SLUSBP6D september 2013 – april 2023 BQ24296 , BQ24297
PRODUCTION DATA
THERMAL METRIC(1) | BQ2429x | UNIT | |
---|---|---|---|
RGE (VQFN) | |||
24 PIN | |||
RθJA | Junction-to-ambient thermal resistance | 32.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 29.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 9.1 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.3 | °C/W |
ψJB | Junction-to-board characterization parameter | 9.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.2 | °C/W |