology) : VNWA addedGo
  • (System Topologies) : Added description for each of the two system topologies.Go
  • (Power Topologies) : Updated introduction with more information regarding the two power topologies.Go
  • (Internal LDO output De-cap and layout conditions for BOM optimized topology) : Added new section addressing range for de-coupling capacitor values and output path parasitic values.Go
  • (Noise and ripple specification) : Added 1.8V noise and ripple specification note Go
  • (Typical Power Consumption Numbers) : Updated description with device condition and ambient temperature.Go
  • (Typical Power Consumption Numbers) : Updated Estimated Power Consumed in 3.3V IO Mode table - Conditions and Power consumption for power optimized and BOM optimized modes.Go
  • (Typical Power Consumption Numbers) : Updated Estimated Power Consumed in 1.8V IO Mode table - Conditions and Power consumption for power optimized and BOM optimized modes.Go
  • (Typical Power Consumption Numbers) : Updated the Use-Case Power Consumed in 3.3V Power Optimized Topology (Level Sensing Application) table - Conditions and Typical Power consumption value.Go
  • (Typical Power Consumption Numbers) : Added the Use-Case Power Consumed in 3.3V Power Optimized Topology (Kick to Open Application) table.Go
  • (Peak Current Requirement per Voltage Rail) : Updated the Maximum current for each power rail is updated in the table.Go
  • (RF Specification) : Added typical Noise Figure, S11 of Tx and RxGo
  • (RF Specification) : Updated the Noise Figure plot and 1-dB compression point (Out Of Band)Go
  • (Supported Front End features) : Updated title to Supported Front End Features from Supported DFE features.Go
  • (Supported Front End features) : Updated supported ADC sampling ratesGo
  • (Supported Front End features) : Updated timing engine paragraphGo
  • (Supported Front End features) : Updated chirp profile supported by timing engine figureGo
  • (Supported Front End features) : Added noteGo
  • (Power Supply Sequencing) : Updated the SOP sequence.Go
  • (Clock Specifications) : Corrected the External Clock Mode Specifications table - units of DC Voltages.Go
  • (RDIF Interface Configuration) : Removed the 100Mbps from supported data rates.Go
  • (LIN) : Corrected the Baud rate unit and pin names.Go
  • (SCI Timing Requirements) : Added the supported baud ratesGo
  • (Clock Subsystem) : Updated Clock Subsystem diagram.Go
  • (Application Subsystem): Updated the section name and description from Main Subsystem to Application Subsystem.Go
  • (GPADC channels) : Included the APPSS Cortex M4F® .Go
  • (Monitoring and Diagnostics) : Added the new sectionGo
  • (Device Nomenclature) : Updated reflecting production part number.Go