SLUSFR2 November   2024 BQ21088

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (continued)
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Battery Charging Process
        1. 7.1.1.1 Trickle Charge
        2. 7.1.1.2 Pre-Charge
        3. 7.1.1.3 Fast Charge
        4. 7.1.1.4 Termination
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Based Dynamic Power Management (VINDPM)
      2. 7.3.2  Dynamic Power Path Management Mode (DPPM)
      3. 7.3.3  Battery Supplement Mode
      4. 7.3.4  Sleep Mode
      5. 7.3.5  SYS Power Control (SYS_MODE bit control)
        1. 7.3.5.1 SYS Pulldown Control
      6. 7.3.6  SYS Regulation
      7. 7.3.7  ILIM Control
      8. 7.3.8  Protection Mechanisms
        1. 7.3.8.1 Input Overvoltage Protection
        2. 7.3.8.2 Battery Undervoltage Lockout
        3. 7.3.8.3 Battery Overcurrent Protection
        4. 7.3.8.4 System Overvoltage Protection
        5. 7.3.8.5 System Short Protection
        6. 7.3.8.6 Thermal Protection and Thermal Regulation
        7. 7.3.8.7 Safety Timer and Watchdog Timer
      9. 7.3.9  Pushbutton Wake and Reset Input
        1. 7.3.9.1 Pushbutton Wake or Short Button Press Functions
        2. 7.3.9.2 Pushbutton Reset or Long Button Press Functions
      10. 7.3.10 15-Second Timeout for HW Reset
      11. 7.3.11 Hardware Reset
      12. 7.3.12 Software Reset
      13. 7.3.13 Interrupt Indicator (/INT) Pin
      14. 7.3.14 External NTC Monitoring (TS)
        1. 7.3.14.1 TS Biasing and Function
      15. 7.3.15 I2C Interface
        1. 7.3.15.1 F/S Mode Protocol
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
      1. 7.5.1 I2C Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Thermal Information

THERMAL METRIC(1) BQ25185 UNIT
DLH
10
RθJA Junction-to-ambient thermal resistance (JEDEC(1)) 107.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.9 °C/W
RθJB Junction-to-board thermal resistance 30.3 °C/W
ΨJT Junction-to-top characterization parameter 0.3 °C/W
ΨJB Junction-to-board characterization parameter 30.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.