SLUSCE2D April 2016 – January 2019
PRODUCTION DATA.
THERMAL METRIC(1) | bq21040 | UNIT | |
---|---|---|---|
DBV (SOT-23) | |||
6 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 130.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 75.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 45.5 | °C/W |
ψJT | Junction-to-top characterization parameter | 31.8 | °C/W |
ψJB | Junction-to-board characterization parameter | 45.5 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |