BAT |
5, 6 |
I/O |
Battery input and output. |
CE |
9 |
I |
Chip enable input (active high) |
DPPM |
13 |
I |
Dynamic power-path management set point (account for scale factor) |
GND |
19, 20 |
I |
Ground input |
IN |
4 |
I |
Charge input voltage |
ISET1 |
10 |
I/O |
Charge current set point and precharge and termination set point |
ISET2 |
7 |
I |
Charge current set point for USB port. (High = 500 mA, Low = 100 mA) See half-charge current mode using ISET2. |
MODE |
8 |
I |
Power source selection input (Low for USB mode current limit) |
OUT |
15, 16, 17 |
O |
Output terminal to the system |
PG |
18 |
O |
Power-good status output (open-drain) |
STAT1 |
2 |
O |
Charge status output 1 (open-drain) |
STAT2 |
3 |
O |
Charge status output 2 (open-drain) |
TMR |
14 |
I/O |
Timer program input programmed by resistor. Disable fast-charge safety timer and termination by tying TMR to VREF. |
TS |
12 |
I/O |
Temperature sense input |
VREF |
1 |
O |
Internal reference signal |
VSS |
11 |
– |
Ground input (the thermal pad on the underside of the package) There is an internal electrical connection between the exposed thermal pad and VSS pin of the device. The exposed thermal pad must be connected to the same potential as the VSS pin on the printed-circuit board. Do not use the thermal pad as the primary ground input for the device. VSS pin must be connected to ground at all times. |