SLUS937C December   2009  – December 2019 BQ24072T , BQ24075T , BQ24079T

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Circuit
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Undervoltage Lockout (UVLO)
      2. 9.3.2  Overvoltage Protection (OVP)
      3. 9.3.3  Dynamic Power-Path Management
      4. 9.3.4  Battery Charging
      5. 9.3.5  Charge Current Translator
      6. 9.3.6  Battery Detection and Recharge
      7. 9.3.7  Termination Disable (TD Input, BQ24072T)
      8. 9.3.8  Battery Disconnect (SYSOFF Input)
      9. 9.3.9  Dynamic Charge Timers (TMR Input)
      10. 9.3.10 Status Indicators (PGOOD, CHG)
      11. 9.3.11 Thermal Regulation and Thermal Shutdown
      12. 9.3.12 Battery Pack Temperature Monitoring
    4. 9.4 Device Functional Modes
      1. 9.4.1 Input Source Connected (Adapter or USB)
        1. 9.4.1.1 Input DPM Mode (VIN-DPM)
        2. 9.4.1.2 DPPM Mode
        3. 9.4.1.3 Battery Supplement Mode
      2. 9.4.2 Input Source Not Connected
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Using the BQ24075T, BQ24079T to Disconnect the Battery from the System
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Program the Fast Charge Current (ISET):
          2. 10.2.1.2.2 Program the Input Current Limit (ILIM):
          3. 10.2.1.2.3 Program 6.25-hour Fast-Charge Safety Timer (TMR):
          4. 10.2.1.2.4 TS Function:
          5. 10.2.1.2.5 CHG and PGOOD LED Status:
          6. 10.2.1.2.6 Processor Monitoring Status:
          7. 10.2.1.2.7 System ON/OFF (SYSOFF):
          8. 10.2.1.2.8 Selecting IN, OUT and BAT Capacitors
        3. 10.2.1.3 Application Curves
      2. 10.2.2 BQ24072T in a Host Controlled Charger Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedures
          1. 10.2.2.2.1 Termination Disable:
        3. 10.2.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power On
      1. 11.1.1 Half-Wave Adapters
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Package
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1 Absolute Maximum Ratings(1)(2)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Input voltage IN (with respect to VSS) –0.3 28 V
BAT (with respect to VSS) –0.3 5 V
OUT, EN1, EN2, CE, TS, ISET, PGOOD, CHG, ILIM, VREF, ITERM, SYSOFF, TD (with respect to VSS) –0.3 7 V
Input current IN 1.6 A
Output current (Continuous) OUT 5 A
BAT (Discharge mode) 5 A
BAT (Charging mode) 1.5 A
Output sink current CHG, PGOOD 15 mA
Junction temperature, TJ –40 150 °C
Storage temperature , Tstg –65 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The IC operational charging life is reduced to 20,000 hours, when charging at 1.5A and 125°C. The thermal regulation feature reduces charge current if the IC’s junction temperature reaches 125°C; thus without a good thermal design the maximum programmed charge current may not be reached.