SLUSC27C April   2015  – March 2017

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Power Up
        1. 7.3.1.1 Battery Only
        2. 7.3.1.2 Adapter Detect and ACOK Output
          1. 7.3.1.2.1 Adapter Overvoltage (ACOVP)
      2. 7.3.2 System Power Selection
      3. 7.3.3 Enable and Disable Charging
        1. 7.3.3.1 Automatic Internal Soft-Start Charger Current
      4. 7.3.4 Current and Power Monitor
        1. 7.3.4.1 High Accuracy Current Sense Amplifier (IADP and IDCHG)
        2. 7.3.4.2 High Accuracy Power Sense Amplifier (PMON)
      5. 7.3.5 Processor Hot Indication for CPU Throttling
      6. 7.3.6 Converter Operation
        1. 7.3.6.1 Continuous Conduction Mode (CCM)
        2. 7.3.6.2 Discontinuous Conduction Mode (DCM)
        3. 7.3.6.3 Non-Sync Mode and Light Load Comparator
        4. 7.3.6.4 EMI Switching Frequency Adjust
      7. 7.3.7 Battery LEARN Cycle
      8. 7.3.8 Charger Timeout
      9. 7.3.9 Device Protections Features
        1. 7.3.9.1 Input Overcurrent Protection (ACOC)
        2. 7.3.9.2 Charge Overcurrent Protection (CHGOCP)
        3. 7.3.9.3 Battery Overvoltage Protection (BATOVP)
        4. 7.3.9.4 Battery Short
        5. 7.3.9.5 Thermal Shutdown Protection (TSHUT)
        6. 7.3.9.6 Inductor Short, MOSFET Short Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Battery Charging
      2. 7.4.2 Hybrid Power Boost Mode
        1. 7.4.2.1 Battery Discharge Current Regulation in Hybrid Power Boost Mode
    5. 7.5 Programming
      1. 7.5.1 SMBus Interface
        1. 7.5.1.1 SMBus Write-Word and Read-Word Protocols
        2. 7.5.1.2 Timing Diagrams
    6. 7.6 Register Maps
      1. 7.6.1  Battery-Charger Commands
      2. 7.6.2  Setting Charger Options
        1. 7.6.2.1 ChargeOption0 Register
      3. 7.6.3  ChargeOption1 Register
      4. 7.6.4  ChargeOption2 Register
      5. 7.6.5  ChargeOption3 Register
      6. 7.6.6  ProchotOption0 Register
      7. 7.6.7  ProchotOption1 Register
      8. 7.6.8  ProchotStatus Register
      9. 7.6.9  Setting the Charge Current
      10. 7.6.10 Setting the Charge Voltage
      11. 7.6.11 Setting Input Current
      12. 7.6.12 Setting the Discharge Current
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Negative Output Voltage Protection
        2. 8.2.2.2 Reverse Input Voltage Protection
        3. 8.2.2.3 Reduce Battery Quiescent Current
        4. 8.2.2.4 Inductor Selection
        5. 8.2.2.5 Input Capacitor
        6. 8.2.2.6 Output Capacitor
        7. 8.2.2.7 Power MOSFETs Selection
        8. 8.2.2.8 Input Filter Design
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
      1. 10.2.1 Layout Consideration of Current Path
      2. 10.2.2 Layout Consideration of Short Circuit Protection
      3. 10.2.3 Layout Consideration for Short Circuit Protection
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

Intel is a registered trademark of Intel Corporation.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.