SLUSCM2B October 2017 – November 2018
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | bq24079QW-Q1 | UNIT | |
---|---|---|---|
RGT (VQFN) | |||
16 PIN | |||
RθJA | Junction-to-ambient thermal resistance | 43.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 46.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 17.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.8 | °C/W |
ψJB | Junction-to-board characterization parameter | 17.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.0 | °C/W |