SLUSBV8C August   2014  – November 2014

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Overvoltage-Protection (OVP) - Continuously Monitored
      2. 8.3.2  CHG Pin Indication (bq25101, bq25101H)
      3. 8.3.3  CHG Pin LED Pull-up Source (bq25101, bq25101H)
      4. 8.3.4  IN-DPM (VIN-DPM or IN-DPM)
      5. 8.3.5  OUT
      6. 8.3.6  ISET
      7. 8.3.7  PRE_TERM - Pre-Charge and Termination Programmable Threshold
      8. 8.3.8  TS
      9. 8.3.9  Timers
      10. 8.3.10 Termination
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down or Undervoltage Lockout (UVLO)
      2. 8.4.2 Power-up
      3. 8.4.3 Sleep Mode
      4. 8.4.4 New Charge Cycle
      5. 8.4.5 Termination and Timer Disable Mode (TTDM) - TS Pin High
      6. 8.4.6 Battery Detect Routine
      7. 8.4.7 Refresh Threshold
      8. 8.4.8 Starting a Charge on a Full Battery
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application - Charger Application Design Example
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Calculations
          1. 9.2.2.1.1 Program the Fast Charge Current, ISET:
          2. 9.2.2.1.2 Program the Termination Current Threshold, ITERM:
          3. 9.2.2.1.3 TS Function
          4. 9.2.2.1.4 Selecting IN and OUT Pin Capacitors
      3. 9.2.3 bq25100 Application Performance Plots
  10. 10Power Supply Recommendations
    1. 10.1 Leakage Current Effects on Battery Capacity
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Package
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Related Links
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 1. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
bq25100 Click here Click here Click here Click here Click here
bq25101 Click here Click here Click here Click here Click here
bq25100A Click here Click here Click here Click here Click here
bq25100H Click here Click here Click here Click here Click here
bq25101H Click here Click here Click here Click here Click here
bq25100L Click here Click here Click here Click here Click here

12.3 Trademarks

Bluetooth is a registered trademark of Bluetooth SIG, Inc..

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.