SLUS938A December   2011  – October 2014

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Pin Configuration and Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Electrical Characteristics: DC
    4. 6.4 Switching Characteristcs: AC
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 EPROM
      2. 7.3.2 EPROM Status Memory
      3. 7.3.3 Error Checking
    4. 7.4 Device Functional Modes
      1. 7.4.1  Customizing the bq2026
      2. 7.4.2  Bus Termination
      3. 7.4.3  Serial Communication
      4. 7.4.4  Initialization
      5. 7.4.5  ROM Commands
        1. 7.4.5.1 Read ROM
        2. 7.4.5.2 Match ROM
        3. 7.4.5.3 Skip ROM
      6. 7.4.6  Memory and Status Function Commands
      7. 7.4.7  Read Memory and Field CRC
      8. 7.4.8  Read Status
      9. 7.4.9  Write Memory
      10. 7.4.10 Write Status
      11. 7.4.11 SDQ Signaling
      12. 7.4.12 Reset and Presence Pulse
      13. 7.4.13 Write
      14. 7.4.14 Read
      15. 7.4.15 Program Pulse
      16. 7.4.16 Idle
      17. 7.4.17 CRC Generation
  8. 8Device and Documentation Support
    1. 8.1 Trademarks
    2. 8.2 Electrostatic Discharge Caution
    3. 8.3 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Device and Documentation Support

8.1 Trademarks

SDQ is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

8.2 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

8.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.