SLUSE42A july   2020  – april 2023 BQ21062

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Linear Charger and Power Path
        1. 9.3.1.1 Battery Charging Process
        2. 9.3.1.2 JEITA and Battery Temperature Dependent Charging
        3. 9.3.1.3 Input Voltage Based Dynamic Power Management (VINDPM)
        4. 9.3.1.4 Battery Supplement Mode
      2. 9.3.2  Protection Mechanisms
        1. 9.3.2.1 Input Over-Voltage Protection
        2. 9.3.2.2 Safety Timer and I2C Watchdog Timer
        3. 9.3.2.3 Thermal Protection and Thermal Charge Current Foldback
        4. 9.3.2.4 Battery Short and Over Current Protection
        5. 9.3.2.5 PMID Short Circuit
      3. 9.3.3  VDD LDO
      4. 9.3.4  Load Switch/LDO Output and Control
      5. 9.3.5  PMID Power Control
      6. 9.3.6  System Voltage (PMID) Regulation
      7. 9.3.7  MR Wake and Reset Input
        1. 9.3.7.1 MR Wake or Short Button Press Functions
        2. 9.3.7.2 MR Reset or Long Button Press Functions
      8. 9.3.8  14-Second Watchdog for HW Reset
      9. 9.3.9  Faults Conditions and Interrupts ( INT)
        1. 9.3.9.1 Flags and Fault Condition Response
      10. 9.3.10 Power Good ( PG) Pin
      11. 9.3.11 External NTC Monitoring (TS)
        1. 9.3.11.1 TS Thresholds
      12. 9.3.12 I2C Interface
        1. 9.3.12.1 F/S Mode Protocol
    4. 9.4 Device Functional Modes
      1. 9.4.1 Ship Mode
      2. 9.4.2 Low Power
      3. 9.4.3 Active Battery
      4. 9.4.4 Charger/Adapter Mode
      5. 9.4.5 Power-Up/Down Sequencing
    5. 9.5 Register Map
      1. 9.5.1 I2C Registers
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Input (IN/PMID) Capacitors
        2. 10.2.2.2 VDD, LDO Input and Output Capacitors
        3. 10.2.2.3 TS
        4. 10.2.2.4 Recommended Passive Components
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Pin Configuration and Functions

GUID-0BB6330E-5BC6-48A4-8EED-5E4839BC8A81-low.gif Figure 7-1 YFP Package20-Pin DSBGATop View
Table 7-1 Pin Functions
PIN I/O DESCRIPTION
NAME NO.
IN A1 I DC Input Power Supply. IN is connected to the external DC supply. Bypass IN to GND with at least 1-µF of capacitance using a ceramic capacitor.
PMID A2, B2 I/O Regulated System Output. Connect 22-µF capacitor from PMID to GND as close to the PMID and GND pins as possible. If operating in VIN Pass-Through Mode (PMID_REG = 111) a lower capacitor value may be used (at least 3-µF of ceramic capacitance with DC bias de-rating).
GND A4 PWR Ground connection. Connect to the ground plane of the circuit.
VDD D1 O Digital supply LDO. Must connect a 2.2-µF from this pin to ground, do not leave floating.
CE C2 I Charge Enable. Drive CE low or leave disconnected to enable charging when VIN is valid. CE is pulled low internally with 900-kΩ resistor.
SCL E3 I/O I2C Interface Clock. Connect SCL to the logic rail through a 10-kΩ resistor.
SDA E2 I I2C Interface Data. Connect SDA to the logic rail through a 10-kΩ resistor.
LP D3 I Low Power Mode Enable. Drive this pin low to set the device in low power mode when powered by the battery. This pin must be driven high to allow I2C communication when VIN is not present. LP is pulled low internally with 900-kΩ resistor. This pin has no effect when VIN is present.
INT D2 O INT is an open-drain output that signals fault interrupts. When a fault occurs, a 128-µs pulse is sent out as an interrupt for the host.
MR C1 I Manual Reset Input. MR is a general purpose input used to reset the device or to wake it up from Ship Mode. MR has in internal 125-kΩ pull-up resistor to BAT. The battery voltage VBAT must be above VBATUVLO in order for MR low logic level to be detected.
LS/LDO D4 O Load Switch or LDO output. Connect 2.2 µF of ceramic capacitance to this pin to assure stability. Be sure to account for capacitance bias voltage derating when selecting the capacitor. If LDO is not used, short to VINLS
VINLS E4 I Input to the Load Switch / LDO output. Connect at least 1 µF of ceramic capacitance from this pin to ground.
BAT A3, B3 I/O Battery Connection. Connect to the positive terminal of the battery. Bypass BAT to GND with at least 1 µF of ceramic capacitance.
TS B4 I Battery Pack NTC Monitor. Connect TS to a 10-kΩ NTC thermistor in parallel to a 10-kΩ resistor. If TS function is not to be used connect a 5-kΩ resistor from TS to ground.
PG B1 O Open-drain Power Good status indication output. The PG pin can also be configured as a general purpose open drain output or level shifter version of MR.
VIO E1 I System IO supply. Connect to system IO supply to allow level shifting of input signals (SDA, SCL, LP and CE) to the device internal digital domain. Connect to VDD when external IO supply is not available.
NC1 C3 I No Connect. Connect to ground if possible for better thermal dissipation or leave floating. Do not connect to a any voltage source or signal to avoid higher quiescent current.
NC2 C4 I No Connect. Connect to ground if possible for better thermal dissipation. May be shorted to /LP for easier routing as long as Absolute Maximum Rating requirements are met..