SLUSC03C August   2014  – December 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Battery Only
      2. 8.3.2  Adapter Detect and ACOK Output
        1. 8.3.2.1 Adapter Overvoltage (ACOVP)
      3. 8.3.3  System Power Selection
      4. 8.3.4  System Power Up
        1. 8.3.4.1 Dynamic Power Management (IDPM) and Supplement Mode
        2. 8.3.4.2 Minimum System Voltage Regulation and LDO Mode
      5. 8.3.5  Current and Power Monitor
        1. 8.3.5.1 High Accuracy Current Sense Amplifier (IADP and IBAT)
        2. 8.3.5.2 High Accuracey Power Sense Amplifier (PMON)
      6. 8.3.6  Processor Hot Indication for CPU Throttling
      7. 8.3.7  Converter Operation
        1. 8.3.7.1 Continuous Conduction Mode (CCM)
        2. 8.3.7.2 Discontinuous Conduction Mode (DCM)
        3. 8.3.7.3 PFM Mode
        4. 8.3.7.4 Switching Frequency Adjust
      8. 8.3.8  Learn Mode
      9. 8.3.9  Charger Timeout
      10. 8.3.10 Device Protection Features
        1. 8.3.10.1 Input Overcurrent Protection (ACOC)
        2. 8.3.10.2 Converter Overcurrent Protection
        3. 8.3.10.3 Battery Overvoltage Protection (BATOVP)
        4. 8.3.10.4 System Overvoltage Protection (SYSOVP)
        5. 8.3.10.5 Thermal Shutdown Protection (TSHUT)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Battery Charging
      2. 8.4.2 System Voltage Regulation with Narrow VDC Architecture
    5. 8.5 Programming
      1. 8.5.1 SMBus Interface
        1. 8.5.1.1 SMBus Write-Word and Read-Word Protocols
        2. 8.5.1.2 Timing Diagrams
      2. 8.5.2 I2C Serial Interface
        1. 8.5.2.1 Data Validity
        2. 8.5.2.2 START and STOP Conditions
        3. 8.5.2.3 Byte Format
        4. 8.5.2.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 8.5.2.5 Slave Address and Data Direction Bit
        6. 8.5.2.6 Single Read and Write
        7. 8.5.2.7 Multi-Read and Multi-Write
    6. 8.6 Register Maps
      1. 8.6.1 ChargeOption0 Register
      2. 8.6.2 ChargeOption1 Register
      3. 8.6.3 ChargeOption2 Register
      4. 8.6.4 ProchotOption0 Register
      5. 8.6.5 ProchotOption1 Register
      6. 8.6.6 Setting the Charge Current
      7. 8.6.7 Setting the Maximum Charge Voltage
      8. 8.6.8 Setting the Minimum Charge Voltage
      9. 8.6.9 Setting Input Current
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application, bq24770
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Reverse Input Voltage Protection
        2. 9.2.2.2 Inductor Selection
        3. 9.2.2.3 Input Capacitor
        4. 9.2.2.4 Output Capacitor
        5. 9.2.2.5 Power MOSFETs Selection
        6. 9.2.2.6 Input Filter Design
      3. 9.2.3 Application Curves
      4. 9.2.4 Typical Application, bq24773
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Layout Consideration of Current Path
      2. 11.2.2 Layout Consideration of Short Circuit Protection
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 15. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
bq24770 Click here Click here Click here Click here Click here
bq24773 Click here Click here Click here Click here Click here

12.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.