SLUS977B September   2009  – August 2015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Overvoltage Protection
      2. 8.3.2 Input Overcurrent Protection
      3. 8.3.3 Battery Overvoltage Protection
      4. 8.3.4 Thermal Protection
      5. 8.3.5 Enable Function
      6. 8.3.6 PGATE Output
    4. 8.4 Device Functional Modes
      1. 8.4.1 OPERATION Mode
      2. 8.4.2 POWER-DOWN Mode
      3. 8.4.3 POWER-ON RESET Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selection of RBAT
        2. 9.2.2.2 Selection of RCE
        3. 9.2.2.3 Selection of Input and Output Bypass Capacitors
        4. 9.2.2.4 Selection of the PGATE External MOSFET
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

  • This device is a protection device, and is meant to protect down-stream circuitry from hazardous voltages. Potentially, high voltages may be applied to this device. It must be ensured that the edge-to-edge clearances of PCB traces satisfy the design rules for the high voltages. See Figure 24.
  • The device uses WSON packages with a thermal pad. For good thermal performance, the thermal pad must be thermally coupled with the PCB ground plane (GND). This requires a copper pad directly under the device. This copper pad must be connected to the ground plane with an array of thermal vias.
  • CIN and COUT should be located close to the device. Other components like RILIM (optional) and RBAT must also be located close to the device.

11.2 Layout Example

bq24308 lus977_layout.gifFigure 24. Layout Example Recommendation