SWRS325 December   2024 AWRL6844

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configurations and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Signal Descriptions
      1.      11
      2.      12
      3.      13
      4.      14
      5.      15
      6.      16
      7.      17
      8.      18
      9.      19
      10.      20
      11.      21
      12.      22
      13.      23
      14.      24
      15.      25
      16.      26
      17.      27
    3.     28
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.5.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.5.2 Hardware Requirements
      3. 7.5.3 Impact to Your Hardware Warranty
    6. 7.6  Power Supply Specifications
      1. 7.6.1 3.3V I/O Topology
      2. 7.6.2 1.8V I/O Topology
      3. 7.6.3 System Topologies
        1. 7.6.3.1 I/O Topologies
      4. 7.6.4 RF Supply Decoupling Capacitor and Layout Conditions
        1. 7.6.4.1 1.2V RF Supply Rail
          1. 7.6.4.1.1 1.2V RF Rail
        2. 7.6.4.2 1.0V RF LDO
          1. 7.6.4.2.1 1.0V RF LDO
      5. 7.6.5 Noise and Ripple Specifications
    7. 7.7  Power Save Modes
      1. 7.7.1 Typical Power Consumption Numbers
    8. 7.8  Peak Current Requirement per Voltage Rail
    9. 7.9  RF Specification
    10. 7.10 Supported DFE Features
    11. 7.11 CPU Specifications
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 Timing and Switching Characteristics
      1. 7.13.1  Power Supply Sequencing and Reset Timing
      2. 7.13.2  Synchronized Frame Triggering
      3. 7.13.3  Input Clocks and Oscillators
        1. 7.13.3.1 Clock Specifications
      4. 7.13.4  MultiChannel buffered / Standard Serial Peripheral Interface (McSPI)
        1. 7.13.4.1 McSPI Features
        2. 7.13.4.2 SPI Timing Conditions
        3. 7.13.4.3 SPI—Controller Mode
          1. 7.13.4.3.1 Timing and Switching Requirements for SPI - Controller Mode
          2. 7.13.4.3.2 Timing and Switching Characteristics for SPI Output Timings—Controller Mode
        4. 7.13.4.4 SPI—Peripheral Mode
          1. 7.13.4.4.1 Timing and Switching Requirements for SPI - Peripheral Mode
          2. 7.13.4.4.2 Timing and Switching Characteristics for SPI Output Timings—Secondary Mode
      5. 7.13.5  LVDS Instrumentation and Measurement Peripheral
        1. 7.13.5.1 LVDS Interface Configuration
        2. 7.13.5.2 LVDS Interface Timings
      6. 7.13.6  LIN
      7. 7.13.7  General-Purpose Input/Output
        1. 7.13.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      8. 7.13.8  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 7.13.8.1 Dynamic Characteristics for the CANx TX and RX Pins
      9. 7.13.9  Serial Communication Interface (SCI)
        1. 7.13.9.1 SCI Timing Requirements
      10. 7.13.10 Inter-Integrated Circuit Interface (I2C)
        1. 7.13.10.1 I2C Timing Requirements
      11. 7.13.11 Quad Serial Peripheral Interface (QSPI)
        1. 7.13.11.1 QSPI Timing Conditions
        2. 7.13.11.2 Timing Requirements for QSPI Input (Read) Timings
        3. 7.13.11.3 QSPI Switching Characteristics
      12. 7.13.12 JTAG Interface
        1. 7.13.12.1 JTAG Timing Conditions
        2. 7.13.12.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 7.13.12.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Subsystems
      1. 8.3.1  RF and Analog Subsystem
      2. 8.3.2  Clock Subsystem
      3. 8.3.3  Transmit Subsystem
      4. 8.3.4  Receive Subsystem
      5. 8.3.5  Processor Subsystem
      6. 8.3.6  Automotive Interface
      7. 8.3.7  Host Interface
      8. 8.3.8  Application Subsystem Cortex-R5F
      9. 8.3.9  DSP Subsystem
      10. 8.3.10 Hardware Accelerator (HWA1.2) Features
        1. 8.3.10.1 Hardware Accelerator Feature Differences Between HWA1.1 in xWRx843, HWA1.2 in xWRLx432 and HWA1.2 in xWRL684x
    4. 8.4 Other Subsystems
      1. 8.4.1 Security – Hardware Security Module
      2. 8.4.2 GPADC Channels (Service) for User Application
      3. 8.4.3 GPADC Parameters
    5. 8.5 Memory Partitioning Options
    6. 8.6 Boot Modes
  10. 9 Monitoring and Diagnostics
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Reference Schematic
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • ANC|207
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The AWRL684x mmWave Sensor device is TI's low power and Hardware Security Module (HSM) enabled integrated single chip mmWave sensor based on FMCW radar technology. The device is capable of operation in the 57GHz to 64GHz band and is designed for various automotive in-cabin use cases. The device also takes advantage of a low power architecture to enable power-constrained applications. The device is split into the following four switchable power domains:

  1. RF/Analog Sub-System: This block includes all the RF and Analog components required to transmit and receive the RF signals.
  2. Front-End Controller sub-System (FECSS): FECSS contains processor, responsible for radar front-end configuration, control, and calibration.
  3. Application Sub-System (APPSS): APPSS is where the device implements a user programmable ARM Cortex-R5F allowing for custom control and automotive interface applications. Top Sub-System (TOPSS) and Hardware Security Module (HSM) is part of the APPSS power domain and contains the clocking and power management sub-blocks.
  4. DSP Sub-Systems (DSS): TI's high-performance C66x DSP is integrated in it for radar signal processing. The hardware accelerator block (HWA 1.2) supplements the DSP and ARM Cortex-R5F by offloading common radar processing such as FFT, constant false alarm rate (CFAR), scaling, and compression.

The AWRL684x is specifically designed to be able to dynamically control the power states of the above-mentioned power domains based on application requirements. The device also features various low-power states. These low-power states are achieved by turning off internal IP blocks of the device. AWRL684x device also provides the option of retaining memory during these low power states to retain critical information such as application image and RF profiles across different power modes.

A Hardware Security Module (HSM) is also provisioned in the device (available with secure part variants). The HSM consists of a programmable Arm Cortex-M4 core and the necessary infrastructure to provide a secure zone of operation within the device.

Additionally, the device is built with TI’s low power 45nm RF CMOS process and enables unprecedented levels of integration in an extremely small form factor. AWRL684x is designed for low power, self-monitored, ultra-accurate radar systems in the automotive space for applications like child presence detection, intrusion monitoring and occupancy detection.

Packaging Information
PART NUMBER(1) PACKAGE BODY SIZE(1) TRAY / TAPE AND REEL

DESCRIPTION
XA6844DBGANC ANC (FCCSP, 207) 9.1mm x 9.1m Tray Pre-production variant. ASIL-B targeted. Deep Sleep enabled, Generic.
XA6844DBSANC ANC (FCCSP, 207) 9.1mm x 9.1mm Tray Pre-production variant. ASIL-B targeted. Deep Sleep Enabled, Secure variant.
AWRL6843DBGANCRQ1 ANC (FCCSP, 207) 9.1mm x 9.1mm Tape and Reel Automotive production variant. ASIL-B targeted. Deep Sleep enabled. Generic.
AWRL6843DBSANCRQ1 ANC (FCCSP, 207) 9.1mm x 9.1mm Tape and Reel Automotive production variant. ASIL-B targeted. Deep Sleep enabled. Secure Variant.
AWRL6844DBGANCRQ1 ANC (FCCSP, 207) 9.1mm x 9.1mm Tape and Reel Automotive production variant. ASIL-B targeted. Deep Sleep enabled. Generic.
AWRL6844DBSANCRQ1 ANC (FCCSP, 207) 9.1mm x 9.1mm Tape and Reel Automotive production variant. ASIL-B targeted. Deep Sleep enabled. Secure Variant.