SLUSAV3A August   2012  – July 2015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Overvoltage Protection
      2. 7.3.2 Input Overcurrent Protection
      3. 7.3.3 Battery Overvoltage Protection
      4. 7.3.4 Thermal Protection
      5. 7.3.5 Enable Function
      6. 7.3.6 Fault Indication
    4. 7.4 Device Functional Modes
      1. 7.4.1 OPERATION Mode
      2. 7.4.2 POWER-DOWN Mode
      3. 7.4.3 POWER-ON RESET Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Powering Accessories
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Selection of RBAT
        2. 8.2.2.2 Selection of RCE, RFAULT, and RPU
        3. 8.2.2.3 Selection of Input and Output Bypass Capacitors
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

  • This device is a protection device, and is meant to protect down-stream circuitry from hazardous voltages. Potentially, high voltages may be applied to this IC. It has to be ensured that the edge-to-edge clearances of PCB traces satisfy the design rules for high voltages. See Figure 23.
  • The device uses WSON packages with a thermal pad. For good thermal performance, the thermal pad must be thermally coupled with the PCB ground plane (GND). This requires a copper pad directly under the device. This copper pad should be connected to the ground plane with an array of thermal vias.
  • Ensure that external CIN and COUT are located close to the device. Other external components like RILIM and RBAT must also be located close to the device.

10.2 Layout Example

bq24314C layout_slus912.gifFigure 23. Layout Example Recommendation