SLUSF49 January   2023 BQ21080

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Battery Charging Process
        1. 8.1.1.1 Trickle Charge
        2. 8.1.1.2 Precharge
        3. 8.1.1.3 Fast Charge
        4. 8.1.1.4 Termination
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Based Dynamic Power Management (VINDPM)
      2. 8.3.2  Dynamic Power Path Management Mode (DPPM)
      3. 8.3.3  Battery Supplement Mode
      4. 8.3.4  SYS Power Control (SYS_MODE bit control)
        1. 8.3.4.1 SYS Pulldown Control
      5. 8.3.5  SYS Regulation
      6. 8.3.6  ILIM Control
      7. 8.3.7  Protection Mechanisms
        1. 8.3.7.1 Input Overvoltage Protection
        2. 8.3.7.2 Battery Undervoltage Lockout
        3. 8.3.7.3 System Overvoltage Protection
        4. 8.3.7.4 System Short Protection
        5. 8.3.7.5 Battery Overcurrent Protection
        6. 8.3.7.6 Safety Timer and Watchdog Timer
        7. 8.3.7.7 Thermal Protection and Thermal Regulation
      8. 8.3.8  Pushbutton Wake and Reset Input
        1. 8.3.8.1 Pushbutton Wake or Short Button Press Functions
        2. 8.3.8.2 Pushbutton Reset or Long Button Press Functions
      9. 8.3.9  15-Second Timeout for HW Reset
      10. 8.3.10 Hardware Reset
      11. 8.3.11 Software Reset
      12. 8.3.12 Interrupt Indicator (/INT) Pin
      13. 8.3.13 External NTC Monitoring (TS)
        1. 8.3.13.1 TS Biasing and Function
      14. 8.3.14 I2C Interface
        1. 8.3.14.1 F/S Mode Protocol
    4. 8.4 Device Functional Modes
    5. 8.5 Register Maps
      1. 8.5.1 I2C Registers
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input (IN/SYS) Capacitors
        2. 9.2.2.2 TS
        3. 9.2.2.3 Recommended Passive Components
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

TS Biasing and Function

The device can be configured to meet JEITA requirements or a simpler HOT/COLD function only. Additionally, the TS charger control function can be disabled through the TS_EN bit. This will only disable the TS charge action but the faults are still reported based on the TS voltage. To satisfy the JEITA requirements, four temperature thresholds are monitored: cold battery threshold, cool battery threshold, warm battery threshold, and hot battery threshold. These temperatures correspond to the VCOLD, VCOOL, VWARM, and VHOT thresholds in the Electrical Characteristics table. Charging and safety timers are suspended when VTS < VHOT or VTS > VCOLD. When VCOOL < VTS < VCOLD, the charging current is reduced to the value programmed in the TS_Setting register/bit TS_ICHG_0. When VHOT < VTS < VWARM, the battery regulation voltage is reduced by 100 mV or 200 mV based on the value programmed in the TS_VRCG_0 bit within the TS_Setting register.

For devices where the TS function is not needed, tie a 10-kΩ resistor to the TS pin.

There is an active voltage clamp present on this device which will prevent the voltage on the TSMR pin from rising above the VTS_CLAMP threshold. This will particularly be ON when the TSMR pin is floating. The bit TS_OPEN_STAT is set when this clamp is active. This will also be ON regardless of the TS_EN bit. The interrupt is asserted as long as the TS_INT mask is not written.

The bits TS_HOT/TS_COLD, TS_WARM, and TS_COOL will allow these thresholds to be adjusted. The hysteresis will also move along with these thresholds. When the TS_WARM condition occurs, the device will lower the battery target regulation voltage by TS_VRCG but will not modify the VBAT_CTRL register.

The TS_ICHG bit will reduce charging current based on the factor described in the register map when the TSMR pin hits a TS_COOL condition. The TREG function will still be based on this reduced threshold.

The TS_VRCG_0 bit will reduce the charging voltage when the TSMR pin hits the TS_WARM threshold. The factor will be based on the register map.

When the button is detected as pressed (TSMR pin low) during the charging process, charging will be momentarily suspended until the button is high again. When charging is disabled in any of the TS faults, trickle charging is also disabled. In a TS fault where the current is reduced (COOL), the trickle charging current is not altered.